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M5M256DP-55XL-I

Standard SRAM, 32KX8, 55ns, CMOS, PDIP28, 0.600 INCH, DIP-28

器件类别:存储    存储   

厂商名称:Mitsubishi(日本三菱)

厂商官网:http://www.mitsubishielectric.com/semiconductors/

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器件参数
参数名称
属性值
厂商名称
Mitsubishi(日本三菱)
零件包装代码
DIP
包装说明
DIP,
针数
28
Reach Compliance Code
unknow
ECCN代码
EAR99
最长访问时间
55 ns
JESD-30 代码
R-PDIP-T28
长度
36.7 mm
内存密度
262144 bi
内存集成电路类型
STANDARD SRAM
内存宽度
8
功能数量
1
端子数量
28
字数
32768 words
字数代码
32000
工作模式
ASYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-40 °C
组织
32KX8
封装主体材料
PLASTIC/EPOXY
封装代码
DIP
封装形状
RECTANGULAR
封装形式
IN-LINE
并行/串行
PARALLEL
认证状态
Not Qualified
座面最大高度
5.5 mm
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
4.5 V
标称供电电压 (Vsup)
5 V
表面贴装
NO
技术
CMOS
温度等级
INDUSTRIAL
端子形式
THROUGH-HOLE
端子节距
2.54 mm
端子位置
DUAL
宽度
15.24 mm
文档预览
'97.4.7
MITSUBISHI LSIs
M5M5256DP,KP,FP,VP,RV -45LL-I,-55LL-I,-70LL-I,
-45XL-I,-55XL-I,-70XL-I
262144-BIT (32768-WORD BY 8-BIT) CMOS STATIC RAM
DESCRIPTION
The M5M5256DP,KP,FP,VP,RV is 262,144-bit CMOS static RAMs
organized as 32,768-words by 8-bits which is fabricated using
high-performance 3 polysilicon CMOS technology. The use of
resistive load NMOS cells and CMOS periphery results in a high
density and low power static RAM. Stand-by current is small
enough for battery back-up application. It is ideal for the memory
systems which require simple interface.
Especially the M5M5256DVP,RV are packaged in a 28-pin thin
small outline package.Two types of devices are available,
M5M5256DVP(normal lead bend type package),
M5M5256DRV(reverse lead bend type package). Using both types of
devices, it becomes very easy to design a printed circuit board.
PIN CONFIGURATION (TOP VIEW)
A14
A12
1
2
A7
3
A6
4
A5
5
A4
6
7
A3
A2
8
A1
9
A0
10
DQ1 11
DQ2 12
DQ3 13
GND 14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
Vcc
/W
A13
A8
A9
A11
/OE
A10
/S
DQ8
DQ7
DQ6
DQ5
DQ4
M5M5256DP,KP,FP
-I
FEATURE
Type
Access Power supply current
time
Active Stand-by
(max)
(max)
(max)
45ns
55ns
70ns
45ns
55ns
70ns
55mA
(Vcc=5.5V)
M5M5256DP, KP, FP,VP,RV-45LL
M5M5256DP, KP, FP,VP,RV-55LL
M5M5256DP, KP, FP,VP,RV-70LL
M5M5256DP, KP, FP,VP,RV-45XL
M5M5256DP, KP, FP,VP,RV-55XL
M5M5256DP, KP, FP,VP,RV-70XL
Outline 28P4 (DP)
28P4Y (DKP)
28P2W-C (DFP)
22 /OE
23 A11
24 A9
25 A8
26 A13
27 /W
28Vcc
1 A14
2 A12
3 A7
4 A6
5 A5
6 A4
7 A3
A10 21
/S 20
DQ8 19
DQ7 18
DQ6 17
DQ5 16
DQ415
GND 14
DQ3 13
DQ2 12
DQ1 11
A0 10
A1 9
A2 8
40µA
(Vcc=5.5V)
10µA
(Vcc=5.5V)
0.05µA
(Vcc=3.0V,
Typical)
M5M5256DVP
-I
•Single +5V power supply
•No clocks, no refresh
•Data-Hold on +2.0V power supply
•Directly TTL compatible : all inputs and outputs
•Three-state outputs : OR-tie capability
•/OE prevents data contention in the I/O bus
•Common Data I/O
•Battery backup capability
•Low stand-by current··········0.05µA(typ.)
Outline 28P2C-A (DVP)
7 A3
6 A4
5 A5
4 A6
3 A7
2 A12
1 A14
28 Vcc
27 /W
26 A13
25 A8
24 A9
23 A11
22 /OE
A2 8
A1 9
A0 10
DQ1 11
DQ2 12
DQ3 13
GND 14
DQ4 15
DQ5 16
DQ6 17
DQ7 18
DQ8 19
/S 20
A10 21
PACKAGE
M5M256DP
: 28 pin
M5M5256DKP
: 28 pin
M5M5256DFP
: 28 pin
M5M5256DVP,RV : 28pin
600 mil DIP
300 mil DIP
450 mil SOP
2
8 X 13.4 mm
M5M5256DRV
-I
TSOP
APPLICATION
Small capacity memory units
Outline 28P2C-B (DRV)
MITSUBISHI
ELECTRIC
1
'97.4.7
MITSUBISHI LSIs
M5M5256DP,KP,FP,VP,RV -45LL-I,-55LL-I,-70LL-I,
-45XL-I,-55XL-I,-70XL-I
262144-BIT (32768-WORD BY 8-BIT) CMOS STATIC RAM
FUNCTION
The operation mode of the M5M5256DP,KP,FP,VP,RV is
determined by a combination of the device control inputs /S,
/W and /OE. Each mode is summarized in the function table.
A write cycle is executed whenever the low level /W
overlaps with the low level /S. The address must be set up
before the write cycle and must be stable during the entire
cycle. The data is latched into a cell on the trailing edge of
/W, /S, whichever occurs first, requiring the set-up and hold
time relative to these edge to be maintained. The output
enable /OE directly controls the output stage. Setting the
/OE at a high level,the output stage is in a high-impedance
state, and the data bus contention problem in the write cycle
is eliminated.
A read cycle is executed by setting /W at a high level and
/OE at a low level while /S are in an active state.
When setting /S at a high level, the chip is in a
non-selectable mode in which both reading and writing are
disabled. In this mode, the output stage is in a
high-impedance state, allowing OR-tie with other chips and
memory expansion by /S. The power supply current is
reduced as low as the stand-by current which is specified
as Icc3 or Icc4, and the memory data can be held at +2V
power supply, enabling battery back-up operation during
power failure or power-down operation in the non-selected
mode.
FUNCTION TABLE
/S
H
L
L
L
/W
X
L
H
H
/OE
X
X
L
H
Mode
Non selection
Write
Read
DQ
High-impedance
D
IN
D
OUT
High-impedance
Icc
Stand-by
Active
Active
Active
BLOCK DIAGRAM
A8
A 13
A 14
A 12
A7
A6
A5
A4
ADDRESS
INPUT
A3
25
26
ADDRESS INPUT
BUFFER
ROW DECODER
1
2
2
3
4
5
6
7
32768 WORD
SENSE ANPLIFIER
OUTPUT BUFFER
X 8BIT
11
12
13
15
16
17
18
19
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DATA I/O
(512 ROWS X
512 COLUMNS)
A2
A1
A0
A 10
A 11
A9
WRITE CONTROL
INPUT /W
CHIP SELECT
INPUT
/S
8
DATA INPUT
BUFFER
COLUMN
DECODER
9
10
21
23
24
ADDRESS INPUT
BUFFER
CLOCK
GENERATOR
27
20
28
14
VCC
(5V)
GND
(0V)
OUTPUT ENABLE
/OE
INPUT
22
MITSUBISHI
ELECTRIC
2
'97.4.7
MITSUBISHI LSIs
M5M5256DP,KP,FP,VP,RV -45LL-I,-55LL-I,-70LL-I,
-45XL-I,-55XL-I,-70XL-I
262144-BIT (32768-WORD BY 8-BIT) CMOS STATIC RAM
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Supply voltage
Vcc
V
I
V
O
P
d
T
opr
T
stg
Input voltage
Output voltage
Power dissipation
Operating temperature
Storage temperature
Conditions
With respect to GND
Ta=25°C
Ratings
-0.3
*
~7.0
-0.3
*
~Vcc+0.3
(Max 7.0)
Unit
V
V
V
mW
°C
°C
0~Vcc
700
-40~85
-65~150
* -3.0V in case of AC ( Pulse width
30ns )
DC ELECTRICAL CHARACTERISTICS
Symbol
V
IH
V
IL
V
OH1
V
OH2
V
OL
I
I
I
O
Parameter
High-level input voltage
Low-level input voltage
High-level output voltage 1
High-level output voltage 2
Low-level output voltage
Input current
Output current in off-state
Active supply current
(AC, MOS level )
(Ta=-40~85°C, Vcc=5V±10%, unless otherwise noted)
Test conditions
Limits
Min
2.2
-0.3
Typ
Max
Vcc
+0.3
Unit
V
V
V
V
0.8
I
OH
=-1mA
I
OH
=-0.1mA
I
OL
=2mA
V
I
=0
~
Vcc
/S=V
IH
or or /OE=V
IH
,
V
I/O
=0
~
Vcc
45ns
/S≤0.2V,
Other inputs<0.2V or >Vcc-0.2V 55ns
Output-open Min. cycle
70ns
/S=V
IL
,
other inputs=V
IH
or V
IL
Output-open Min. cycle
/S≥Vcc-0.2V,
other inputs=0~Vcc
/S=V
IH
,other inputs=0
~
Vcc
45ns
55ns
70ns
-LL
-XL
2.4
Vcc
-0.5
0.4
±1
±1
35
30
25
35
30
25
50
45
40
55
50
45
40
0.1
10
3
V
uA
uA
Icc
1
mA
Icc
2
Active supply current
(AC, TTL level )
mA
Icc
3
Icc
4
Stand-by current
Stand-by current
uA
mA
* -3.0V in case of AC ( Pulse width
30ns )
CAPACITANCE
Symbol
C
I
C
O
(Ta=-40~85°C, Vcc=5V±10%, unless otherwise noted)
Parameter
Input capacitance
Output capacitance
Test conditions
V
I
=GND, V
I
=25mVrms, f=1MHz
V
O
=GND,V
O
=25mVrms, f=1MHz
Min
Limits
Typ Max
6
8
Unit
pF
pF
Note 0: Direction for current flowing into an IC is positive (no mark).
1: Typical value is one at Ta = 25°C.
2: C
I
, C
O
are periodically sampled and are not 100% tested.
MITSUBISHI
ELECTRIC
3
'97.4.7
MITSUBISHI LSIs
M5M5256DP,KP,FP,VP,RV -45LL-I,-55LL-I,-70LL-I,
-45XL-I,-55XL-I,-70XL-I
262144-BIT (32768-WORD BY 8-BIT) CMOS STATIC RAM
AC ELECTRICAL CHARACTERISTICS
(1) MEASUREMENT CONDITIONS
(Ta = -40~85°C, Vcc=5V±10%, unless otherwise noted )
Vcc
1.8kΩ
DQ
990Ω
(Including
scope and JIG)
Input pulse level···················V
IH
=2.4V,V
IL
=0.6V
Input rise and fall time··········5ns
Reference level····················V
OH
=V
OL
=1.5V
Output loads·························Fig.1,CL=30pF (-45LL,-45XL )
CL=50pF (-55LL,-55XL )
CL=100pF (-70LL,-70XL )
CL=5pF (for ten,tdis)
Transition is measured ±500mV from steady
state voltage. (for ten,tdis)
C
L
Fig.1 Output load
(2) READ CYCLE
Symbol
t
CR
t
a
(A)
t
a
(S)
t
a
(OE)
t
dis
(S)
t
dis
(OE)
t
en
(S)
t
en
(OE)
t
V
(A)
Parameter
Read cycle time
Address access time
Chip select access time
Output enable access time
Output disable time after /S high
Output disable time after /OE high
Output enable time after /S low
Output enable time after /OE low
Data valid time after address
-45LL, XL
Min Max
45
45
45
25
15
15
5
5
10
Limits
-55LL, XL
Min Max
55
55
55
30
20
20
5
5
10
-70LL, XL
Min Max
70
70
70
35
25
25
5
5
10
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
(3) WRITE CYCLE
-45LL, XL
Symbol
Parameter
Min Max
t
CW
45
Write cycle time
t
w
(W)
Write pulse width
35
t
su
(A)
Address setup time
0
t
su
(A-WH)
Address setup time with respect to /W high 40
t
su
(S)
Chip select setup time
40
t
su
(D)
Data setup time
20
t
h
(D)
Data hold time
0
t
rec
(W)
Write recovery time
0
t
dis
(W)
Output disable time from /W low
15
t
dis
(OE)
Output disable time from /OE high
15
t
en
(W)
Output enable time from /W high
5
t
en
(OE)
Output enable time from /OE low
5
Limits
-55LL, XL
Min Max
55
40
0
50
50
25
0
0
20
20
5
5
-70LL, XL
Min Max
70
50
0
65
65
30
0
0
25
25
5
5
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
MITSUBISHI
ELECTRIC
4
'97.4.7
MITSUBISHI LSIs
M5M5256DP,KP,FP,VP,RV -45LL-I,-55LL-I,-70LL-I,
-45XL-I,-55XL-I,-70XL-I
262144-BIT (32768-WORD BY 8-BIT) CMOS STATIC RAM
(4) TIMING DIAGRAMS
Read cycle
A
0~14
t
a
(A)
t
a
(S)
/S
(Note 3)
t
CR
t
v
(A)
t
a
(OE)
t
en
(OE)
t
dis
(S)
(Note 3)
/OE
(Note 3)
t
dis
(OE)
t
en
(S)
(Note 3)
DQ
1~8
/W = "H" level
DATA VALID
Write cycle (/W control mode)
A
0~14
t
CW
t
su
(S)
/S
(Note 3)
(Note 3)
t
su
(A-WH)
/OE
t
su
(A)
/W
t
dis
(W)
t
dis
(OE)
DQ
1~8
(Note 3)
t
w
(W)
t
rec
(W)
t
en
(W)
t
en
(OE)
DATA IN
STABLE
(Note 3)
t
su
(D)
t
h
(D)
MITSUBISHI
ELECTRIC
5
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参数对比
与M5M256DP-55XL-I相近的元器件有:M5M256DP-70LL-I、M5M256DP-55LL-I、M5M256DP-70XL-I、M5M256DP-45XL-I、M5M256DP-45LL-I。描述及对比如下:
型号 M5M256DP-55XL-I M5M256DP-70LL-I M5M256DP-55LL-I M5M256DP-70XL-I M5M256DP-45XL-I M5M256DP-45LL-I
描述 Standard SRAM, 32KX8, 55ns, CMOS, PDIP28, 0.600 INCH, DIP-28 Standard SRAM, 32KX8, 70ns, CMOS, PDIP28, 0.600 INCH, DIP-28 Standard SRAM, 32KX8, 55ns, CMOS, PDIP28, 0.600 INCH, DIP-28 Standard SRAM, 32KX8, 70ns, CMOS, PDIP28, 0.600 INCH, DIP-28 Standard SRAM, 32KX8, 45ns, CMOS, PDIP28, 0.600 INCH, DIP-28 Standard SRAM, 32KX8, 45ns, CMOS, PDIP28, 0.600 INCH, DIP-28
厂商名称 Mitsubishi(日本三菱) Mitsubishi(日本三菱) Mitsubishi(日本三菱) Mitsubishi(日本三菱) Mitsubishi(日本三菱) Mitsubishi(日本三菱)
零件包装代码 DIP DIP DIP DIP DIP DIP
包装说明 DIP, DIP, DIP, DIP, DIP, DIP,
针数 28 28 28 28 28 28
Reach Compliance Code unknow unknown unknown unknown unknown unknow
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 55 ns 70 ns 55 ns 70 ns 45 ns 45 ns
JESD-30 代码 R-PDIP-T28 R-PDIP-T28 R-PDIP-T28 R-PDIP-T28 R-PDIP-T28 R-PDIP-T28
长度 36.7 mm 36.7 mm 36.7 mm 36.7 mm 36.7 mm 36.7 mm
内存密度 262144 bi 262144 bit 262144 bit 262144 bit 262144 bit 262144 bi
内存集成电路类型 STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
内存宽度 8 8 8 8 8 8
功能数量 1 1 1 1 1 1
端子数量 28 28 28 28 28 28
字数 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words
字数代码 32000 32000 32000 32000 32000 32000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
组织 32KX8 32KX8 32KX8 32KX8 32KX8 32KX8
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 DIP DIP DIP DIP DIP DIP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 5.5 mm 5.5 mm 5.5 mm 5.5 mm 5.5 mm 5.5 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO NO NO NO NO NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
端子节距 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL
宽度 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm
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器件捷径:
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