型号
- 型号
- 关键词
IC,DECODER/DEMUX,2-TO-4-LINE,SC-CMOS,DIP,16PIN,PLASTIC
厂商名称：Microsemi
厂商官网：https://www.microsemi.com
下载文档
| 型号 | MD74SC239AE | MD54SC237AC | MD54SC238AC | MD54SC239AC | MD74SC237AC | MD74SC237AE | MD74SC238AC | MD74SC238AE | MD74SC239AC |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC,DECODER/DEMUX,2-TO-4-LINE,SC-CMOS,DIP,16PIN,PLASTIC | Decoder/Driver, CMOS, CDIP16, | Decoder/Driver, CMOS, CDIP16, | Decoder/Driver, CMOS, CDIP16, | IC,DECODER/DEMUX,3-TO-8-LINE,SC-CMOS,DIP,16PIN,CERAMIC | IC,DECODER/DEMUX,3-TO-8-LINE,SC-CMOS,DIP,16PIN,PLASTIC | IC,DECODER/DEMUX,3-TO-8-LINE,SC-CMOS,DIP,16PIN,CERAMIC | IC,DECODER/DEMUX,3-TO-8-LINE,SC-CMOS,DIP,16PIN,PLASTIC | IC,DECODER/DEMUX,2-TO-4-LINE,SC-CMOS,DIP,16PIN,CERAMIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | unknown | unknow | unknow | unknow | unknow | unknow | unknow | unknow | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| JESD-30 代码 | R-PDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-XDIP-T16 |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER |
| 最大I（ol） | 0.008 A | 0.0065 A | 0.0065 A | 0.0065 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A |
| 功能数量 | 2 | 1 | 1 | 2 | 1 | 1 | 1 | 1 | 2 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 70 °C | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 技术 | TTL | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | TTL |
| 温度等级 | COMMERCIAL | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 包装说明 | DIP, DIP16,.3 | DIP, DIP16,.3 | - | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| JESD-609代码 | e0 | - | - | - | e0 | e0 | e0 | e0 | e0 |
| 端子面层 | Tin/Lead (Sn/Pb) | - | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 厂商名称 | - | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi | - |
