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MX674AKEPI

ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, Word Access, BICMOS, PDIP28, PLASTIC, DIP-28

器件类别:模拟混合信号IC    转换器   

厂商名称:Rochester Electronics

厂商官网:https://www.rocelec.com/

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器件参数
参数名称
属性值
厂商名称
Rochester Electronics
包装说明
DIP,
Reach Compliance Code
unknow
最大模拟输入电压
10 V
最小模拟输入电压
-10 V
最长转换时间
15 µs
转换器类型
ADC, SUCCESSIVE APPROXIMATION
JESD-30 代码
R-PDIP-T28
长度
36.83 mm
最大线性误差 (EL)
0.0122%
标称负供电电压
-15 V
模拟输入通道数量
1
位数
12
功能数量
1
端子数量
28
最高工作温度
85 °C
最低工作温度
-40 °C
输出位码
BINARY, OFFSET BINARY
输出格式
PARALLEL, WORD
封装主体材料
PLASTIC/EPOXY
封装代码
DIP
封装形状
RECTANGULAR
封装形式
IN-LINE
采样并保持/跟踪并保持
SAMPLE
座面最大高度
5.08 mm
标称供电电压
15 V
表面贴装
NO
技术
BICMOS
温度等级
INDUSTRIAL
端子形式
THROUGH-HOLE
端子节距
2.54 mm
端子位置
DUAL
宽度
15.24 mm
参数对比
与MX674AKEPI相近的元器件有:MX674ASD、MX674ATQ、MX674AUD、MX674ASQ。描述及对比如下:
型号 MX674AKEPI MX674ASD MX674ATQ MX674AUD MX674ASQ
描述 ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, Word Access, BICMOS, PDIP28, PLASTIC, DIP-28 ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, Word Access, BICMOS, CDIP28, SIDEBRAZED, CERAMIC, DIP-28 ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, Word Access, BICMOS, CDIP28, CERAMIC, DIP-28 ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, Word Access, BICMOS, CDIP28, SIDEBRAZED, CERAMIC, DIP-28 ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, Word Access, BICMOS, CDIP28, CERAMIC, DIP-28
厂商名称 Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics
包装说明 DIP, DIP, DIP, DIP, DIP,
Reach Compliance Code unknow unknown unknown unknown unknown
最大模拟输入电压 10 V 10 V 10 V 10 V 10 V
最小模拟输入电压 -10 V -10 V -10 V -10 V -10 V
转换器类型 ADC, SUCCESSIVE APPROXIMATION ADC, SUCCESSIVE APPROXIMATION ADC, SUCCESSIVE APPROXIMATION ADC, SUCCESSIVE APPROXIMATION ADC, SUCCESSIVE APPROXIMATION
JESD-30 代码 R-PDIP-T28 R-CDIP-T28 R-GDIP-T28 R-CDIP-T28 R-GDIP-T28
最大线性误差 (EL) 0.0122% 0.0244% 0.0183% 0.0183% 0.0244%
标称负供电电压 -15 V -15 V -15 V -15 V -15 V
模拟输入通道数量 1 1 1 1 1
位数 12 12 12 12 12
功能数量 1 1 1 1 1
端子数量 28 28 28 28 28
最高工作温度 85 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -40 °C -55 °C -55 °C -55 °C -55 °C
输出位码 BINARY, OFFSET BINARY BINARY, OFFSET BINARY BINARY, OFFSET BINARY BINARY, OFFSET BINARY BINARY, OFFSET BINARY
输出格式 PARALLEL, WORD PARALLEL, WORD PARALLEL, WORD PARALLEL, WORD PARALLEL, WORD
封装主体材料 PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
封装代码 DIP DIP DIP DIP DIP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
采样并保持/跟踪并保持 SAMPLE SAMPLE SAMPLE SAMPLE SAMPLE
座面最大高度 5.08 mm 5.89 mm 5.89 mm 5.89 mm 5.89 mm
标称供电电压 15 V 15 V 15 V 15 V 15 V
表面贴装 NO NO NO NO NO
技术 BICMOS BICMOS BICMOS BICMOS BICMOS
温度等级 INDUSTRIAL MILITARY MILITARY MILITARY MILITARY
端子形式 THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
端子节距 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
端子位置 DUAL DUAL DUAL DUAL DUAL
宽度 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm
最长转换时间 15 µs - 15 µs 15 µs 15 µs
ECCN代码 - 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
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