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MBT3946DW1T2

Bipolar Transistors - BJT 200mA 40V Dual

器件类别:分立半导体    晶体管   

厂商名称:ON Semiconductor(安森美)

厂商官网:http://www.onsemi.cn

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
ON Semiconductor(安森美)
零件包装代码
SC-88
包装说明
SMALL OUTLINE, R-PDSO-G6
针数
6
制造商包装代码
CASE 419B-02
Reach Compliance Code
not_compliant
ECCN代码
EAR99
Is Samacsys
N
最大集电极电流 (IC)
0.2 A
集电极-发射极最大电压
40 V
配置
SEPARATE, 2 ELEMENTS
最小直流电流增益 (hFE)
30
JESD-30 代码
R-PDSO-G6
JESD-609代码
e0
湿度敏感等级
1
元件数量
2
端子数量
6
最高工作温度
150 °C
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
峰值回流温度(摄氏度)
240
极性/信道类型
NPN AND PNP
最大功率耗散 (Abs)
0.15 W
认证状态
Not Qualified
表面贴装
YES
端子面层
Tin/Lead (Sn/Pb)
端子形式
GULL WING
端子位置
DUAL
处于峰值回流温度下的最长时间
30
晶体管应用
AMPLIFIER
晶体管元件材料
SILICON
标称过渡频率 (fT)
300 MHz
最大关闭时间(toff)
250 ns
最大开启时间(吨)
70 ns
Base Number Matches
1
文档预览
MBT3946DW1T1G,
SMBT3946DW1T1G
Complementary General
Purpose Transistor
The MBT3946DW1T1G device is a spin-off of our popular
SOT−23/SOT−323 three-leaded device. It is designed for general
purpose amplifier applications and is housed in the SOT−363−6
surface mount package. By putting two discrete devices in one
package, this device is ideal for low-power surface mount applications
where board space is at a premium.
Features
http://onsemi.com
h
FE
, 100−300
Low V
CE(sat)
,
0.4 V
Simplifies Circuit Design
Reduces Board Space
Reduces Component Count
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS
Compliant
Table 1. MAXIMUM RATINGS
Rating
Collector
−Emitter
Voltage
(NPN)
(PNP)
Collector
Base Voltage
(NPN)
(PNP)
Emitter
−Base
Voltage
(NPN)
(PNP)
Collector Current
Continuous
(NPN)
(PNP)
Electrostatic Discharge
Symbol
V
CEO
Value
40
−40
60
−40
6.0
−5.0
200
−200
Unit
Vdc
SOT−363/SC−88
CASE 419B
STYLE 1
(3)
(2)
(1)
Q
1
Q
2
(4)
(5)
MBT3946DW1T1*
*Q1 PNP
Q2 NPN
(6)
MARKING DIAGRAM
V
CBO
Vdc
46 M
G
G
V
EBO
Vdc
I
C
mAdc
ESD
HBM Class 2
MM Class B
46 = Specific Device Code
M = Date Code
G
= Pb-Free Package
(Note: Microdot may be in either location)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
ORDERING INFORMATION
Device
MBT3946DW1T1G
Package
SC−88
(Pb-Free)
SC−88
(Pb-Free)
SC−88
(Pb-Free)
Shipping
3,000 /
Tape & Reel
3,000 /
Tape & Reel
3,000 /
Tape & Reel
Table 2. THERMAL CHARACTERISTICS
Characteristic
Total Package Dissipation (Note 1)
T
A
= 25°C
Thermal Resistance,
Junction-to-Ambient
Junction and Storage Temperature Range
Symbol
P
D
R
qJA
T
J
, T
stg
Max
150
833
−55
to +150
Unit
mW
°C/W
°C
SMBT3946DW1T1G
MBT3946DW1T2G
1. Device mounted on FR4 glass epoxy printed circuit board using the minimum
recommended footprint.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2012
July, 2012
Rev. 7
1
Publication Order Number:
MBT3946DW1T1/D
MBT3946DW1T1G, SMBT3946DW1T1G
Table 3. ELECTRICAL CHARACTERISTICS
(T
A
= 25°C unless otherwise noted)
Characteristic
OFF CHARACTERISTICS
Collector
−Emitter
Breakdown Voltage (Note 2)
(I
C
= 1.0 mAdc, I
B
= 0)
(I
C
=
−1.0
mAdc, I
B
= 0)
Collector
−Base
Breakdown Voltage
(I
C
= 10
mAdc,
I
E
= 0)
(I
C
=
−10
mAdc,
I
E
= 0)
Emitter
−Base
Breakdown Voltage
(I
E
= 10
mAdc,
I
C
= 0)
(I
E
=
−10
mAdc,
I
C
= 0)
Base Cutoff Current
(V
CE
= 30 Vdc, V
EB
= 3.0 Vdc)
(V
CE
=
−30
Vdc, V
EB
=
−3.0
Vdc)
Collector Cutoff Current
(V
CE
= 30 Vdc, V
EB
= 3.0 Vdc)
(V
CE
=
−30
Vdc, V
EB
=
−3.0
Vdc)
ON CHARACTERISTICS
(Note 2)
DC Current Gain
(I
C
= 0.1 mAdc, V
CE
= 1.0 Vdc)
(I
C
= 1.0 mAdc, V
CE
= 1.0 Vdc)
(I
C
= 10 mAdc, V
CE
= 1.0 Vdc)
(I
C
= 50 mAdc, V
CE
= 1.0 Vdc)
(I
C
= 100 mAdc, V
CE
= 1.0 Vdc)
(I
C
=
−0.1
mAdc, V
CE
=
−1.0
Vdc)
(I
C
=
−1.0
mAdc, V
CE
=
−1.0
Vdc)
(I
C
=
−10
mAdc, V
CE
=
−1.0
Vdc)
(I
C
=
−50
mAdc, V
CE
=
−1.0
Vdc)
(I
C
=
−100
mAdc, V
CE
=
−1.0
Vdc)
Collector
−Emitter
Saturation Voltage
(I
C
= 10 mAdc, I
B
= 1.0 mAdc)
(I
C
= 50 mAdc, I
B
= 5.0 mAdc)
(I
C
=
−10
mAdc, I
B
=
−1.0
mAdc)
(I
C
=
−50
mAdc, I
B
=
−5.0
mAdc)
Base
−Emitter
Saturation Voltage
(I
C
= 10 mAdc, I
B
= 1.0 mAdc)
(I
C
= 50 mAdc, I
B
= 5.0 mAdc)
(I
C
=
−10
mAdc, I
B
=
−1.0
mAdc)
(I
C
=
−50
mAdc, I
B
=
−5.0
mAdc)
SMALL- SIGNAL CHARACTERISTICS
Current
−Gain −
Bandwidth Product
(I
C
= 10 mAdc, V
CE
= 20 Vdc, f = 100 MHz)
(I
C
=
−10
mAdc, V
CE
=
−20
Vdc, f = 100 MHz)
Output Capacitance
(V
CB
= 5.0 Vdc, I
E
= 0, f = 1.0 MHz)
(V
CB
=
−5.0
Vdc, I
E
= 0, f = 1.0 MHz)
Input Capacitance
(V
EB
= 0.5 Vdc, I
C
= 0, f = 1.0 MHz)
(V
EB
=
−0.5
Vdc, I
C
= 0, f = 1.0 MHz)
Input Impedance
(V
CE
= 10 Vdc, I
C
= 1.0 mAdc, f = 1.0 kHz)
(V
CE
=
−10
Vdc, I
C
=
−1.0
mAdc, f = 1.0 kHz)
Voltage Feedback Ratio
(V
CE
= 10 Vdc, I
C
= 1.0 mAdc, f = 1.0 kHz)
(V
CE
=
−10
Vdc, I
C
=
−1.0
mAdc, f = 1.0 kHz)
Small
−Signal
Current Gain
(V
CE
= 10 Vdc, I
C
= 1.0 mAdc, f = 1.0 kHz)
(V
CE
=
−10
Vdc, I
C
=
−1.0
mAdc, f = 1.0 kHz)
(NPN)
(PNP)
(NPN)
(PNP)
(NPN)
(PNP)
(NPN)
(PNP)
(NPN)
(PNP)
(NPN)
(PNP)
f
T
300
250
1.0
2.0
0.5
0.1
100
100
4.0
4.5
8.0
10.0
10
12
8.0
10
400
400
MHz
(NPN)
h
FE
40
70
100
60
30
60
80
100
60
30
V
CE(sat)
V
BE(sat)
0.65
−0.65
300
300
0.2
0.3
−0.25
−0.4
0.85
0.95
−0.85
−0.95
Vdc
Vdc
(NPN)
(PNP)
(NPN)
(PNP)
(NPN)
(PNP)
(NPN)
(PNP)
(NPN)
(PNP)
V
(BR)CEO
40
−40
60
−40
6.0
−5.0
50
−50
50
−50
Vdc
Symbol
Min
Max
Unit
V
(BR)CBO
Vdc
V
(BR)EBO
Vdc
I
BL
nAdc
I
CEX
nAdc
(PNP)
(NPN)
(PNP)
(NPN)
(PNP)
C
obo
pF
C
ibo
pF
h
ie
kW
h
re
X 10
4
h
fe
http://onsemi.com
2
MBT3946DW1T1G, SMBT3946DW1T1G
Table 4. ELECTRICAL CHARACTERISTICS
(T
A
= 25°C unless otherwise noted) (continued)
Characteristic
Output Admittance
(V
CE
= 10 Vdc, I
C
= 1.0 mAdc, f = 1.0 kHz)
(V
CE
=
−10
Vdc, I
C
=
−1.0
mAdc, f = 1.0 kHz)
Noise Figure
(V
CE
= 5.0 Vdc, I
C
= 100
mAdc,
R
S
= 1.0 kW, f = 1.0 kHz)
(V
CE
=
−5.0
Vdc, I
C
=
−100
mAdc,
R
S
= 1.0 kW, f = 1.0 kHz)
SWITCHING CHARACTERISTICS
Delay Time
Rise Time
Storage Time
Fall Time
(V
CC
= 3.0 Vdc, V
BE
=
0.5 Vdc)
(V
CC
=
−3.0
Vdc, V
BE
= 0.5 Vdc)
(I
C
= 10 mAdc, I
B1
= 1.0 mAdc)
(I
C
=
−10
mAdc, I
B1
=
−1.0
mAdc)
(V
CC
= 3.0 Vdc, I
C
= 10 mAdc)
(V
CC
=
−3.0
Vdc, I
C
=
−10
mAdc)
(I
B1
= I
B2
= 1.0 mAdc)
(I
B1
= I
B2
=
−1.0
mAdc)
(NPN)
(PNP)
(NPN)
(PNP)
(NPN)
(PNP)
(NPN)
(PNP)
t
d
t
r
t
s
t
f
35
35
35
35
200
225
50
75
(NPN)
(PNP)
(NPN)
(PNP)
Symbol
h
oe
Min
1.0
3.0
Max
40
60
5.0
4.0
Unit
mmhos
NF
dB
ns
ns
2. Pulse Test: Pulse Width
300
ms;
Duty Cycle
2.0%.
(NPN)
DUTY CYCLE = 2%
300 ns
+3 V
+10.9 V
10 k
0
- 0.5 V
< 1 ns
C
s
< 4 pF*
- 9.1 V′
* Total shunt capacitance of test jig and connectors
< 1 ns
1N916
C
s
< 4 pF*
275
10 < t
1
< 500
ms
DUTY CYCLE = 2%
t
1
+3 V
+10.9 V
275
10 k
Figure 1. Delay and Rise Time
Equivalent Test Circuit
Figure 2. Storage and Fall Time
Equivalent Test Circuit
TYPICAL TRANSIENT CHARACTERISTICS
T
J
= 25°C
T
J
= 125°C
10
7.0
CAPACITANCE (pF)
5.0
C
ibo
3.0
2.0
C
obo
(NPN)
5000
3000
2000
Q, CHARGE (pC)
1000
700
500
300
200
100
70
50
Q
T
Q
A
V
CC
= 40 V
I
C
/I
B
= 10
(NPN)
1.0
0.1
0.2 0.3
0.5 0.7 1.0
2.0 3.0
5.0 7.0 10
20 30 40
1.0
2.0 3.0
5.0 7.0 10
20
30
50 70 100
200
REVERSE BIAS VOLTAGE (VOLTS)
I
C
, COLLECTOR CURRENT (mA)
Figure 3. Capacitance
http://onsemi.com
3
Figure 4. Charge Data
MBT3946DW1T1G, SMBT3946DW1T1G
(NPN)
500
300
200
100
70
50
30
20
10
7
5
(NPN)
t
d
@ V
OB
= 0 V
1.0
2.0 3.0
5.0 7.0 10
20
30
40 V
15 V
10
2.0 V
50 70 100
200
7
5
(NPN)
1.0
2.0 3.0
5.0 7.0 10
20
30
50 70 100
200
I
C
/I
B
= 10
500
300
200
t r, RISE TIME (ns)
100
70
50
30
20
V
CC
= 40 V
I
C
/I
B
= 10
TIME (ns)
t
r
@ V
CC
= 3.0 V
I
C
, COLLECTOR CURRENT (mA)
I
C
, COLLECTOR CURRENT (mA)
Figure 5. Turn-On Time
500
300
200
t s, STORAGE TIME (ns)
100
70
50
30
20
10
7
5
(NPN)
1.0
2.0 3.0
5.0 7.0 10
20
30
50 70 100
200
I
C
/I
B
= 20
I
C
/I
B
= 10
I
C
/I
B
= 20
I
C
/I
B
= 10
t′
s
= t
s
-
1
/
8
t
f
I
B1
= I
B2
t f , FALL TIME (ns)
500
300
200
Figure 6. Rise Time
V
CC
= 40 V
I
B1
= I
B2
I
C
/I
B
= 20
100
70
50
30
20
10
7
5
(NPN)
1.0
2.0 3.0
5.0 7.0 10
20
30
50 70 100
200
I
C
/I
B
= 10
I
C
, COLLECTOR CURRENT (mA)
I
C
, COLLECTOR CURRENT (mA)
Figure 7. Storage Time
Figure 8. Fall Time
TYPICAL AUDIO SMALL-SIGNAL CHARACTERISTICS
NOISE FIGURE VARIATIONS
(V
CE
= 5.0 Vdc, T
A
= 25°C, Bandwidth = 1.0 Hz)
12
10
NF, NOISE FIGURE (dB)
8
6
4
2
0
0.1
SOURCE RESISTANCE = 500
W
I
C
= 100
mA
0.2
0.4
1.0
2.0
4.0
SOURCE RESISTANCE = 200
W
I
C
= 1.0 mA
NF, NOISE FIGURE (dB)
SOURCE RESISTANCE = 200
W
I
C
= 0.5 mA
SOURCE RESISTANCE = 1.0 k
I
C
= 50
mA
14
f = 1.0 kHz
12
10
8
6
4
2
20
40
100
0
0.1
0.2
0.4
1.0
2.0
4.0
(NPN)
10
20
40
100
I
C
= 100
mA
I
C
= 1.0 mA
I
C
= 0.5 mA
I
C
= 50
mA
(NPN)
10
f, FREQUENCY (kHz)
R
S
, SOURCE RESISTANCE (k OHMS)
Figure 9. Noise Figure
http://onsemi.com
4
Figure 10. Noise Figure
MBT3946DW1T1G, SMBT3946DW1T1G
(NPN)
h PARAMETERS
(V
CE
= 10 Vdc, f = 1.0 kHz, T
A
= 25°C)
300
(NPN)
h fe , CURRENT GAIN
200
hoe, OUTPUT ADMITTANCE (
m
mhos)
100
50
(NPN)
20
10
5
100
70
50
2
1
30
0.1
0.2
0.3
0.5
1.0
2.0 3.0
I
C
, COLLECTOR CURRENT (mA)
5.0
10
0.1
0.2
0.3
0.5
1.0
2.0 3.0
I
C
, COLLECTOR CURRENT (mA)
5.0
10
Figure 11. Current Gain
20
h ie , INPUT IMPEDANCE (k OHMS)
10
5.0
(NPN)
h
re
, VOLTAGE FEEDBACK RATIO (x 10
-4
)
10
7.0
5.0
3.0
2.0
Figure 12. Output Admittance
(NPN)
2.0
1.0
0.5
1.0
0.7
0.5
0.1
0.2
0.3
0.5
1.0
2.0 3.0
I
C
, COLLECTOR CURRENT (mA)
5.0
10
0.2
0.1
0.2
0.3
0.5
1.0
2.0 3.0
I
C
, COLLECTOR CURRENT (mA)
5.0
10
Figure 13. Input Impedance
Figure 14. Voltage Feedback Ratio
1000
I
C
, COLLECTOR CURRENT (mA)
1
ms
100 ms
10 ms 1 ms
100
1s
10
(NPN)
1
1
Single Pulse Test at T
A
= 25°C
10
V
CE
, COLLECTOR EMITTER VOLTAGE (V)
100
Figure 15. Safe Operating Area
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参数对比
与MBT3946DW1T2相近的元器件有:MBT3946DW1T1。描述及对比如下:
型号 MBT3946DW1T2 MBT3946DW1T1
描述 Bipolar Transistors - BJT 200mA 40V Dual Bipolar Transistors - BJT 200mA 40V Dual
零件包装代码 SC-88 SC-88
包装说明 SMALL OUTLINE, R-PDSO-G6 SMALL OUTLINE, R-PDSO-G6
针数 6 6
制造商包装代码 CASE 419B-02 419B-02
Reach Compliance Code not_compliant not_compliant
ECCN代码 EAR99 EAR99
最大集电极电流 (IC) 0.2 A 0.2 A
集电极-发射极最大电压 40 V 40 V
配置 SEPARATE, 2 ELEMENTS SEPARATE, 2 ELEMENTS
最小直流电流增益 (hFE) 30 30
JESD-30 代码 R-PDSO-G6 R-PDSO-G6
JESD-609代码 e0 e0
湿度敏感等级 1 1
元件数量 2 2
端子数量 6 6
最高工作温度 150 °C 150 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装形状 RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE
峰值回流温度(摄氏度) 240 240
极性/信道类型 NPN AND PNP NPN AND PNP
认证状态 Not Qualified Not Qualified
表面贴装 YES YES
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 GULL WING GULL WING
端子位置 DUAL DUAL
处于峰值回流温度下的最长时间 30 30
晶体管应用 AMPLIFIER AMPLIFIER
晶体管元件材料 SILICON SILICON
标称过渡频率 (fT) 300 MHz 300 MHz
最大关闭时间(toff) 250 ns 250 ns
最大开启时间(吨) 70 ns 70 ns
Base Number Matches 1 1
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