ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, Word Access, BICMOS, PDIP28, PLASTIC, DIP-28
厂商官网:https://www.rocelec.com/
下载文档型号 | MX674AKEPI | MX674ASD | MX674ATQ | MX674AUD | MX674ASQ |
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描述 | ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, Word Access, BICMOS, PDIP28, PLASTIC, DIP-28 | ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, Word Access, BICMOS, CDIP28, SIDEBRAZED, CERAMIC, DIP-28 | ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, Word Access, BICMOS, CDIP28, CERAMIC, DIP-28 | ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, Word Access, BICMOS, CDIP28, SIDEBRAZED, CERAMIC, DIP-28 | ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, Word Access, BICMOS, CDIP28, CERAMIC, DIP-28 |
厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
包装说明 | DIP, | DIP, | DIP, | DIP, | DIP, |
Reach Compliance Code | unknow | unknown | unknown | unknown | unknown |
最大模拟输入电压 | 10 V | 10 V | 10 V | 10 V | 10 V |
最小模拟输入电压 | -10 V | -10 V | -10 V | -10 V | -10 V |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | R-PDIP-T28 | R-CDIP-T28 | R-GDIP-T28 | R-CDIP-T28 | R-GDIP-T28 |
最大线性误差 (EL) | 0.0122% | 0.0244% | 0.0183% | 0.0183% | 0.0244% |
标称负供电电压 | -15 V | -15 V | -15 V | -15 V | -15 V |
模拟输入通道数量 | 1 | 1 | 1 | 1 | 1 |
位数 | 12 | 12 | 12 | 12 | 12 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 28 | 28 | 28 | 28 | 28 |
最高工作温度 | 85 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -55 °C | -55 °C | -55 °C | -55 °C |
输出位码 | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY |
输出格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
封装主体材料 | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
封装代码 | DIP | DIP | DIP | DIP | DIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
采样并保持/跟踪并保持 | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE |
座面最大高度 | 5.08 mm | 5.89 mm | 5.89 mm | 5.89 mm | 5.89 mm |
标称供电电压 | 15 V | 15 V | 15 V | 15 V | 15 V |
表面贴装 | NO | NO | NO | NO | NO |
技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
温度等级 | INDUSTRIAL | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
最长转换时间 | 15 µs | - | 15 µs | 15 µs | 15 µs |
ECCN代码 | - | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |