Microcontroller, 16-Bit, MROM, OLMS-66K CPU, 14MHz, CMOS, PQFP100
器件类别:嵌入式处理器和控制器 微控制器和处理器
厂商名称:LAPIS Semiconductor Co Ltd
下载文档型号 | MSM66573GS | MSM66Q573TS | MSM66Q573GS | MSM66573TS |
---|---|---|---|---|
描述 | Microcontroller, 16-Bit, MROM, OLMS-66K CPU, 14MHz, CMOS, PQFP100 | Microcontroller, 16-Bit, FLASH, OLMS-66K CPU, 14MHz, CMOS, PQFP100 | Microcontroller, 16-Bit, FLASH, OLMS-66K CPU, 14MHz, CMOS, PQFP100 | Microcontroller, 16-Bit, MROM, OLMS-66K CPU, 14MHz, CMOS, PQFP100 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd | LAPIS Semiconductor Co Ltd |
包装说明 | QFP, QFP100,.75X.99 | QFP, TQFP100,.63SQ | QFP, QFP100,.75X.99 | QFP, TQFP100,.63SQ |
Reach Compliance Code | unknown | unknown | unknown | unknown |
位大小 | 16 | 16 | 16 | 16 |
CPU系列 | OLMS-66K | OLMS-66K | OLMS-66K | OLMS-66K |
JESD-30 代码 | R-PQFP-G100 | S-PQFP-G100 | R-PQFP-G100 | S-PQFP-G100 |
JESD-609代码 | e0 | e0 | e0 | e0 |
端子数量 | 100 | 100 | 100 | 100 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
最低工作温度 | -30 °C | -30 °C | -30 °C | -30 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QFP | QFP | QFP | QFP |
封装等效代码 | QFP100,.75X.99 | TQFP100,.63SQ | QFP100,.75X.99 | TQFP100,.63SQ |
封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
电源 | 3/3.3 V | 3/5 V | 3/5 V | 3/3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM(字节) | 4096 | 4096 | 4096 | 4096 |
ROM(单词) | 65536 | 65536 | 65536 | 65536 |
ROM可编程性 | MROM | FLASH | FLASH | MROM |
速度 | 14 MHz | 14 MHz | 14 MHz | 14 MHz |
表面贴装 | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | OTHER | OTHER | OTHER | OTHER |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.635 mm | 0.5 mm | 0.635 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD |