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MC100EP08DT

100E SERIES, 2-INPUT XOR/XNOR GATE, PDSO8, PLASTIC, TSSOP-8

器件类别:逻辑    逻辑   

厂商名称:Rochester Electronics

厂商官网:https://www.rocelec.com/

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
厂商名称
Rochester Electronics
零件包装代码
SOIC
包装说明
PLASTIC, TSSOP-8
针数
8
Reach Compliance Code
unknown
其他特性
NECL MODE: 0V VCC WITH VEE = -3.0V TO -5.5V
系列
100E
JESD-30 代码
S-PDSO-G8
JESD-609代码
e0
长度
3 mm
逻辑集成电路类型
XOR/XNOR GATE
湿度敏感等级
NOT SPECIFIED
功能数量
1
输入次数
2
端子数量
8
最高工作温度
85 °C
最低工作温度
-40 °C
封装主体材料
PLASTIC/EPOXY
封装代码
TSSOP
封装形状
SQUARE
封装形式
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度)
240
传播延迟(tpd)
0.3 ns
认证状态
COMMERCIAL
座面最大高度
1.1 mm
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
3 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
ECL
温度等级
INDUSTRIAL
端子面层
TIN LEAD
端子形式
GULL WING
端子节距
0.65 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
30
宽度
3 mm
文档预览
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MC10EP08, MC100EP08
3.3V / 5V ECL 2-Input
Differential XOR/XNOR
Description
The MC10/100EP08 is a differential XOR/XNOR gate. The EP08 is
ideal for applications requiring the fastest AC performance available.
The 100 Series contains temperature compensation.
Features
http://onsemi.com
MARKING DIAGRAMS*
8
1
SOIC−8
D SUFFIX
CASE 751
1
8
HEP08
ALYWG
G
8
KEP08
ALYWG
G
250 ps Typical Propagation Delay
Maximum Frequency > 3 GHz Typical
PECL Mode Operating Range: V
CC
= 3.0 V to 5.5 V
with V
EE
= 0 V
NECL Mode Operating Range: V
CC
= 0 V
with V
EE
=
−3.0
V to
−5.5
V
Open Input Default State
Safety Clamp on Inputs
Q Output Will Default LOW with Inputs Open or at V
EE
Pb−Free Packages are Available
1
8
1
TSSOP−8
DT SUFFIX
CASE 948R
8
HP08
ALYWG
G
1
8
KP082
ALYWG
G
1
DFN8
MN SUFFIX
CASE 506AA
H
K
5J
2Y
D
= MC10
= MC100
= MC10
= MC100
= Date Code
1 5J DG
G
4
1 2Y DG
G
4
A
L
Y
W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
©
Semiconductor Components Industries, LLC, 2008
August, 2008
Rev. 5
1
Publication Order Number:
MC10EP08/D
MC10EP08, MC100EP08
Table 1. PIN DESCRIPTION
D0
1
8
V
CC
PIN
D0, D1, D0, D1
Q, Q
V
CC
D0
2
7
Q
V
EE
EP
FUNCTION
ECL Data Inputs
ECL Data Outputs
Positive Supply
Negative Supply
(DFN8 only) Thermal exposed pad
must be connected to a sufficient
thermal conduit. Electrically connect
to the most negative supply (GND) or
leave unconnected, floating open.
D1
3
6
Q
Table 2. TRUTH TABLE
D0*
D1
4
5
V
EE
L
L
H
H
D1*
L
H
L
H
D0**
H
H
L
L
D1**
H
L
H
L
Q
L
H
H
L
Q
H
L
L
H
Figure 1. 8−Lead Pinout
(Top View)
and Logic Diagram
Table 3. ATTRIBUTES
Characteristics
Internal Input Pulldown Resistor
Internal Input Pullup Resistor
ESD Protection
* Pins will default LOW when left open.
** Pins will default to 0.666% of V
CC
when left open.
Value
75 kW
37.5 kW
Human Body Model
Machine Model
Charged Device Model
Pb Pkg
Level 1
Level 1
Level 1
> 4 kV
> 200 V
> 2 kV
Pb−Free Pkg
Level 1
Level 3
Level 1
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
SOIC−8
TSSOP−8
DFN8
Flammability Rating
Transistor Count
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
135 Devices
http://onsemi.com
2
MC10EP08, MC100EP08
Table 4. MAXIMUM RATINGS
Symbol
V
CC
V
EE
V
I
I
out
T
A
T
stg
q
JA
q
JC
q
JA
q
JC
q
JA
T
sol
q
JC
Parameter
PECL Mode Power Supply
NECL Mode Power Supply
PECL Mode Input Voltage
NECL Mode Input Voltage
Output Current
Operating Temperature Range
Storage Temperature Range
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Wave Solder
Pb
Pb−Free
0 lfpm
500 lfpm
Standard Board
0 lfpm
500 lfpm
Standard Board
0 lfpm
500 lfpm
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
(Note 2)
DFN8
SOIC−8
SOIC−8
SOIC−8
TSSOP−8
TSSOP−8
TSSOP−8
DFN8
DFN8
Condition 1
V
EE
= 0 V
V
CC
= 0 V
V
EE
= 0 V
V
CC
= 0 V
Continuous
Surge
V
I
v
V
CC
V
I
w
V
EE
Condition 2
Rating
6
−6
6
−6
50
100
−40
to +85
−65
to +150
190
130
41 to 44
185
140
41 to 44
129
84
265
265
35 to 40
Unit
V
V
V
V
mA
mA
°C
°C
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C
°C/W
Thermal Resistance (Junction−to−Case)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
2. JEDEC standard multilayer board
2S2P (2 signal, 2 power)
Table 5. 10EP DC CHARACTERISTICS, PECL
V
CC
= 3.3 V, V
EE
= 0 V (Note 3)
−40°C
Symbol
I
EE
V
OH
V
OL
V
IH
V
IL
V
IHCMR
I
IH
I
IL
Characteristic
Power Supply Current
Output HIGH Voltage (Note 4)
Output LOW Voltage (Note 4)
Input HIGH Voltage (Single−Ended)
Input LOW Voltage (Single−Ended)
Input HIGH Voltage Common Mode
Range (Differential Configuration) (Note 5)
Input HIGH Current
Input LOW Current
D
D
0.5
−150
Min
20
2165
1365
2090
1365
2.0
Typ
28
2290
1490
Max
36
2415
1615
2415
1690
3.3
150
0.5
−150
Min
20
2230
1430
2155
1430
2.0
25°C
Typ
30
2355
1555
Max
38
2480
1680
2480
1755
3.3
150
0.5
−150
Min
20
2290
1490
2215
1490
2.0
85°C
Typ
32
2415
1615
Max
38
2540
1740
2540
1815
3.3
150
Unit
mA
mV
mV
mV
mV
V
mA
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
3. Input and output parameters vary 1:1 with V
CC
. V
EE
can vary +0.3 V to
−2.2
V.
4. All loading with 50
W
to V
CC
2.0 V.
5. V
IHCMR
min varies 1:1 with V
EE
, V
IHCMR
max varies 1:1 with V
CC
. The V
IHCMR
range is referenced to the most positive side of the differential
input signal.
http://onsemi.com
3
MC10EP08, MC100EP08
Table 6. 10EP DC CHARACTERISTICS, PECL
V
CC
= 5.0 V, V
EE
= 0 V (Note 6)
−40°C
Symbol
I
EE
V
OH
V
OL
V
IH
V
IL
V
IHCMR
I
IH
I
IL
Characteristic
Power Supply Current
Output HIGH Voltage (Note 7)
Output LOW Voltage (Note 7)
Input HIGH Voltage (Single−Ended)
Input LOW Voltage (Single−Ended)
Input HIGH Voltage Common Mode Range
(Differential Configuration) (Note 8)
Input HIGH Current
Input LOW Current
D
D
0.5
−150
Min
20
3865
3065
3790
3065
2.0
Typ
28
3940
3190
Max
36
4115
3315
4115
3390
5.0
150
0.5
−150
Min
20
3930
3130
3855
3130
2.0
25°C
Typ
30
4055
3255
Max
38
4180
3380
4180
3455
5.0
150
0.5
−150
Min
20
3990
3190
3915
3190
2.0
85°C
Typ
32
4115
3315
Max
38
4240
3440
4240
3515
5.0
150
Unit
mA
mV
mV
mV
mV
V
mA
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
6. Input and output parameters vary 1:1 with V
CC
. V
EE
can vary +2.0 V to
−0.5
V.
7. All loading with 50
W
to V
CC
2.0 V.
8. V
IHCMR
min varies 1:1 with V
EE
, V
IHCMR
max varies 1:1 with V
CC
. The V
IHCMR
range is referenced to the most positive side of the differential
input signal.
Table 7. 10EP DC CHARACTERISTICS, NECL
V
CC
= 0 V; V
EE
=
−5.5
V to
−3.0
V (Note 9)
−40°C
Symbol
I
EE
VOH
V
OL
V
IH
V
IL
V
IHCMR
Characteristic
Power Supply Current
Output HIGH Voltage (Note 10)
Output LOW Voltage (Note 10)
Input HIGH Voltage (Single−Ended)
Input LOW Voltage (Single−Ended)
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 11)
Input HIGH Current
Input LOW Current
D
D
0.5
−150
Min
20
−1135
−1935
−1210
−1935
V
EE
+ 2.0
Typ
28
−1010
−1810
Max
36
−885
−1685
−885
−1610
0.0
Min
20
−1070
−1870
−1145
−1870
V
EE
+ 2.0
25°C
Typ
30
−945
−1745
Max
38
−820
−1620
−820
−1545
0.0
Min
20
−1010
−1810
−1085
−1810
V
EE
+ 2.0
85°C
Typ
32
−885
−1685
Max
38
−760
−1560
−760
−1485
0.0
Unit
mA
mV
mV
mV
mV
V
I
IH
I
IL
150
0.5
−150
150
0.5
−150
150
mA
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
9. Input and output parameters vary 1:1 with V
CC
.
10. All loading with 50
W
to V
CC
2.0 V.
11. V
IHCMR
min varies 1:1 with V
EE
, V
IHCMR
max varies 1:1 with V
CC
. The V
IHCMR
range is referenced to the most positive side of the differential
input signal.
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