型号 | M-8870-02 | M-8870-01C | M-8870-02SM |
---|---|---|---|
描述 | DTMF Signaling Circuit, CMOS, PDIP18, | DTMF Signaling Circuit, CMOS, PDIP18, | DTMF Signaling Circuit, CMOS, PDSO18, |
是否Rohs认证 | 不符合 | 不符合 | 不符合 |
厂商名称 | Industrial Defender Inc | Industrial Defender Inc | Industrial Defender Inc |
包装说明 | DIP, DIP18,.3 | DIP, DIP18,.3 | SOP, SOP18,.4 |
Reach Compliance Code | unknown | unknown | unknown |
JESD-30 代码 | R-PDIP-T18 | R-PDIP-T18 | R-PDSO-G18 |
JESD-609代码 | e0 | e0 | e0 |
功能数量 | 1 | 1 | 1 |
端子数量 | 18 | 18 | 18 |
最高工作温度 | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | SOP |
封装等效代码 | DIP18,.3 | DIP18,.3 | SOP18,.4 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE |
电源 | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified |
最大压摆率 | 7 mA | 7 mA | 7 mA |
标称供电电压 | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | YES |
技术 | CMOS | CMOS | CMOS |
电信集成电路类型 | DTMF SIGNALING CIRCUIT | DTMF SIGNALING CIRCUIT | DTMF SIGNALING CIRCUIT |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
端子节距 | 2.54 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL |