首页 > 器件类别 > 存储 > 存储

MSM51V18160F-70TS-L

描述:
Fast Page DRAM, 1MX16, 70ns, CMOS, PDSO44, 0.400 INCH, 0.80 MM PITCH, REVERSE, PLASTIC, TSOP2-50/44
分类:
存储    存储   
文件大小:
178KB,共15页
制造商:
概述
Fast Page DRAM, 1MX16, 70ns, CMOS, PDSO44, 0.400 INCH, 0.80 MM PITCH, REVERSE, PLASTIC, TSOP2-50/44
器件参数
参数名称
属性值
厂商名称
LAPIS Semiconductor Co Ltd
零件包装代码
TSOP2
包装说明
TSOP2-R,
针数
50
Reach Compliance Code
unknown
ECCN代码
EAR99
访问模式
FAST PAGE
最长访问时间
70 ns
其他特性
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 代码
R-PDSO-G44
长度
20.95 mm
内存密度
16777216 bit
内存集成电路类型
FAST PAGE DRAM
内存宽度
16
功能数量
1
端口数量
1
端子数量
44
字数
1048576 words
字数代码
1000000
工作模式
ASYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
1MX16
封装主体材料
PLASTIC/EPOXY
封装代码
TSOP2-R
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, THIN PROFILE
认证状态
Not Qualified
座面最大高度
1.2 mm
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
3 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子形式
GULL WING
端子节距
0.8 mm
端子位置
DUAL
宽度
10.16 mm
文档预览
Semiconductor
MSM51V18160F
1,048,576-Word x 16-Bit DYNAMIC RAM : FAST PAGE MODE TYPE
This version:Oct.1999
DESCRIPTION
The MSM51V18160F is a 1,048,576-word
´
16-bit dynamic RAM fabricated in Oki’s silicon-gate CMOS
technology. The MSM51V18160F achieves high integration, high-speed operation, and low-power consumption
because Oki manufactures the device in a quadruple-layer polysilicon/double-layer metal CMOS process. The
MSM51V18160F is available in a 42-pin plastic SOJ or 50/44-pin plastic TSOP.
FEATURES
·
·
·
·
·
·
·
·
·
1,048,576-word
´
16-bit configuration
Single 3.3V power supply,
±0.3V
tolerance
Input
Output
Refresh
: LVTTL compatible, low input capacitance
: LVTTL compatible, 3-state
: 1024 cycles/16ms
Fast page mode, read modify write capability
CAS before RAS refresh, hidden refresh, RAS-only refresh capability
CAS before RAS self-refresh capability
Package options:
42-pin 400mil plastic SOJ
50/44-pin 400mil plastic TSOP
(SOJ42-P-400-1.27)
(TSOPII50/44-P-400-0.80-K)
(TSOPII50/44-P-400-0.80-L)
(Product : MSM51V18160F-xxJS)
(Product : MSM51V18160F-xxTS-K)
(Product : MSM51V18160F-xxTS-L)
xx indicates speed rank.
PRODUCT FAMILY
Access Time (Max.)
Family
t
RAC
50ns
MSM51V18165F
60ns
70ns
t
AA
25ns
30ns
35ns
t
CAC
13ns
15ns
20ns
t
OEA
13ns
15ns
20ns
Cycle Time
(Min.)
90ns
110ns
130ns
Power Dissipation
Operating (Max.)
450mW
414mW
378mW
1.8mW
Standby (Max.)
No.
1/14
PIN CONFIGRATION (TOP VIEW)
V
CC
DQ1
DQ2
DQ3
DQ4
V
CC
DQ5
DQ6
DQ7
DQ8
NC
NC
WE
RAS
NC
NC
A0
A1
A2
A3
V
CC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
V
SS
DQ16
DQ15
DQ14
DQ13
V
SS
DQ12
DQ11
DQ10
DQ9
NC
LCAS
UCAS
OE
A9
A8
A7
A6
A5
A4
V
SS
V
CC
DQ1
DQ2
DQ3
DQ4
V
CC
DQ5
DQ6
DQ7
DQ8
NC
1
2
3
4
5
6
7
8
9
10
11
50
49
48
47
46
45
44
43
42
41
40
V
SS
DQ16
DQ15
DQ14
DQ13
V
SS
DQ12
DQ11
DQ10
DQ9
NC
V
SS
DQ16
DQ15
DQ14
DQ13
V
SS
DQ12
DQ11
DQ10
DQ9
NC
50
49
48
47
46
45
44
43
42
41
40
1
2
3
4
5
6
7
8
9
10
11
V
CC
DQ1
DQ2
DQ3
DQ4
V
CC
DQ5
DQ6
DQ7
DQ8
NC
42-Pin Plastic SOJ
NC 15
NC 16
WE 17
RAS 18
NC 19
NC 20
A0 21
A1 22
A2 23
A3 24
V
CC
25
36
35
34
33
32
31
30
29
28
27
26
NC 36
NC
LCAS LCAS 35
UCAS UCAS 34
OE
OE 33
A9
A9 32
A8
A8 31
A7 30
A7
A6 29
A6
A5
A5 28
A4
A4 27
V
SS
26
V
SS
15
16
17
18
19
20
21
22
23
24
25
NC
NC
WE
RAS
NC
NC
A0
A1
A2
A3
V
CC
55/44-Pin Plastic TSOP
(K Type)
55/44-Pin Plastic TSOP
(L Type)
Pin Name
A0–A9
RAS
LCAS
UCAS
DQ1–DQ16
OE
WE
V
CC
V
SS
NC
Function
Address Input
Row Address Strobe
Lower Byte Column Address Strobe
Upper Byte Column Address Strobe
Data Input/Data Output
Output Enable
Write Enable
Power Supply (3.3V)
Ground (0V)
No Connection
Note : The same power supply voltage must be provided to every V
CC
pin, and the same
GND voltage level must be provided to every V
SS
pin.
No.
2/14
BLOCK DIAGRAM
WE
RAS
LCAS
UCAS
Column
Address
Buffers
Internal
Address
Counter
Row
Address
Buffers
Timing
Generator
I/O
Controller
I/O
Controller
10
10
Column Decoders
8
Output
Buffers
8
OE
DQ1-DQ8
8
I/O
Selector
Input
Buffers
8
A0-A9
Refresh
Control Clock
Sense Amplifiers
16
16
Input
Buffers
8
10
10
Row
Deco-
ders
Word
Drivers
Memory
Cells
8
8
DQ9-DQ16
Output
Buffers
8
V
CC
On Chip
V
BB
Generator
On Chip
IV
CC
Generator
V
SS
FUNCTION TABLE
Input Pin
RAS
H
L
L
L
L
L
L
L
L
LCAS
*
H
L
H
L
L
H
L
L
UCAS
*
H
H
L
L
H
L
L
L
WE
*
*
H
H
H
L
L
L
H
OE
*
*
L
L
L
H
H
H
H
DQ Pin
Function Mode
DQ1-DQ8
High-Z
High-Z
D
OUT
High-Z
D
OUT
D
IN
Don’t Care
D
IN
High-Z
DQ9-DQ16
High-Z
High-Z
High-Z
D
OUT
D
OUT
Don’t Care
D
IN
D
IN
High-Z
Standby
Refresh
Lower Byte Read
Upper Byte Read
Word Read
Lower Byte Write
Upper Byte Write
Word Write
¾
* : “H” or “L”
No.
3/14
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Parameter
Voltage on Any Pin Relative to V
SS
Voltage V
CC
Supply relative to V
SS
Short Circuit Output Current
Power Dissipation
Operating Temperature
Storage Temperature
Symbol
V
IN
, V
OUT
V
CC
I
OS
P
D*
T
opr
T
stg
Rating
-
0.5 to V
CC
+
0.5
-
0.5 to 4.6
50
1
0 to 70
-
55 to 150
Unit
V
V
mA
W
°C
°C
*: Ta = 25°C
Recommended Operating Conditions
(Ta = 0 °C to 70 °C)
Parameter
Power Supply Voltage
Input High Voltage
Input Low Voltage
Symbol
Min.
3.0
0
2.0
-
0.3
*2
Typ.
3.3
0
¾
¾
Max.
3.6
0
V
CC
+ 0.3
0.8
*1
Unit
V
V
V
V
V
CC
V
SS
V
IH
V
IL
Notes:
*1. The input voltage is V
CC
+ 1.0V when the pulse width is less than 20ns (the pulse width is with
respect to the point at which V
CC
is applied).
*2. The input voltage is V
SS
-
1.0V when the pulse width is less than 20ns (the pulse width respect to
the point at which V
SS
is applied).
Capacitance
(V
CC
= 3.3V
±
0.3V, Ta = 25°C, f=1MHz)
Parameter
Input Capacitance (A0 - A9)
Input Capacitance
(RAS, LCAS, UCAS, WE, OE)
Output Capacitance (DQ1 - DQ16)
Symbol
Typ.
¾
¾
¾
Max.
5
7
7
Unit
pF
pF
pF
C
IN1
C
IN2
C
I/O
No.
4/14
DC Characteristics
(V
CC
= 3.3V
±
0.3V, Ta = 0°C to 70°C)
MSM51V18160 MSM51V18160 MSM51V18160
F-50
F-60
F-70
Unit Note
Min.
Output High Voltage
Output Low Voltage
Input Leakage
Current
Output Leakage
Current
Average Power
Supply Current
(Operating)
Power Supply
Current
(Standby)
Average Power
Supply Current
(RAS-only Refresh)
Power Supply
Current
(Standby)
Average Power
Supply Current
(CAS before RAS
Refresh)
Average Power
Supply Current
(Fast Page Mode)
V
OH
V
OL
I
LI
I
OH
=
-2.0mA
I
OL
= 2.0mA
0V
£
V
I
£
V
CC
+0.3V;
All other pins not
under test = 0V
DQ disable
0V
£
V
O
£
V
CC
RAS, CAS cycling,
t
RC
= Min.
RAS, CAS = V
IH
I
CC2
RAS, CAS
³
V
CC
-
0.2V
RAS cycling,
I
CC3
CAS = V
IH
,
t
RC
= Min.
RAS = V
IH
,
I
CC5
CAS = V
IL
,
DQ = enable
I
CC6
RAS = cycling,
CAS before RAS
RAS = V
IL
,
I
CC7
CAS cycling,
t
PC
= Min.
¾
80
¾
70
¾
60
mA
1,3
¾
¾
¾
¾
5
¾
5
¾
5
mA
1
¾
80
¾
70
¾
60
mA
1,2
-
10
10
-
10
10
-
10
10
mA
2.4
0
Max.
V
CC
0.4
Min.
2.4
0
Max.
V
CC
0.4
Min.
2.4
0
Max.
V
CC
0.4
V
V
Parameter
Symbol
Condition
I
LO
-
10
10
-
10
10
-
10
10
mA
I
CC1
¾
¾
¾
80
¾
¾
¾
70
¾
¾
¾
60
mA
1,2
2
0.5
2
0.5
2
0.5
mA
1
80
70
60
mA
1,2
Notes: 1.
2.
3.
I
CC
Max. is specified as I
CC
for output open condition.
The address can be changed once or less while RAS = V
IL
.
The address can be changed once or less while CAS = V
IH
.
No.
5/14
参数对比
与MSM51V18160F-70TS-L相近的元器件有:MSM51V18160F-60TS-L、MSM51V18160F-50TS-L。描述及对比如下:
型号 MSM51V18160F-70TS-L MSM51V18160F-60TS-L MSM51V18160F-50TS-L
描述 Fast Page DRAM, 1MX16, 70ns, CMOS, PDSO44, 0.400 INCH, 0.80 MM PITCH, REVERSE, PLASTIC, TSOP2-50/44 Fast Page DRAM, 1MX16, 60ns, CMOS, PDSO44, 0.400 INCH, 0.80 MM PITCH, REVERSE, PLASTIC, TSOP2-50/44 Fast Page DRAM, 1MX16, 50ns, CMOS, PDSO44, 0.400 INCH, 0.80 MM PITCH, REVERSE, PLASTIC, TSOP2-50/44
厂商名称 LAPIS Semiconductor Co Ltd LAPIS Semiconductor Co Ltd LAPIS Semiconductor Co Ltd
零件包装代码 TSOP2 TSOP2 TSOP2
包装说明 TSOP2-R, TSOP2-R, TSOP2-R,
针数 50 50 50
Reach Compliance Code unknown unknown unknown
ECCN代码 EAR99 EAR99 EAR99
访问模式 FAST PAGE FAST PAGE FAST PAGE
最长访问时间 70 ns 60 ns 50 ns
其他特性 RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 代码 R-PDSO-G44 R-PDSO-G44 R-PDSO-G44
长度 20.95 mm 20.95 mm 20.95 mm
内存密度 16777216 bit 16777216 bit 16777216 bit
内存集成电路类型 FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM
内存宽度 16 16 16
功能数量 1 1 1
端口数量 1 1 1
端子数量 44 44 44
字数 1048576 words 1048576 words 1048576 words
字数代码 1000000 1000000 1000000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C
组织 1MX16 1MX16 1MX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSOP2-R TSOP2-R TSOP2-R
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
认证状态 Not Qualified Not Qualified Not Qualified
座面最大高度 1.2 mm 1.2 mm 1.2 mm
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 3 V 3 V 3 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES
技术 CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 GULL WING GULL WING GULL WING
端子节距 0.8 mm 0.8 mm 0.8 mm
端子位置 DUAL DUAL DUAL
宽度 10.16 mm 10.16 mm 10.16 mm
热门器件
热门资源推荐
器件捷径:
L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ
索引文件:
418  2281  183  355  1460  9  46  4  8  30 
需要登录后才可以下载。
登录取消
下载 PDF 文件