Multilayer Ceramic Chip Capacitors
FEATURES
•
CLASS I DIELECTRIC, TEMPERATURE COMPENSATING
•
HIGH STABILITY OVER TIME, VOLTAGE AND
TEMPERATURE CHANGES
•
LOW DIELECTRIC LOSS
•
NICKEL BARRIER TERMINATIONS AND EXCELLENT
MECHANICAL STRENGTH
SPECIFICATIONS NPO
Capacitance Range
Capacitance Tolerance
Operating Temperature Range
Temperature Characteristics
Rated Voltages
Dissipation Factor
insulation Resistance
Dielectric Withstanding Voltage
Test Conditions (EIA-198-2E)
NMC Series NPO
Expanded
01005
Case Size
0.47pF to 0.068μF
Below 10pF: ±0.1pF(B), ± 0.25pF(C), ±0.5pF(D)
10pF and above: ±1%(F), ±2%(G), ±5% (J)
-55°C ~ +125°C
0 ± 30ppm/°C
25Vdc, 35Vdc, 50Vdc (see NMC-H Series for higher voltages)
For values >30pF 0.1% @ 25°C; For values < 30pF Q=400+20 x C (C in pF)
10,000Megohms min. or 500Megohm/μF (min.), whichever is less @ +25°C
250% of Rated Voltage for 5 ±1 seconds, 50mA maximum current
<1000pF; 1MHz, 1.2Vrms max. or >1000pF; 1KHz, 1.2Vrms max.
Typical NPO Temperature Coefficient
0.4
0.3
0.2
0.1
0.0
-0.1
-0.2
-0.3
-0.4
-55 -25
0 25
50 75 100 125
Temperature (Degrees Celsius)
0.2
0.1
0.0
-0.1
-0.2
Voltage Coefficient of
Capacitance - NPO
10,000
1000
100
10
10
Minimum Insulation Resistance
vs Temperature
0 10 20 30 40 50 60 70 80 90 100
DC Volts Applied
0.2
0.1
25
100 150
Temperature (Degrees C)
Impedance vs. Frequency NPO
1000
100
10
1
0.1
0.01
1
10
100
Frequency (MHz)
1000
1000pF
100pF
Aging Rate - NPO
0.0
-0.1
-0.2
1
10
100
Hours
1000
10000
PART NUMBER SYSTEM
NMC 0805 NPO 101 J 50 TRP or TRPLP 3K 7C3 F
Series
* - Part Number Level Identification of NPO MLCCs that do not take RoHS exemption 7C-III
RoHS Compliant
RoHS 7C-III Exemption Free*
Optional Reel Qty (3K=3,000pcs)
Tape & Reel (Embossed Plastic Carrier)
Tape & Reel (Punched carrier)
Voltage (Vdc)
Capacitance Tolerance Code (see chart)
Capacitance Code, expressed in pF,
fi
rst 2 digits are
significant, 3rd digit is no. of zeros, “R” indicates
decimal for under 10pF
Temperature Characteristic
Size Code (see chart)
®
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
Specifications are subject to change
1
Multilayer Ceramic Chip Capacitors
EIA Case Size
Length (L)
Width (W)
Thickness max. (T)
Termination Width
(P)
Capacitance
0.5pF
1.0pF
1.5pF
2.0pF
3.0pF
4.0pF
5.0pF
6.0pF
7.0pF
8.0pF
9.0pF
10pF
12pF
15pF
18pF
22pF
27pF
33pF
39pF
47pF
56pF
68pF
82pF
100pF
01005
0.4±0.02
0.2±0.02
0.22
0.1±0.03
Working Voltage (Vdc)
16
EIA Case Size
Length (L)
Width (W)
Thickness max. (T)
Termination Width
(P)
Capacitance
0.47pF ~ 22pF
24pF
27pF
30pF
33pF
36pF
39pF
43pF
47pF
51pF
56pF
62pF
68pF
75pF
82pF
91pF
100pF
110pF
120pF
130pF
150pF
160pF
180pF
200pF
220pF
240pF
270pF
300pF
330pF
360pF
390pF
430pF
470pF
510pF
560pF
620pF
680pF
750pF
820pF
910pF
0.001μF
0.0012μF
0.0015μF
0.0018μF
0.0022μF
0.0027μF
0.0033μF
0.0039μF
0.0047μF
0.0056μF
0.0068μF
0.0082μF
*1.45mm maximum thickness
®
0201
0.6±0.03
0.3±0.03
0.33
0.15±0.05
0402
1.0±0.05
0.5±0.05
0.6
0.2±0.1
NMC Series NPO
0603
1.6±0.15
0.8±0.15
1.0
0.12 ~ 0.51
0805
2.0±0.2
1.25±0.2
1.35
0.25 ~ 0.71
Working Voltage (Vdc)
10 16 25 50 16 25 50 100 16 25 50 100 16 25 50 100
W
T
P
L
P
100% Sn over Ni barrier
(CONSULT FACTORY
FOR CAPACITANCE
VALUES NOT LISTED)
*
*
*
*
*
*
*
*
*
*
*
2
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
Specifications are subject to change
Multilayer Ceramic Chip Capacitors
EIA Case Size
Length (L)
Width (W)
Thickness max. (T)
Termination Width (P)
Capacitance
0.47pF ~ 9.1pF
10pF ~ 22pF
24pF ~ 0.001μF
0.0012μF
0.0015μF
0.0018μF
0.0022μF
0.0027μF
0.0033μF
0.0039μF
0.0047μF
0.0056μF
0.0068μF
0.0075μF
0.0082μF
0.0091μF
0.01μF
0.012μF
0.015μF
0.018μF
0.022μF
0.027μF
0.033μF
0.039μF
0.047μF
0.056μF
1210
3.2±0.2
2.5±0.2
1.80
0.25 ~ 0.71
Working Voltage (Vdc)
16 25 50 100 10 16 25 50 100 10 16 25 50 100
0805
2.0±0.2
1.25±0.2
1.45
0.25 ~ 0.71
1206
3,2±0.2
1.6±0.2
1.80
0.25 ~ 0.71
NMC Series NPO
1812
4.5±0.3
3.2±0.25
1.80
0.25 ~ 0.76
25
50
100
2225
5.70±0.4
6.35±0.25
1.80
0.25 ~ 1.02
50
100
See the
previous page
*
**
**
**
**
*1.90mm maximum thickness, **2.60mm maximum thickness
See NMC High Capactiance datasheet for higher capacitance values
or NMC-H High Voltage datasheet for higher voltage ratings
®
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
Specifications are subject to change
3
Multilayer Ceramic Chip Capacitors
REEL
B
Taping Specifications
B
13 ± 0.5
C
50 min.
100 ± 1.0
100 ± 1.0
D
21 ± 1.0
T max.
8.4 +1.0/-0
(1812 case size
12.4 +2.0/-0)
REEL DIMENSIONS (mm)
Reel Diameter (A)
7” (178 ± 2.0)
10” (250 ± 2.0)
13” (330 ± 2.0)
D
7 INCH REEL QUANTITIES*
C
Size
Tape Size
Min. Qty
Per Reel
Max. Qty
Per Reel
01005
8mm
20,000
20,000
0201
8mm
20,000
20,000
0402
8mm
10,000
10,000
0603
8mm
4,000
4,000
0805
8mm
4,000
5,000
1206
8mm
4,000
5,000
1210
8mm
2,000
5,000
1812
12mm
1,000
2,000
*Quantity dependent on chip thickness. Contact NIC for reel
quantities on larger diameter reels.
T
A
CARRIER TAPE MATERIAL
Parts with a thickness of >1mm will be taped on embossed
plastic carrier. Parts with a thickness of less then 1mm
will be taped on paper carrier
EMBOSSED PLASTIC CARRIER TAPE DIMENSIONS (mm)
Tape Size
8mm
12mm
W
8.0 ± 0.2
12 ± 0.2
F
3.5 ± 0.05
5.5 ± 0.05
E
1.75 ± 0.10
P
0
4.0 ± 0.1
P
2
2.0 ± 0.5
D
1.5
+0.1-0.0
K max.
3.0
T max.
2.0
4.5
P
4.0 ± 0.1
8.0 ± 0.1
Notes:
1. Specifications are in compliance with EIA RS481-1-A
“Taping of surface Mount Components for Automatic Placement”
2. Dimensions Ao (max.) equals component width dimension plus 0.5mm
3. Dimension Bo (max.) equals component length dimension plus 0.5mm
EMBOSSED PLASTIC CARRIER TAPE
D
T
P
o
E
P
2
F
B
o
W
A
o
K
P
See notes 2 & 3 regarding dimensions
Ao and Bo
PUNCHED CARRIER TAPE DIMENSIONS (mm)
Type
A
o
B
o
W
F
E
P1
2.0 ± 0.05
8.0 ± 0.3
3.5 ± 0.05
1.75 ± 0.1
4.0 ± 0.10
01005 0.25 ± 0.04 0.45 ± 0.04
0201 0.37 ± 0.03 0.67 ± 0.05
0402 0.65 ± 0.05 1.15 ± 0.05
0603
1.1 ± 0.2
1.9 ± 0.2
0805 1.65 ± 0.2
2.4 ± 0.2
1206
2.0 ± 0.2
3.6 ± 0.2
P0
D0
T1
max.
0.27
0.45
1.1
T2
max.
0.36
0.80
1.4
Mounting
Hole
Angular
Punch
Hole
4.0 ± 0.1
1.5
+0.1/-0.0
PUNCHED CARRIER TAPE
D
t
1
P
o
E
B
o
F
W
®
t
2
A
o
Component
Pitch
P1
4
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
Specifications are subject to change
FPGA/CPLD
