The MARR-5 reed switch is a miniature, normally open switch with a 19.69mm
long x 2.66mm diameter (0.775” x 0.105”) glass envelope, capable of high voltage
switching of up to 1kVdc at 1mA. It has high insulation resistance of 10¹² ohms
minimum and contact resistance less than 100 milli-ohms.
Features
• Miniature normally open switch
• Capable of switching 1000Vdc at
1mA or 0.5A up to 10W
• Minimum voltage breakdown
2000 Vdc
• Available sensitivity range 17-38 AT
Benefits
Agency Approvals
Agency
Agency File Number
E47258
E471070
DEMKO 14 ATEX 1393U
Ampere-Turns Range
17-38 AT
17-38 AT
• Hermetically sealed switch
contacts are not affected by and
have no effect on their external
environment
• Zero operating power required
for contact closure
Applications
• Reed relays (particularly suitable
for high voltage breakdown
applications)
• Security
• Limit switching
• Telecoms line switching
• Office equipment
Dimensions
Dimensions in mm (inch)
CL OF OVERLAP
(1.117) REF.
28.37
(.105) MAX.
2.66
(.022) DIA. REF.
0.55
Switch Type
Contact Form
Materials
A (SPST-NO)
Body: Glass
Leads: Tin-plated Ni-Fe wire
(.685) MIN.
17.39
(.775) MAX.
19.69
(2.235) NOM.
56.77
Note: SPST-NO = Single-pole, single-throw, normally open
Electrical Ratings
Contact Rating
Voltage
Current
3
1
W/VA - max.
Switching
2
Breakdown
4
Switching
Carry
2
10
1000
2000
0.50
1.30
0.100
10
12
0.2
-75 to +125
-75 to +125
Vdc - max.
Vdc - min.
Adc - max.
Adc - max.
Ω - max.
Ω - min.
pF - typ.
°C
°C
3
Resistance
Capacitance
Temperature
Contact, Initial
Insulation
Contact
Operating
Storage
5
Notes:
1. Contact rating - Product of the switching voltage and current should never exceed the wattage rating. Contact Littelfuse for additional load/life information.
2. When switching inductive and/or capacitive loads, the effects of transient voltages and/or currents should be considered. Refer to Application Notes AN108A and
AN107 for details.
3. Electrical Load Life Expectancy - Contact Littelfuse with voltage, current values along with type of load.
4. Breakdown Voltage - per MIL-STD-202, Method 301.
5. Storage Temperature - Long time exposure at elevated temperature may degrade solderability of the leads.
