| 型号 | MSM6351LGS-BK | MSM6351LGS-K | MSM6351GS-BK | MSM6351GS-L | MSM6351LGS-L |
|---|---|---|---|---|---|
| 描述 | Microcontroller, 4-Bit, MROM, OLMS-63 CPU, 0.032MHz, CMOS, PQFP100 | Microcontroller, 4-Bit, MROM, OLMS-63 CPU, 0.032MHz, CMOS, PQFP100 | Microcontroller, 4-Bit, MROM, OLMS-63 CPU, 0.032MHz, CMOS, PQFP100 | Microcontroller, 4-Bit, MROM, OLMS-63 CPU, 0.032MHz, CMOS, PQFP100 | Microcontroller, 4-Bit, MROM, OLMS-63 CPU, 0.032MHz, CMOS, PQFP100 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd |
| 包装说明 | QFP, QFP100,.7X.9,32 | QFP, QFP100,.7X.9,32 | QFP, QFP100,.7X.9,32 | QFP, QFP100,.7X.9,32 | QFP, QFP100,.7X.9,32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 位大小 | 4 | 4 | 4 | 4 | 4 |
| CPU系列 | OLMS-63 | OLMS-63 | OLMS-63 | OLMS-63 | OLMS-63 |
| JESD-30 代码 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 100 | 100 | 100 | 100 | 100 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 最低工作温度 | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QFP | QFP | QFP | QFP | QFP |
| 封装等效代码 | QFP100,.7X.9,32 | QFP100,.7X.9,32 | QFP100,.7X.9,32 | QFP100,.7X.9,32 | QFP100,.7X.9,32 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
| 电源 | -1.5/-3,-4.5 V | -1.5/-3,-4.5 V | -1.5/-3,-4.5 V | -1.5/-3,-4.5 V | -1.5/-3,-4.5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM(字节) | 512 | 512 | 512 | 512 | 512 |
| ROM(单词) | 4096 | 4096 | 4096 | 4096 | 4096 |
| ROM可编程性 | MROM | MROM | MROM | MROM | MROM |
| 速度 | 0.032 MHz | 0.032 MHz | 0.032 MHz | 0.032 MHz | 0.032 MHz |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD |