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MCZ33395EWR2

Motor / Motion / Ignition Controllers & Drivers 3 PHASE MOTOR DRIVER

器件类别:其他集成电路(IC)    信号电路   

厂商名称:NXP(恩智浦)

厂商官网:https://www.nxp.com

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
NXP(恩智浦)
零件包装代码
SOIC
包装说明
SSOP,
针数
32
Reach Compliance Code
unknown
ECCN代码
EAR99
模拟集成电路 - 其他类型
BRUSHLESS DC MOTOR CONTROLLER
JESD-30 代码
R-PDSO-G32
JESD-609代码
e3
长度
11 mm
湿度敏感等级
3
功能数量
1
端子数量
32
最高工作温度
125 °C
最低工作温度
-40 °C
封装主体材料
PLASTIC/EPOXY
封装代码
SSOP
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, SHRINK PITCH
峰值回流温度(摄氏度)
260
认证状态
Not Qualified
座面最大高度
2.65 mm
最大供电电压 (Vsup)
24 V
最小供电电压 (Vsup)
5.5 V
标称供电电压 (Vsup)
12 V
表面贴装
YES
温度等级
AUTOMOTIVE
端子面层
Matte Tin (Sn)
端子形式
GULL WING
端子节距
0.65 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
40
宽度
7.5 mm
Base Number Matches
1
文档预览
Freescale Semiconductor
Technical Data
Document Number:
MC33395
Rev 4.0, 2/2007
Three-Phase Gate Driver IC
The 33395 simplifies the design of high-power BLDC motor control
design by combining the gate drive, charge pump, current sense, and
protection circuitry necessary to drive a three-phase bridge
configuration of six N-channel power MOSFETs. Mode logic is
incorporated to route a pulse width modulation (PWM) or a
complementary PWM output signal to either low-side or high-side
MOSFETs of the bridge.
Detection and drive circuitry are also incorporated to control a
reverse battery protection high-side MOSFET switch. PWM
frequencies up to 28 kHz are possible. Built-in protection circuitry
prevents damage to the MOSFET bridge as well as the drive IC and
includes overvoltage shutdown, overtemperature shutdown,
overcurrent shutdown, and undervoltage shutdown.
The device is parametrically specified over ambient temperature
range of -40°C
T
A
125°C and 5.5 V
V
IGN
24 V supply.
Features
• Drives Six N-Channel Low R
DS(ON)
Power MOSFETs
• Built-In Charge Pump Circuitry
• Built-In Current Sense Comparator and Output Drive Current
Limiting
• Built-In PWM Mode Control Logic
• Built-In Circuit Protection
• Designed for Fractional to Integral HP BLDC Motors
• 32-Pin SOIC Wide Body Surface Mount Package
• 33395 Incorporates a <5.0
μs
Shoot-Through Suppression Timer
• 33395T Incorporates a <1.0
μs
Shoot-Through Suppression Timer
• Pb-Free Packaging Designated by Suffix Code EW
33395
33395T
THREE-PHASE
GATE DRIVER IC
ARCHIVE INFORMATION
DWB SUFFIX
EW SUFFIX (Pb-FREE)
98ARH99137A
32-PIN SOICW
ORDERING INFORMATION
Device
MC33395DWB/R2
MC33395EW/R2
MCZ33395EW/R2
MC33395TDWB/R2
MC33395TEW/R2
- 40°C to 125°C
32 SOICW
32 SOICW
(Pb-Free)
Temperature
Range (T
A
)
Package
32 SOICW
32 SOICW
(Pb-Free)
V
PWR
33395
V
DD
VGDH
VIGN
VDD
CP1H
CP1L
CP2H
CP2L
CRES
3
2
3
VIGNP
GDH1
GDH2
GDH3
SRC1
SRC2
SRC3
N
S
N
H
S
H
MCU
HSE1–3
MODE0–1 GDL1
GDL2
PWM
GDL3
LSE1–3
-ISENS
AGND
PGND
+ISENS
V
DD
Figure 1. 33395 Simplified Application Diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2007. All rights reserved.
ARCHIVE INFORMATION
H
INTERNAL BLOCK DIAGRAM
INTERNAL BLOCK DIAGRAM
VIGN
VDD
Osc.
Low
Low
Voltage
Reset
Reset
Charge
Charge
Pump
Overvoltage
Overvoltage
Shutdown
CP1H
CP1L
CP2H
CP2L
CPRES
ARCHIVE INFORMATION
+ISENS
-ISENS
+
-
Drive Limiting
Drive Limiting
L
H
VGDH
Control
Control
Logic
Logic
VIGNP
Gate
Drive
Gate
Circuits
Drive
Circuits
GDH1
GDH2
GDH3
SRC1
SRC2
SRC3
GDL1
GDL2
GDL3
MODE0
MODE1
PWM
HSE1
HSE2
HSE3
LSE1
LSE2
LSE3
AGND
TEST
PGND
Overtemperature
Shutdown
Shutdown
Figure 2. 33395 Simplified Internal Block Diagram
33395
2
Analog Integrated Circuit Device Data
Freescale Semiconductor
ARCHIVE INFORMATION
PIN CONNECTIONS
PIN CONNECTIONS
ARCHIVE INFORMATION
16
18
17
Figure 3. 33395 Pin Connections
Table 1. 33395 Pin Definitions
A functional description of each pin can be found in the Functional Pin Description section beginning on
page 9.
Pin Number
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
Pin Name
CP2H
CPRES
VIGN
VGDH
VIGNP
SRC1
GDH1
GDL1
SRC2
GDH2
GDL2
SRC3
GDH3
GDL3
PGND
Test
-ISENS
+ISENS
AGND
VDD
PWM
Input
Input
Output
Input
Sensor
Output
Output
Sensor
Output
Output
Sensor
Output
Output
Ground
N/A
Input
Input
Ground
Power
Input
Pin Function
Formal Name
Charge Pump Cap
Charge Pump
Reserve Cap
Input Voltage
High-Side Gate
Voltage
Input Voltage
Protected
High-Side Sense
Gate Drive High
Output for Gate
High-Side Sense
Gate Drive High
Output for Gate
High-Side Sense
Gate Drive High
Gate Drive Low
Power Ground
Test Pin
IS Minus
IS Plus
Analog Ground
Logic Supply Voltage
Definition
High potential pin connection for secondary charge pump capacitor
Input from external reservoir capacitor for charge pump
Input from ignition level supply voltage for power functions
Output full-time gate drive for auxiliary high-side power MOSFET switch
Input from protected ignition level supply for power functions
Sense for high-side source voltage, phase 1
Output for gate high-side, phase 1
Output for gate drive low-side, phase 1
Sense for high-side source voltage, phase 2
Output for gate high-side, phase 2
Output for gate drive low-side, phase 2
Sense for high-side source voltage, phase 3
Output for gate drive high-side, phase 3
Output for gate drive low-side, phase 3
Ground pins for power functions
This should be connected to ground or left open
Inverting input for current limit comparator
Non-inverting input for current limit comparator
Ground pin for logic functions
Supply voltage for logic functions
Pulse Width Modulator Input for pulse width modulated driver duty cycle
33395
Analog Integrated Circuit Device Data
Freescale Semiconductor
3
ARCHIVE INFORMATION
CP2H
CPRES
VIGN
VGDH
VIGNP
SRC1
GDH1
GDL1
SRC2
GDH2
GDL2
SRC3
GDH3
GDL3
PGND
TEST
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
32
31
30
29
28
27
26
25
24
23
22
21
20
19
CP2L
CP1H
CP1L
LSE1
LSE2
LSE3
HSE1
HSE2
HSE3
MODE0
MODE1
PWM
VDD
AGND
+ISENS
-ISENS
PIN CONNECTIONS
Table 1. 33395 Pin Definitions (continued)
A functional description of each pin can be found in the Functional Pin Description section beginning on
page 9.
Pin Number
22
23
24
25
26
27
28
Pin Name
MODE1
MODE0
HSE3
HSE2
HSE1
LSE3
LSE2
LSE1
CP1L
CP1H
CP2L
Pin Function
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Formal Name
Mode Control Bit 1
Mode Control Bit 0
High-Side Enable
High-Side Enable
High-Side Enable
Low-Side Enable
Low-Side Enable
Low-Side Enable
External Pump
Capacitor
External Pump
Capacitor
Charge Pump
Capacitor
Definition
Input for mode control selection
Input for mode control selection
Input for high-side enable logic, phase 3
Input for high-side enable logic, phase 2
Input for high-side enable logic, phase 1
Input for low-side enable logic, phase 3
Input for low-side enable logic, phase 2
Input for low-side enable logic, phase 1
Input from external pump capacitor for charge pump and secondary pins
Input from external pump capacitor for charge pump and secondary pins
Input from external reservoir, external pump capacitors for charge pump,
and secondary pins
ARCHIVE INFORMATION
29
30
31
32
33395
4
Analog Integrated Circuit Device Data
Freescale Semiconductor
ARCHIVE INFORMATION
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted.
Rating
VIGN Supply Voltage
VIGNP Load Dump Survival
VDD Logic Supply Voltage (Fail Safe)
Symbol
V
IGN
V
IGNP
LD
Value
-15.5 to 40
-0.3 to 65
-0.3 to 7.0
0.3 to 7.0
100
Unit
VDC
VDC
VDC
VDC
mA
V
V
DD
V
IN
I
VIGNSTARTUP
ARCHIVE INFORMATION
Logic Input Voltage (LSEn, HSEn, PWM, and MODEn)
Start Up Current V
IGNP
ESD Voltage
(1)
Human Body Model
Machine Model
Storage Temperature
Operating Ambient Temperature
Operating Case Temperature
Maximum Junction Temperature
Power Dissipation (T
A
= 25°C)
Peak Package Reflow Temperature During Reflow
(2)
,
(3)
Thermal Resistance, Junction-to-Ambient
V
ESD1
V
ESD2
T
STG
T
A
T
C
T
J
P
D
T
PPRT
R
Θ
JA
±500
±200
-65 to 160
-40 to 125
-40 to 125
150
1.5
Note 3
65
°C
°C
°C
°C
W
°C
°C/ W
Notes
1. ESD1 testing is performed in accordance with the Human Body Model (C
ZAP
= 100 pF, R
ZAP
= 1500
Ω),
ESD2 testing is performed in
accordance with the Machine Model (C
ZAP
= 200 pF, R
ZAP
= 0
Ω).
2.
3.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
33395
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
ARCHIVE INFORMATION
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参数对比
与MCZ33395EWR2相近的元器件有:MC33395TDWB、MC33395DWBR2、MC33395TEWR2、MC33395DWB、MC33395TEW。描述及对比如下:
型号 MCZ33395EWR2 MC33395TDWB MC33395DWBR2 MC33395TEWR2 MC33395DWB MC33395TEW
描述 Motor / Motion / Ignition Controllers & Drivers 3 PHASE MOTOR DRIVER Motor / Motion / Ignition Controllers & Drivers TPDT Motor / Motion / Ignition Controllers & Drivers TPD Motor / Motion / Ignition Controllers & Drivers PB FREE TPDT Motor / Motion / Ignition Controllers & Drivers TPD Motor / Motion / Ignition Controllers & Drivers PB FREE TPDT
是否Rohs认证 符合 不符合 不符合 符合 不符合 符合
厂商名称 NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)
零件包装代码 SOIC SOIC SOIC SOIC SOIC SOIC
包装说明 SSOP, SSOP, SSOP32,.4 SSOP, SSOP32,.4 SSOP, SSOP, SSOP32,.4 SSOP,
针数 32 32 32 32 32 32
Reach Compliance Code unknown unknown unknown unknown unknown unknown
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
模拟集成电路 - 其他类型 BRUSHLESS DC MOTOR CONTROLLER BRUSHLESS DC MOTOR CONTROLLER BRUSHLESS DC MOTOR CONTROLLER BRUSHLESS DC MOTOR CONTROLLER BRUSHLESS DC MOTOR CONTROLLER BRUSHLESS DC MOTOR CONTROLLER
JESD-30 代码 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32
JESD-609代码 e3 e0 e0 e3 e0 e3
长度 11 mm 11 mm 11 mm 11 mm 11 mm 11 mm
湿度敏感等级 3 3 3 3 3 3
功能数量 1 1 1 1 1 1
端子数量 32 32 32 32 32 32
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SSOP SSOP SSOP SSOP SSOP SSOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
峰值回流温度(摄氏度) 260 220 220 245 220 245
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 2.65 mm 2.65 mm 2.65 mm 2.65 mm 2.65 mm 2.65 mm
最大供电电压 (Vsup) 24 V 24 V 24 V 24 V 24 V 24 V
最小供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
标称供电电压 (Vsup) 12 V 12 V 12 V 12 V 12 V 12 V
表面贴装 YES YES YES YES YES YES
温度等级 AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
端子面层 Matte Tin (Sn) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Matte Tin (Sn) Tin/Lead (Sn/Pb) Matte Tin (Sn)
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 40 30 30 30 30 30
宽度 7.5 mm 7.5 mm 7.5 mm 7.5 mm 7.5 mm 7.5 mm
Base Number Matches 1 1 1 1 1 1
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