Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPT004N03L
MA001049824
PG-HSOF-8-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
5.854
0.421
0.126
420.040
15.327
4.772
52.491
260.867
6.479
0.526
0.001
0.128
0.102
4.885
Average
Mass
[%]
0.76
0.05
0.02
54.40
1.99
0.62
6.80
33.79
0.84
0.07
0.00
0.02
0.01
0.63
29. August 2013
772.02 mg
Sum
[%]
0.76
Average
Mass
[ppm]
7583
545
163
54.47
1.99
544079
19853
6181
67993
41.21
0.84
337902
8392
681
0.07
2
166
133
0.66
6327
6626
1000000
683
412076
8392
544787
19853
Sum
[ppm]
7583
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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