型号
- 型号
- 关键词
5V/3.3V/3V or Adjustable, High-Efficiency,
厂商名称：Maxim(美信半导体)
厂商官网：https://www.maximintegrated.com/en.html
下载文档| 型号 | MAX649C/D | MAX649-MAX652 | MAX652ESA | MAX652C/D | MAX652 | MAX651C/D | MAX649 |
|---|---|---|---|---|---|---|---|
| 描述 | 5V/3.3V/3V or Adjustable, High-Efficiency, | 5V/3.3V/3V or Adjustable, High-Efficiency, | 5V/3.3V/3V or Adjustable, High-Efficiency, | 5V/3.3V/3V or Adjustable, High-Efficiency, | 5V/3.3V/3V or Adjustable, High-Efficiency, | 5V/3.3V/3V or Adjustable, High-Efficiency, | 5V/3.3V/3V or Adjustable, High-Efficiency, |
| 是否无铅 | 含铅 | - | 含铅 | 含铅 | - | 含铅 | - |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | - | 不符合 | - |
| 厂商名称 | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | - | Maxim(美信半导体) | - |
| 零件包装代码 | DIE | - | SOIC | DIE | - | DIE | - |
| 包装说明 | DIE-9 | - | 0.150 INCH, SOIC-8 | DIE-9 | - | DIE-9 | - |
| 针数 | 9 | - | 8 | 9 | - | 9 | - |
| Reach Compliance Code | _compli | - | _compli | _compli | - | _compli | - |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | - | EAR99 | - |
| 模拟集成电路 - 其他类型 | SWITCHING CONTROLLER | - | SWITCHING CONTROLLER | SWITCHING CONTROLLER | - | SWITCHING CONTROLLER | - |
| 控制模式 | CURRENT-MODE | - | CURRENT-MODE | CURRENT-MODE | - | CURRENT-MODE | - |
| 控制技术 | PULSE FREQUENCY MODULATION | - | PULSE FREQUENCY MODULATION | PULSE FREQUENCY MODULATION | - | PULSE FREQUENCY MODULATION | - |
| 最大输入电压 | 16.5 V | - | 16.5 V | 16.5 V | - | 16.5 V | - |
| 最小输入电压 | 6 V | - | 4 V | 4 V | - | 4 V | - |
| JESD-30 代码 | R-XUUC-N9 | - | R-PDSO-G8 | R-XUUC-N9 | - | R-XUUC-N9 | - |
| JESD-609代码 | e0 | - | e0 | e0 | - | e0 | - |
| 湿度敏感等级 | 1 | - | 1 | 1 | - | 1 | - |
| 功能数量 | 1 | - | 1 | 1 | - | 1 | - |
| 端子数量 | 9 | - | 8 | 9 | - | 9 | - |
| 最高工作温度 | 70 °C | - | 85 °C | 70 °C | - | 70 °C | - |
| 最大输出电流 | 1.5 A | - | 1.5 A | 1.5 A | - | 1.5 A | - |
| 标称输出电压 | 5 V | - | 3 V | 3 V | - | 3.3 V | - |
| 封装主体材料 | UNSPECIFIED | - | PLASTIC/EPOXY | UNSPECIFIED | - | UNSPECIFIED | - |
| 封装代码 | DIE | - | SOP | DIE | - | DIE | - |
| 封装等效代码 | DIE OR CHIP | - | SOP8(UNSPEC) | DIE OR CHIP | - | DIE OR CHIP | - |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | - |
| 封装形式 | UNCASED CHIP | - | SMALL OUTLINE | UNCASED CHIP | - | UNCASED CHIP | - |
| 峰值回流温度（摄氏度） | 240 | - | 245 | 240 | - | 240 | - |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified | - |
| 最大供电电流 (Isup) | 0.1 mA | - | 0.1 mA | 0.1 mA | - | 0.1 mA | - |
| 表面贴装 | YES | - | YES | YES | - | YES | - |
| 切换器配置 | BUCK | - | BUCK | BUCK | - | BUCK | - |
| 最大切换频率 | 300 kHz | - | 300 kHz | 300 kHz | - | 300 kHz | - |
| 技术 | BICMOS | - | BICMOS | BICMOS | - | BICMOS | - |
| 温度等级 | COMMERCIAL | - | INDUSTRIAL | COMMERCIAL | - | COMMERCIAL | - |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | TIN LEAD | - | Tin/Lead (Sn/Pb) | - |
| 端子形式 | NO LEAD | - | GULL WING | NO LEAD | - | NO LEAD | - |
| 端子位置 | UPPER | - | DUAL | UPPER | - | UPPER | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - |