MCM63F733ATQ8.5,MCM63F733ATQ8.5 pdf中文资料,MCM63F733ATQ8.5引脚图,MCM63F733ATQ8.5电路-Datasheet-电子工程世界

参数对比

与MCM63F733ATQ8.5相近的元器件有：MCM63F733ATQ8.5R、MCM63F733ATQ11、MCM63F733ATQ9、MCM63F733ATQ10、MCM63F733ATQ11R、MCM63F733ATQ9R、MCM63F733ATQ10R。描述及对比如下：

型号	MCM63F733ATQ8.5	MCM63F733ATQ8.5R	MCM63F733ATQ11	MCM63F733ATQ9	MCM63F733ATQ10	MCM63F733ATQ11R	MCM63F733ATQ9R	MCM63F733ATQ10R
描述	IC,SYNC SRAM,128KX32,CMOS,QFP,100PIN,PLASTIC	128KX32 CACHE SRAM, 8.5ns, PQFP100, TQFP-100	128KX32 CACHE SRAM, 11ns, PQFP100, TQFP-100	128KX32 CACHE SRAM, 9ns, PQFP100, TQFP-100	128KX32 CACHE SRAM, 10ns, PQFP100, TQFP-100	IC,SYNC SRAM,128KX32,CMOS,QFP,100PIN,PLASTIC	IC,SYNC SRAM,128KX32,CMOS,QFP,100PIN,PLASTIC	128KX32 CACHE SRAM, 10ns, PQFP100, TQFP-100
厂商名称	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)
零件包装代码	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP
包装说明	LQFP,	LQFP,	LQFP,	LQFP,	LQFP,	LQFP,	LQFP,	LQFP,
针数	100	100	100	100	100	100	100	100
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
最长访问时间	8.5 ns	8.5 ns	11 ns	9 ns	10 ns	11 ns	9 ns	10 ns
其他特性	FLOW-THROUGH ARCHITECTURE	FLOW-THROUGH ARCHITECTURE	FLOW-THROUGH ARCHITECTURE	FLOW-THROUGH ARCHITECTURE	FLOW-THROUGH ARCHITECTURE	FLOW-THROUGH ARCHITECTURE	FLOW-THROUGH ARCHITECTURE	FLOW-THROUGH ARCHITECTURE
JESD-30 代码	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100
长度	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm
内存密度	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit
内存集成电路类型	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM
内存宽度	32	32	32	32	32	32	32	32
功能数量	1	1	1	1	1	1	1	1
端子数量	100	100	100	100	100	100	100	100
字数	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
字数代码	128000	128000	128000	128000	128000	128000	128000	128000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	128KX32	128KX32	128KX32	128KX32	128KX32	128KX32	128KX32	128KX32
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	LQFP	LQFP	LQFP	LQFP	LQFP	LQFP	LQFP	LQFP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm
最大供电电压 (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压 (Vsup)	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V
标称供电电压 (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm
端子位置	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
宽度	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm
ECCN代码	-	3A991	3A991	3A991	3A991	3A991	3A991	3A991

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