型号
- 型号
- 关键词
EPROM, 32KX8, 200ns, MOS, CDIP28
厂商名称：FUJITSU(富士通)
厂商官网：http://edevice.fujitsu.com/fmd/en/index.html
下载文档| 型号 | MBM27256-20Z-X | MBM27256-20CV | MBM27256-30CV | MBM27256-25CV | MBM27256-25Z-X | MBM27256-17CV |
|---|---|---|---|---|---|---|
| 描述 | EPROM, 32KX8, 200ns, MOS, CDIP28 | EPROM, 32KX8, 200ns, MOS, CQCC32 | EPROM, 32KX8, 300ns, MOS, CQCC32 | EPROM, 32KX8, 250ns, MOS, CQCC32 | EPROM, 32KX8, 250ns, MOS, CDIP28 | EPROM, 32KX8, 170ns, MOS, CQCC32 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DIP, DIP28,.6 | QCCN, LCC32,.45X.55 | QCCN, LCC32,.45X.55 | QCCN, LCC32,.45X.55 | DIP, DIP28,.6 | QCCN, LCC32,.45X.55 |
| Reach Compliance Code | compli | unknown | unknown | unknown | compliant | unknown |
| 最长访问时间 | 200 ns | 200 ns | 300 ns | 250 ns | 250 ns | 170 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-XDIP-T28 | R-XQCC-N32 | R-XQCC-N32 | R-XQCC-N32 | R-XDIP-T28 | R-XQCC-N32 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 262144 bi | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| 端子数量 | 28 | 32 | 32 | 32 | 28 | 32 |
| 字数 | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| 字数代码 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| 最高工作温度 | 85 °C | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C |
| 组织 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DIP | QCCN | QCCN | QCCN | DIP | QCCN |
| 封装等效代码 | DIP28,.6 | LCC32,.45X.55 | LCC32,.45X.55 | LCC32,.45X.55 | DIP28,.6 | LCC32,.45X.55 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 编程电压 | 12.5 V | 12.5 V | 12.5 V | 12.5 V | 12.5 V | 12.5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大压摆率 | 0.12 mA | 0.1 mA | 0.1 mA | 0.1 mA | 0.12 mA | 0.1 mA |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | NO | YES |
| 技术 | MOS | MOS | MOS | MOS | MOS | MOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE | NO LEAD |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | QUAD | QUAD | QUAD | DUAL | QUAD |
| 厂商名称 | FUJITSU(富士通) | - | - | FUJITSU(富士通) | FUJITSU(富士通) | FUJITSU(富士通) |