SUGGESTED PAD LAYOUT
Based on IPC-7351A
X1-DFN1006-2 / X2-DFN1006-2 / MiniMELF / MELF / SOD323 / SOD123 / SOD523 / SMA / SMB / SMC
C
X
Y
G
Z
Dimensions
Z
G
X
Y
C
X1-DFN1006-2 /
MiniMELF
X2-DFN1006-2
1.1
4.7
0.3
2.1
0.7
1.7
0.4
1.3
0.7
3.5
MELF
6.3
3.3
2.7
1.5
4.8
SOD123
4.9
2.5
0.7
1.2
3.7
SOD323
3.75
1.05
0.65
1.35
2.40
SOD523
2.3
1.1
0.8
0.6
1.7
SMA
6.5
1.5
1.7
2.5
4.0
SMB
6.8
1.8
2.3
2.5
4.3
SMC
9.4
4.4
3.3
2.5
6.8
X3-DFN0603-2
X1
X2-DFN0806-3
Z
C
Y1
Dimensions
Dimensions Value (in mm)
C
0.355
X
0.230
Y
0.300
Z
0.610
Y (2x)
Y2
X (2x)
Y (2x)
C
X
X1
X2
Y
Y1
Y2
Value
(in mm)
0.350
0.200
0.450
0.550
0.375
0.475
1.000
X (2x)
C
X2
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
1 of 27
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Suggested Pad Layout
© Diodes Incorporated
X1-DFN1006-3 / X2-DFN1006-3
C
X
1
X
G2
G1
Y
Z
Dimensions Value (in mm)
Z
1.1
G1
0.3
G2
0.2
X
0.7
X1
0.25
Y
0.4
C
0.7
X2-DFN1010-6
X1
C
Y (6x)
Dimensions
C
G
X
X1
Y
Y1
Y1
Value
(in mm)
0.350
0.150
0.200
0.900
0.550
1.250
1
G(4x)
X(6x)
X1-DFN1212-3
X
Y
X
X1-DFN1212-3
Type B
Y2
Y1
(2x)
C
X1
(2x)
Dimensions Value (in mm)
C
0.80
X
0.42
X1
0.32
Y
0.50
Y1
0.50
Y2
1.50
Y
X2
Y3
Y2
X1(2x)
Y1
(2x)
C
Dimensions Value (in mm)
C
0.80
X
0.42
X1
0.32
X2
0.90
Y
0.50
Y1
0.50
Y2
0.20
Y3
1.50
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
2 of 27
www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
X2-DFN1410-6
X1
C
Y(6x)
Dimensions
C
G
X
X1
Y
Y1
Y1
Value
(in mm)
0.500
0.250
0.250
1.250
0.525
1.250
1
G(4x)
X(6x)
X1-DFN1411-3
C
X2
X1
G2 X
Y
Z
G1
Dimensions
Z
G1
G2
X
X1
X2
Y
C
Value (in mm)
1.38
0.15
0.15
0.95
0.75
0.40
0.75
0.76
X1-DFN1612-6 / X2-DFN1310-6
G2
X2
Y2
G1
b
Y1
G3
a
X1
Dimensions
G1
G2
G3
X1
X2
Y1
Y2
a
b
X1-DFN1612-6
0.15
0.175
0.15
0.60
0.25
0.65
0.45
0.10
0.15
X2- DFN1310-6
0.16
0.17
0.15
0.52
0.20
0.52
0.375
0.09
0.06
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
3 of 27
www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
U-DFN1616-6
X3
X1-DFN1616-6 Type E
Y
X2
C
Y (2x)
Dimensions
C
X
X1
X2
X3
Y
Y1
Y2
G
X1
Dimensions Value (in mm)
Z
1.3
G
0.175
X1
0.50
X2
0.525
Y
0.30
C
0.50
Y2
X2
X1
Y1
Z
X (6x)
C
Value
(in mm)
0.500
0.300
0.200
0.720
0.400
0.475
0.620
1.900
U-DFN1616-8
X2
Y2
a
G2
Y1
G1
Dimensions Value (in mm)
G1
0.15
G2
0.20
X1
0.65
X2
0.25
Y1
1.25
Y2
0.50
C
0.40
a
0.10
X1
C
U-DFN2018-6
X
Y
C
Y1
G
Dimensions
C
G
X
X1
Y
Y1
Value (in mm)
0.50
0.20
0.25
1.60
0.35
1.20
X1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
4 of 27
www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
U-DFN2020-3
X
X2
X4
Y3
Y4
R3
G
Y1
X1
C
Y2
Y5
X3
R2
Y
R1
Dimensions
C
G
X
X1
X2
X3
X4
Y
Value
Value
Dimensions
(in mm)
(in mm)
1.00
Y1
0.60
0.15
Y2
0.45
1.40
Y3
0.45
0.35
Y4
0.698
0.45
Y5
0.313
0.322
R1
0.225
0.60
R2
0.05
1.10
R3
0.20
U-DFN2020-6
X2
X1
Y (6x)
Dimensions
C
X
X1
X2
Y
Y1
Y2
Y2
Y1
Value
(in mm)
0.650
0.350
1.650
1.700
0.525
1.010
2.400
X (6x)
C
X2-DFN2020-6
X2
X1
Y
Dimensions
C
X
X1
X2
Y
Y1
Y2
Y3
Y3
Y2
Y1
Value
(in mm)
0.650
0.400
1.050
1.700
0.500
1.600
1.600
2.300
X (6x)
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
5 of 27
www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
