型号
- 型号
- 关键词
| 型号 | M74HC375B1R | M74HC375M1R | M74HC375C1R | M74HC375 | M54HC375F1R | M54HC375 |
|---|---|---|---|---|---|---|
| 描述 | QUAD D TYPE LATCH | QUAD D TYPE LATCH | QUAD D TYPE LATCH | QUAD D TYPE LATCH | QUAD D TYPE LATCH | QUAD D TYPE LATCH |
| 是否Rohs认证 | 符合 | 符合 | 符合 | - | 不符合 | - |
| 零件包装代码 | DIP | SOIC | QLCC | - | DIP | - |
| 包装说明 | DIP, DIP16,.3 | SOP, SOP16,.25 | QCCJ, LDCC20,.4SQ | - | CERAMIC, DIP-16 | - |
| 针数 | 16 | 16 | 20 | - | 16 | - |
| Reach Compliance Code | compli | compli | compli | - | _compli | - |
| 系列 | HC/UH | HC/UH | HC/UH | - | HC/UH | - |
| JESD-30 代码 | R-PDIP-T16 | R-PDSO-G16 | S-PQCC-J20 | - | R-GDIP-T16 | - |
| JESD-609代码 | e3 | e4 | e3 | - | e0 | - |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | - | 50 pF | - |
| 逻辑集成电路类型 | D LATCH | D LATCH | D LATCH | - | D LATCH | - |
| 最大I（ol） | 0.004 A | 0.004 A | 0.004 A | - | 0.004 A | - |
| 位数 | 2 | 2 | 2 | - | 2 | - |
| 功能数量 | 2 | 2 | 2 | - | 2 | - |
| 端子数量 | 16 | 16 | 20 | - | 16 | - |
| 最高工作温度 | 125 °C | 85 °C | 85 °C | - | 125 °C | - |
| 最低工作温度 | -55 °C | -40 °C | -40 °C | - | -55 °C | - |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | - | COMPLEMENTARY | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | CERAMIC, GLASS-SEALED | - |
| 封装代码 | DIP | SOP | QCCJ | - | DIP | - |
| 封装等效代码 | DIP16,.3 | SOP16,.25 | LDCC20,.4SQ | - | DIP16,.3 | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | - | RECTANGULAR | - |
| 封装形式 | IN-LINE | SMALL OUTLINE | CHIP CARRIER | - | IN-LINE | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - |
| 电源 | 2/6 V | 2/6 V | 2/6 V | - | 2/6 V | - |
| Prop。Delay @ Nom-Su | 29 ns | 29 ns | 29 ns | - | 35 ns | - |
| 传播延迟（tpd） | 160 ns | 26 ns | 26 ns | - | 32 ns | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | - |
| 座面最大高度 | 5.1 mm | 1.75 mm | 4.57 mm | - | 5.08 mm | - |
| 最大供电电压 (Vsup) | 6 V | 6 V | 6 V | - | 6 V | - |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | - | 2 V | - |
| 标称供电电压 (Vsup) | 4.5 V | 5 V | 5 V | - | 5 V | - |
| 表面贴装 | NO | YES | YES | - | NO | - |
| 技术 | CMOS | CMOS | CMOS | - | CMOS | - |
| 温度等级 | MILITARY | INDUSTRIAL | INDUSTRIAL | - | MILITARY | - |
| 端子面层 | Matte Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) | - | Tin/Lead (Sn/Pb) | - |
| 端子形式 | THROUGH-HOLE | GULL WING | J BEND | - | THROUGH-HOLE | - |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | - | 2.54 mm | - |
| 端子位置 | DUAL | DUAL | QUAD | - | DUAL | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - |
| 触发器类型 | HIGH LEVEL | HIGH LEVEL | HIGH LEVEL | - | HIGH LEVEL | - |
| 宽度 | 7.62 mm | 3.9 mm | 8.9662 mm | - | 7.62 mm | - |
