Multilayer Ceramic Chip Capacitors
FEATURES
• CLASS II DIELECTRIC, TEMPERATURE STABLE
• EXCELLENT FREQUENCY CHARACTERISTICS, NON-LINEAR
CAPACITANCE CHANGE
• HIGHER CAPACITANCE THAN NPO
• NICKEL BARRIER TERMINATIONS AND EXCELLENT
MECHANICAL STRENGTH
• EIA MARKING AVAILABLE
SPECIFICATIONS X7R
Capacitance Range
Capacitance Tolerances
Operating Temperature Range
Temperature Characteristics
Rated Voltages
Dissipation Factor
Insulation Resistance
Dielectric Withstanding Voltage
Test Conditions (EIA-198-2E)
Typical X7R Temperature Coefficient
NMC Series X7R
SURFACE MOUNT
47pF to 10
µF
±5%(J), ±10%(K), ±20%(M)
-55
o
C to +125
o
C
±15%
∆
max. over temperature range (with 0 Vdc applied)
16Vdc, 25Vdc, 50Vdc, 100Vdc (see NMC-H Series for Higher Voltages)
2.5% max. (50Vdc, 100Vdc); 3.5% max. (16Vdc, 25Vdc), 5% max. (10Vdc)
@ 1.0Vrms and khz, +25
o
C
100,000 Megohms min. or 1000 ohm/F min. whichever is less @ 25°C
250% of Rated Voltage for 5 ± 1 seconds, 50 milliamps maximum
1khz, 1.0V ±0.2 Vrms
Voltage Coefficient of Capacitance - X7R
Temperature °C
Impedance vs. Frequency - X7R
% Dissipation Factor vs. Temperature
DC Volts Applied
Minimum Insulation Resistance
vs. Temperature
10000
.001uF
Insulation Resistance
(Ω Farads)
1000
0.1uF
100
10
10
25
100
125
Frequency (Mhz)
Temperature °C
Temperature °C
PART NUMBERING SYSTEM
NMC
0805
X7R
102
K 50 TRP or TRPLP
F
Lead Free Terminations
(100% Sn optional)
Tape and Reel (Embossed Plastic
Carrier), TRPLP10 = 10K pcs per reel
TRP = Tape & Reel Paper Carrier, TRP10 = 10K pcs per reel
Voltage (Vdc)
Capacitance Tolerance Code (see chart above)
Capacitance Code, expressed in pF, first 2 digits are
significant, 3rd digit is no. of zeros, “R” indicates
decimal for under 10pF
Temperature Characteristic
Size Code (see chart)
®
Series
140
NIC COMPONENTS
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www.RFpassives.com
Multilayer Ceramic Chip Capacitors
(CONSULT FACTORY
FOR CAPACITANCE
VALUES NOT LISTED)
For Values
Under 47pF
SEE NPO
X7R CAPACITOR SIZE CHART (mm)
EIA Case Size
Length
L
Width
W
Thickness (max.) T
T rmination Width P
e
Capacitance
47pF
56
68
82
100
150
220
330
470
680
820
1000
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
.01
µF
.015
.018
.022
.027
.033
.039
.047
.056
.068
.082
0.1
0.15
0.22
0201
0.6±0.03
0.3±0.03
0.3±0.03
0.15±0.05
16
25
50
10
0402
1.0±0.05
0.5±0.05
0.6
0.2±0.1
16
25
NMC Series X7R
SURFACE MOUNT
0603
1.6±0.15
0.8±0.15
1.0
.12-.51
W rking V ltage (Vdc)
o
o
50
10
16
25
50 100 16
0805
2.0±0.2
1.25±0.2
1.30
.25-.71
25
50 100
W
T (max.)
P
L
P
Termination:
Sn-Pb solder plate
finish over nickel
barrier over Cu base.
Also available with
100% Sn lead-free
plating finish.
®
NIC COMPONENTS
www.niccomp.com
www.lowESR.com
www.RFpassives.com
141
Multilayer Ceramic Chip Capacitors
SURFACE MOUNT
X7R CAPACITOR SIZE CHART (mm)
EIA Case Size
Length
L
Width
W
Thickness (max.) T
T rmination Width P
e
Capacitance
0805
2.0±0.2
1.25±0.2
1.30
.25-.71
1206
3.2±0.2
1.6±0.2
1.80
.25-.71
1210
3.2±0.2
2.5±0.2
1.80
.25-.71
W rking V ltage (Vdc)
o
o
NMC Series X7R
1812
4.5±0.3
3.2±0.25
1.80
.25-.76
2225
5.7±0.4
6.35±0.25
1.80
.25-1.02
10 16 25 50 10 16 25 50 100 10 16 25 50 100 25 50 100 25 50 100
1000pF
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
Below 0.1
µF
8200
See previous page
.01
µF
.012
.015
.018
.022
.027
.033
.039
.047
.056
.068
.082
.1
.15
.22
.33
.47
.68
1.0
1.5
2.2
3.3
4.7
6.8
10
*
Notes: * 1.90mm maximum thickness , ** 2.20mm maximum thickness
**
®
142
NIC COMPONENTS
www.niccomp.com
www.lowESR.com
www.RFpassives.com
