型号
- 型号
- 关键词
ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP20, PLASTIC, DIP-20
厂商名称：Qorvo
下载文档| 型号 | ML2261CCP | ML2261BCQ | ML2261BCP | ML2261CCQ |
|---|---|---|---|---|
| 描述 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP20, PLASTIC, DIP-20 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PQCC20, PLASTIC, LCC-20 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP20, PLASTIC, DIP-20 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PQCC20, PLASTIC, LCC-20 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Qorvo | Qorvo | Qorvo | Qorvo |
| 零件包装代码 | DIP | QLCC | DIP | QLCC |
| 包装说明 | DIP, DIP20,.3 | QCCJ, LDCC20,.4SQ | DIP, DIP20,.3 | QCCJ, LDCC20,.4SQ |
| 针数 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大模拟输入电压 | 5.1 V | 5.1 V | 5.1 V | 5.1 V |
| 最小模拟输入电压 | -0.1 V | -0.1 V | -0.1 V | -0.1 V |
| 最长转换时间 | 1.06 µs | 1.06 µs | 1.06 µs | 1.06 µs |
| 转换器类型 | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD |
| JESD-30 代码 | R-PDIP-T20 | S-PQCC-J20 | R-PDIP-T20 | S-PQCC-J20 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 长度 | 25.97 mm | 8.965 mm | 25.97 mm | 8.965 mm |
| 最大线性误差 (EL) | 0.39% | 0.195% | 0.195% | 0.39% |
| 模拟输入通道数量 | 1 | 1 | 1 | 1 |
| 位数 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
| 输出位码 | BINARY | BINARY | BINARY | BINARY |
| 输出格式 | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | QCCJ | DIP | QCCJ |
| 封装等效代码 | DIP20,.3 | LDCC20,.4SQ | DIP20,.3 | LDCC20,.4SQ |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER |
| 电源 | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 采样并保持/跟踪并保持 | SAMPLE | SAMPLE | SAMPLE | SAMPLE |
| 座面最大高度 | 4.32 mm | 4.57 mm | 4.32 mm | 4.57 mm |
| 最大压摆率 | 14 mA | 14 mA | 14 mA | 14 mA |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | J BEND | THROUGH-HOLE | J BEND |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | QUAD | DUAL | QUAD |
| 宽度 | 7.62 mm | 8.965 mm | 7.62 mm | 8.965 mm |