5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com
BGA Sockets
Standard Socket (S):
• Mates with Standard Adapter (A)
• Socket size same size as BGA device body
• Use with SMT Adapter for LGA and reworked
BGA device socketing
Extraction Socket (SB):
• Mates with Extraction Slot Adapter (AX)
• Socket size equals BGA body + .079/(2.0)
• Protects valuable PCB during device/adapter
extraction - tool never touches PCB
• Available in 1.0, 1.27 and 1.5mm pitch only
Features:
• Advanced
®
exclusive eutectic solder ball
terminals offer superior SMT processing.
• Uses same footprint as BGA device.
• Proven long-term performance in vigorous
temperature cycling applications - solder
ball terminal absorbs TCE mismatch.
• Closed bottom socket terminal for 100%
anti-wicking of solder.
• Gold contacts allow gold/gold
interconnections to male Adapter pins.
• Low insertion force socket with multi-
fingered high reliability Beryllium Copper
contacts.
• Coplanarity consistently under .006 inch
industry standard.
• In-house Tape and Reel packaging
available.
• See page 4 for How It Works.
Guide Post Socket (SG):
• Integral molded corners allow accurate positioning of
device/adapter assembly in blind-mating applications.
• Mates with Extraction Slot Adapter (AX)
• Socket size equals BGA body + .276/(7.00)
• Available in 1.27 and 1.5mm pitch only
Terminals:
1.27 & 1.5mm Pitch Terminals
Type -636
Type -673
Solder Ball
STANDARD
.117
(2.97)
1.0mm Pitch Terminals
Type -716
Type -717
Solder Ball
.105
(2.67)
.090
(2.29)
Thru-Hole
.090
(2.29)
.125
(3.18)
.024/(0.61) Dia.
PATENTED
.015 Dia.
(0.38)
Thru-Hole
.117
(2.97)
.095
(2.41)
.030 Dia.
(0.76)
.128
(3.25)
.018 Dia.
(0.46)
.105
(2.67)
PATENTED
Terminals and Contacts:
Terminals: Brass - Copper Alloy (C36000)
ASTM-B-16
Contacts: Beryllium Copper - Copper
Alloy (C17200), ASTM-B-194
0.80mm Pitch Terminals
Type -731
Type -702
Solder Ball
Thru-Hole
0.75mm Pitch Terminals
Type -758
Solder Ball
.125
(3.18)
.125
(3.18)
.080
(2.03)
.011 Dia.
(0.28)
.125
(3.18)
.020/(0.51) Dia.
.018/(0.46) Dia.
PATENTED
Plating:
G - Gold over Nickel
PATENTED
Body Material:
M - Molded High Temp. Glass Filled
Thermoplastic (P.P.S.), U.L. Rated 94V-O,
-60˚C to 260˚C (-76˚F to 500˚F)
F - FR-4 Glass Epoxy, U.L. Rated 94V-O
1
Footprint Dash#
If Applicable
How To Order
M
G
S
XXX -636
G
G
Contact Plating
G - Gold
Terminal Plating
G - Gold
Terminal Type
Number of Positions
See BGA Footprint section or web site
Model Type
S
= Standard Socket
SB
= Extraction Slot (1.5, 1.27 and 1.0mm pitch only)
SG
= Guide Post Socket (1.5 and 1.27mm pitch only)
Solder:
63Sn/37Pb, Eutectic, 183˚C (361.4˚F)
Body Type
M - Molded PPS (1.27 & 1.5mm pitch)
F - FR-4 (0.75, 0.80 & 1.0mm pitch)
Pitch
B = .059/(1.5mm)
G = .050/(1.27mm)
H = .039/(1.0mm)
J = .0315/(0.80mm)
K = .0295/(0.75mm)
inch/(mm)
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
2009年2月16日，ARM日前宣布，将在巴塞罗那移动世界大会(Mobile World Congress)上展示采用32nm高K金属门(HKMG)工艺技术生产的ARM处理器。它是采用ARM物理IP、在IBM基于32nm高K金属门(HKMG)工艺的Common Platform测试芯片上构建的32nm Cortex™系列处理器核。该处理器将为ARM®半导体合作伙伴提供支持，使他们不仅...[详细]
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