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FEUL610Q409-01

ML610Q407/ML610Q408/ML610Q409

User’s Manual

Issue Date: Nov. 7, 2010

NOTICE

The information contained herein can change without notice owing to product and/or technical improvements. Before using the

product, please make sure that the information being referred to is up-to-date.

The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard

action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected

in the actual circuit, assembly, and program designs.

When designing your product, please use our product below the specified maximum ratings and within the specified operating

ranges including, but not limited to, operating voltage, power dissipation, and operating temperature.

OKI SEMICONDUCTOR assumes no responsibility or liability whatsoever for any failure or unusual or unexpected

operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or

unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum

ratings or operation outside the specified operating range.

Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted by us in

connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us

for any infringement of a third party’s right which may result from the use thereof.

The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g.,

office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not,

unless specifically authorized by OKI SEMICONDUCTOR authorized for use in any system or application that requires special

or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or

application may result in the loss or damage of property, or death or injury to humans.

Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear

power control, medical equipment, and life-support systems.

Certain products in this document may need government approval before they can be exported to particular countries. The

purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and

necessary steps at their own expense for these.

No part of the contents contained herein may be reprinted or reproduced without our prior permission.

Preface

This manual describes the operation of the hardware of the 8-bit microcontroller

ML610Q407/ML610Q408/ML610Q409.

The following manuals are also available.

nX-U8/100 Core Instruction Manual

Read them as necessary.

Description on the basic architecture and the each instruction of the

nX-U8/100 Core

MACU8 Assembler Package User’s Manual

Description on the method of operating the relocatable assembler, the linker, the

librarian, and the object converter and also on the specifications of the assembler

language.

CCU8 User’s Manual

Description on the method of operating the

compiler

CCU8 Programming Guide

Description on the method of programming.

CCU8 Language Reference

Description on the

language specifications

DTU8 Debugger User’s Manual

Description on the method of operating the debugger

DTU8

IDEU8 User’s Manual

Description on the integrated development environment

IDEU8

uEASE User’s Manual

Description on the on-chip debug tool uEASE.

uEASE connection Manual for ML610Q407/ML610Q408/ML610Q409

Description about the connection between uEASE and

ML610Q407/

ML610Q408/ ML610Q409

FWuEASE Flash Writer Host Program User’s Manual

Description on the Flash Writer host program.

Notation

Classification

♦

Numeric value

♦

Unit

Notation

xxh, xxH

xxb

word, W

byte, B

nibble, N

maga-, M

kilo-, K

kilo-, k

milli-, m

micro-, µ

nano-, n

second, s (lower case)

“H” level, “1” level

“L” level, “0” level

Description

Indicates a hexadecimal number. x: Any value in the range of 0 to F

Indicates a binary number; “b” may be omitted. x: A value 0 or 1

1 word = 16 bits

1 byte = 8 bits

1 nibble = 4 bits

= 1024

= 1000

-3

-6

-9

second

Indicates high voltage signal levels V

and V

as specified by the

electrical characteristics.

Indicates low voltage signal levels V

and V

as specified by the

electrical characteristics.

♦

Terminology

♦

R/W: Indicates that Read/Write attribute. “R” indicates that data can be read and “W” indicates that data can be written.

“R/W” indicates that data can be read or written.

Invalid bit: This bit reads “0” when read. Write to this bit is ignored.

Bit name

MSB

FCON0

R/W

Initial value

⎯

R/W

⎯

R/W

OUTC1

R/W

OUTC0

R/W

OSCM1

R/W

OSCM0

R/W

SYSC1

R/W

SYSC0

R/W

LSB

Initial value after reset

ML610Q407/ML610Q408/ML610Q409 User’s Manual

Contents

Table of Contents

Chapter 1

1. Overview ........................................................................................................................................................................... 1-1

1.1 Features ........................................................................................................................................................................ 1-1

1.2 Configuration of Functional Blocks ............................................................................................................................. 1-4

1.2.1

Block Diagram of ML610Q407/ML610Q408/ML610Q409.............................................................................. 1-4

1.3 Pins .............................................................................................................................................................................. 1-5

1.3.1 Pin Layout............................................................................................................................................................. 1-5

1.3.1.1

1.3.1.2

1.3.1.3

1.3.1.4

1.3.1.5

1.3.1.6

1.3.1.7

Pin Layout of ML610Q407 TQFP Package ......................................................................................................................... 1-5

Pin Layout of ML610Q408 TQFP Package ......................................................................................................................... 1-6

Pin Layout of ML610Q409 TQFP Package ......................................................................................................................... 1-7

Pin Layout of ML610Q407 Chip.......................................................................................................................................... 1-8

Pin Layout of ML610Q408 Chip.......................................................................................................................................... 1-9

Pin Layout of ML610Q409 Chip........................................................................................................................................ 1-10

Pad Coordinates of ML610Q407/ML610Q408/M610Q409 Chip ...................................................................................... 1-11

1.3.2 List of Pins.......................................................................................................................................................... 1-12

1.3.3 Pin Descriptions.................................................................................................................................................. 1-15

1.3.4 Handling of Unused Pins .................................................................................................................................... 1-19

Chapter 2

2. CPU and Memory Space ...................................................................................................................................................... 2-1

2.1 Overview ...................................................................................................................................................................... 2-1

2.2 Program Memory Space ............................................................................................................................................... 2-1

2.3 Data Memory Space ..................................................................................................................................................... 2-2

2.4 Instruction Length......................................................................................................................................................... 2-3

2.5 Data Type ..................................................................................................................................................................... 2-3

2.6 Description of Registers ............................................................................................................................................... 2-4

2.6.1 List of Registers .................................................................................................................................................... 2-4

2.6.2 Data Segment Register (DSR) .............................................................................................................................. 2-5

Chapter 3

3. Reset Function ...................................................................................................................................................................... 3-1

3.1 Overview ...................................................................................................................................................................... 3-1

3.1.1 Features................................................................................................................................................................. 3-1

3.1.2 Configuration........................................................................................................................................................ 3-1

3.1.3 List of Pins............................................................................................................................................................ 3-1

3.2 Description of Registers ............................................................................................................................................... 3-2

3.2.1 List of Registers .................................................................................................................................................... 3-2

3.2.2 Reset Status Register (RSTAT) ............................................................................................................................. 3-2

3.3 Description of Operation .............................................................................................................................................. 3-3

3.3.1 Operation of System Reset Mode ......................................................................................................................... 3-3

Contents – 0

参数对比

与ML610Q407P-NNNTBZ03A相近的元器件有：ML610Q408P-NNNTBZ03A、ML610Q409P-NNNWA、ML610Q409P-NNNTBZ03A、ML610Q407-NNNTBZ03A、ML610Q408-NNNWA。描述及对比如下：

型号	ML610Q407P-NNNTBZ03A	ML610Q408P-NNNTBZ03A	ML610Q409P-NNNWA	ML610Q409P-NNNTBZ03A	ML610Q407-NNNTBZ03A	ML610Q408-NNNWA
描述	RISC Microcontroller, 8-Bit, FLASH, 2.5MHz, CMOS, PQFP100, 14 X 14MM, 0.50 PITCH, PLASTIC, TQFP-100	RISC Microcontroller, 8-Bit, FLASH, 2.5MHz, CMOS, PQFP100, 14 X 14MM, 0.50 PITCH, PLASTIC, TQFP-100	RISC Microcontroller, CMOS, 2.27 X 2.23 MM, 0.35MM HEIGHT, 0.80 MM PITCH,DIE-88	RISC Microcontroller, 8-Bit, FLASH, 2.5MHz, CMOS, PQFP100, 14 X 14MM, 0.50 PITCH, PLASTIC, TQFP-100	RISC Microcontroller, 8-Bit, FLASH, 2.5MHz, CMOS, PQFP100, 14 X 14MM, 0.50 PITCH, PLASTIC, TQFP-100	RISC Microcontroller, CMOS, 2.27 X 2.23 MM, 0.35MM HEIGHT, 0.80 MM PITCH,DIE-88
零件包装代码	QFP	QFP	DIE	QFP	QFP	DIE
包装说明	14 X 14MM, 0.50 PITCH, PLASTIC, TQFP-100	14 X 14MM, 0.50 PITCH, PLASTIC, TQFP-100	DIE,	14 X 14MM, 0.50 PITCH, PLASTIC, TQFP-100	14 X 14MM, 0.50 PITCH, PLASTIC, TQFP-100	,
针数	100	100	88	100	100	88
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
uPs/uCs/外围集成电路类型	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
厂商名称	LAPIS Semiconductor Co Ltd	-	LAPIS Semiconductor Co Ltd	LAPIS Semiconductor Co Ltd	LAPIS Semiconductor Co Ltd	LAPIS Semiconductor Co Ltd
具有ADC	YES	-	YES	YES	YES	-
位大小	8	8	8	8	8	-
DAC 通道	NO	-	NO	NO	NO	-
DMA 通道	NO	-	NO	NO	NO	-
JESD-30 代码	S-PQFP-G100	S-PQFP-G100	-	S-PQFP-G100	S-PQFP-G100	-
JESD-609代码	e6	e6	-	e6	e6	-
长度	14 mm	-	2.27 mm	14 mm	14 mm	-
I/O 线路数量	35	-	39	27	35	-
端子数量	100	100	88	100	100	-
最高工作温度	85 °C	85 °C	-	85 °C	70 °C	-
最低工作温度	-40 °C	-40 °C	-	-40 °C	-20 °C	-
PWM 通道	YES	-	YES	YES	YES	-
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	-
封装代码	QFP	QFP	DIE	QFP	QFP	-
封装等效代码	TQFP100,.63SQ	TQFP100,.63SQ	-	TQFP100,.63SQ	TQFP100,.63SQ	-
封装形状	SQUARE	SQUARE	RECTANGULAR	SQUARE	SQUARE	-
封装形式	FLATPACK	FLATPACK	UNCASED CHIP	FLATPACK	FLATPACK	-
电源	1.5/3.3 V	1.5/3.3 V	-	1.5/3.3 V	1.5/3.3 V	-
RAM（字节）	1024	1024	-	1024	1024	-
ROM（单词）	8192	8192	-	8192	8192	-
ROM可编程性	FLASH	FLASH	-	FLASH	FLASH	-
速度	2.5 MHz	2.5 MHz	2.5 MHz	2.5 MHz	2.5 MHz	-
最大供电电压	3.6 V	-	3.6 V	3.6 V	3.6 V	-
最小供电电压	1.8 V	-	1.8 V	1.8 V	1.8 V	-
标称供电电压	3 V	-	3 V	3 V	3 V	-
表面贴装	YES	YES	YES	YES	YES	-
技术	CMOS	CMOS	-	CMOS	CMOS	-
温度等级	INDUSTRIAL	INDUSTRIAL	-	INDUSTRIAL	COMMERCIAL	-
端子面层	TIN BISMUTH	TIN BISMUTH	-	TIN BISMUTH	TIN BISMUTH	-
端子形式	GULL WING	GULL WING	NO LEAD	GULL WING	GULL WING	-
端子节距	0.5 mm	0.5 mm	-	0.5 mm	0.5 mm	-
端子位置	QUAD	QUAD	UPPER	QUAD	QUAD	-
宽度	14 mm	-	2.23 mm	14 mm	14 mm	-

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　　为争抢触控市场，联发科（MTK ）转投资的大陆触控IC厂汇顶已对外发表最新采用单层ITO和多点电容式触控方案，与即将并购的晨星(MStar)互别苗头，亦代表多元布局触控IC市场。　　无论是笔记本电脑、平板电脑或智能手机等终端产品，触控俨然已成标准配备，联发科积极展开布局，去年即不断加码中国大陆触控IC公司汇顶科技，累计投资金额达409万美元（约新台币约1.24亿元），持股比重逾三成。 ...[详细]