型号
- 型号
- 关键词
| 型号 | M74HC07M1R | M74HC07C1R | M74HC07 | M74HC07B1R | M54HC07F1R | M54HC07 |
|---|---|---|---|---|---|---|
| 描述 | HEX BUFFER OPEN DRAIN | HEX BUFFER OPEN DRAIN | HEX BUFFER OPEN DRAIN | HEX BUFFER OPEN DRAIN | HEX BUFFER OPEN DRAIN | HEX BUFFER OPEN DRAIN |
| 是否Rohs认证 | 符合 | 符合 | - | 符合 | 不符合 | - |
| 厂商名称 | ST(意法半导体) | ST(意法半导体) | - | ST(意法半导体) | ST(意法半导体) | - |
| 零件包装代码 | SOIC | QFN | - | DIP | DIP | - |
| 包装说明 | SO-14 | PLASTIC, CC-20 | - | PLASTIC, DIP-14 | CERAMIC, DIP-14 | - |
| 针数 | 14 | 20 | - | 14 | 14 | - |
| Reach Compliance Code | compli | compli | - | compli | _compli | - |
| 系列 | HC/UH | HC/UH | - | HC/UH | HC/UH | - |
| JESD-30 代码 | R-PDSO-G14 | S-PQCC-J20 | - | R-PDIP-T14 | R-GDIP-T14 | - |
| JESD-609代码 | e4 | e3 | - | e3 | e0 | - |
| 负载电容（CL） | 50 pF | 50 pF | - | 50 pF | 50 pF | - |
| 逻辑集成电路类型 | BUFFER | BUFFER | - | BUFFER | BUFFER | - |
| 最大I（ol） | 0.004 A | 0.004 A | - | 0.004 A | 0.004 A | - |
| 功能数量 | 6 | 6 | - | 6 | 6 | - |
| 输入次数 | 1 | 1 | - | 1 | 1 | - |
| 端子数量 | 14 | 20 | - | 14 | 14 | - |
| 最高工作温度 | 125 °C | 85 °C | - | 125 °C | 125 °C | - |
| 最低工作温度 | -55 °C | -40 °C | - | -55 °C | -55 °C | - |
| 输出特性 | OPEN-DRAIN | OPEN-DRAIN | - | OPEN-DRAIN | OPEN-DRAIN | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | - |
| 封装代码 | SOP | QCCJ | - | DIP | DIP | - |
| 封装等效代码 | SOP14,.25 | LDCC20,.4SQ | - | DIP14,.3 | DIP14,.3 | - |
| 封装形状 | RECTANGULAR | SQUARE | - | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | SMALL OUTLINE | CHIP CARRIER | - | IN-LINE | IN-LINE | - |
| 峰值回流温度（摄氏度） | 260 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - |
| 电源 | 2/6 V | 2/6 V | - | 2/6 V | 2/6 V | - |
| 传播延迟（tpd） | 135 ns | 23 ns | - | 135 ns | 27 ns | - |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | - |
| 施密特触发器 | NO | NO | - | NO | NO | - |
| 座面最大高度 | 1.75 mm | 4.57 mm | - | 5.1 mm | 5.08 mm | - |
| 最大供电电压 (Vsup) | 6 V | 6 V | - | 6 V | 6 V | - |
| 最小供电电压 (Vsup) | 2 V | 2 V | - | 2 V | 2 V | - |
| 标称供电电压 (Vsup) | 4.5 V | 5 V | - | 4.5 V | 5 V | - |
| 表面贴装 | YES | YES | - | NO | NO | - |
| 技术 | CMOS | CMOS | - | CMOS | CMOS | - |
| 温度等级 | MILITARY | INDUSTRIAL | - | MILITARY | MILITARY | - |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) | - | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | - |
| 端子形式 | GULL WING | J BEND | - | THROUGH-HOLE | THROUGH-HOLE | - |
| 端子节距 | 1.27 mm | 1.27 mm | - | 2.54 mm | 2.54 mm | - |
| 端子位置 | DUAL | QUAD | - | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | 30 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - |
| 宽度 | 3.9 mm | 8.9662 mm | - | 7.62 mm | 7.62 mm | - |
