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NP161N04TUG-E2-AY

NP161N04TUG-E2-AY

器件类别:分立半导体    晶体管   

厂商名称:Renesas(瑞萨电子)

厂商官网:https://www.renesas.com/

器件标准:

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器件参数
参数名称
属性值
Brand Name
Renesas
是否Rohs认证
符合
厂商名称
Renesas(瑞萨电子)
零件包装代码
MP-25ZT
包装说明
SMALL OUTLINE, R-PSSO-G6
针数
7
制造商包装代码
PRSS0008DB-A7
Reach Compliance Code
compliant
ECCN代码
EAR99
Is Samacsys
N
外壳连接
DRAIN
配置
SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压
40 V
最大漏极电流 (Abs) (ID)
160 A
最大漏极电流 (ID)
160 A
最大漏源导通电阻
0.0018 Ω
FET 技术
METAL-OXIDE SEMICONDUCTOR
JESD-30 代码
R-PSSO-G6
JESD-609代码
e3
元件数量
1
端子数量
6
工作模式
ENHANCEMENT MODE
最高工作温度
175 °C
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
峰值回流温度(摄氏度)
NOT SPECIFIED
极性/信道类型
N-CHANNEL
最大功率耗散 (Abs)
250 W
最大脉冲漏极电流 (IDM)
640 A
认证状态
Not Qualified
表面贴装
YES
端子面层
MATTE TIN
端子形式
GULL WING
端子位置
SINGLE
处于峰值回流温度下的最长时间
NOT SPECIFIED
晶体管应用
SWITCHING
晶体管元件材料
SILICON
Base Number Matches
1
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To our customers,
Old Company Name in Catalogs and Other Documents
On April 1
st
, 2010, NEC Electronics Corporation merged with Renesas Technology
Corporation, and Renesas
Electronics Corporation
took over all the business of both
companies.
Therefore, although the old company name remains in this document, it is a valid
Renesas
Electronics document. We appreciate your understanding.
Renesas Electronics website: http://www.renesas.com
April 1
st
, 2010
Renesas Electronics Corporation
Issued by:
Renesas Electronics Corporation
(http://www.renesas.com)
Send any inquiries to http://www.renesas.com/inquiry.
Notice
1.
All information included in this document is current as of the date this document is issued. Such information, however, is
subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please
confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to
additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website.
Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights
of third parties by or arising from the use of Renesas Electronics products or technical information described in this document.
No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights
of Renesas Electronics or others.
You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.
Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of
semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software,
and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by
you or third parties arising from the use of these circuits, software, or information.
When exporting the products or technology described in this document, you should comply with the applicable export control
laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas
Electronics products or the technology described in this document for any purpose relating to military applications or use by
the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and
technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited
under any applicable domestic or foreign laws or regulations.
Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics
does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages
incurred by you resulting from errors in or omissions from the information included herein.
Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and
“Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as
indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular
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written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for
which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way
liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an
application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written
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expressly specified in a Renesas Electronics data sheets or data books, etc.
Computers; office equipment; communications equipment; test and measurement equipment; audio and visual
equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots.
“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-
crime systems; safety equipment; and medical equipment not specifically designed for life support.
“Specific”:
Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or
systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare
intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life.
You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics,
especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation
characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or
damages arising out of the use of Renesas Electronics products beyond such specified ranges.
Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have
specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further,
Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to
guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a
Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire
control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because
the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system
manufactured by you.
Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental
compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable
laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS
Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with
applicable laws and regulations.
This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas
Electronics.
Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this
document or Renesas Electronics products, or if you have any other inquiries.
“Standard”:
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majority-
owned subsidiaries.
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
DATA SHEET
MOS FIELD EFFECT TRANSISTOR
NP161N04TUG
SWITCHING
N-CHANNEL POWER MOS FET
DESCRIPTION
The NP161N04TUG is N-channel MOS Field Effect Transistor designed for high current switching applications.
ORDERING INFORMATION
PART NUMBER
NP161N04TUG-E1-AY
NP161N04TUG-E2-AY
Note
Note
LEAD PLATING
Pure Sn (Tin)
PACKING
Tape 800 p/reel
PACKAGE
TO-263-7pin (MP-25ZT) typ. 1.5 g
Note
Pb-free (This product does not contain Pb in the external electrode).
FEATURES
Super low on-state resistance
R
DS(on)
= 1.35 mΩ TYP. / 1.8 mΩ MAX. (V
GS
= 10 V, I
D
= 80 A)
High Current Rating
I
D(DC)
=
±160
A
ABSOLUTE MAXIMUM RATINGS (T
A
= 25°C)
Drain to Source Voltage (V
GS
= 0 V)
Gate to Source Voltage (V
DS
= 0 V)
Drain Current (DC) (T
C
= 25°C)
Drain Current (pulse)
Note1
V
DSS
V
GSS
I
D(DC)
I
D(pulse)
P
T1
P
T2
T
ch
T
stg
40
±20
±160
±640
250
1.8
175
−55
to
+175
70
650
V
V
A
A
W
W
°C
°C
A
mJ
Total Power Dissipation (T
C
= 25°C)
Total Power Dissipation (T
A
= 25°C)
Channel Temperature
Storage Temperature
Repetitive Avalanche Current
Repetitive Avalanche Energy
Note2
Note2
I
AR
E
AR
Notes 1.
PW
10
μ
s, Duty Cycle
1%
2.
T
ch
= 150°C, V
DD
= 25 V, R
G
= 25
Ω,
V
GS
= 20
0 V, L = 100
μ
H
THERMAL RESISTANCE
Channel to Case Thermal Resistance
Channel to Ambient Thermal Resistance
R
th(ch-C)
R
th(ch-A)
0.6
83.3
°C/W
°C/W
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. D19411EJ1V0DS00 (1st edition)
Date Published August 2008 NS
Printed in Japan
2008
NP161N04TUG
ELECTRICAL CHARACTERISTICS (T
A
= 25°C)
CHARACTERISTICS
Zero Gate Voltage Drain Current
Gate Leakage Current
Gate to Source Threshold Voltage
Forward Transfer Admittance
Note
Note
SYMBOL
I
DSS
I
GSS
V
GS(th)
| y
fs
|
R
DS(on)
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
Q
G
Q
GS
Q
GD
TEST CONDITIONS
V
DS
= 40 V, V
GS
= 0 V
V
GS
=
±20
V, V
DS
= 0 V
V
DS
= V
GS
, I
D
= 250
μ
A
V
DS
= 5 V, I
D
= 40 A
V
GS
= 10 V, I
D
= 80 A
V
DS
= 25 V,
V
GS
= 0 V,
f = 1 MHz
V
DD
= 20 V, I
D
= 80 A,
V
GS
= 10 V,
R
G
= 0
Ω
MIN.
TYP.
MAX.
1
±100
UNIT
μ
A
nA
V
S
2.0
35
3.0
88
1.35
13500
1200
750
50
40
110
20
4.0
Drain to Source On-state Resistance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Total Gate Charge
Gate to Source Charge
Gate to Drain Charge
Body Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Note
1.8
20250
1800
1350
110
100
220
40
345
pF
pF
pF
ns
ns
ns
ns
nC
nC
nC
V
DD
= 32 V,
V
GS
= 10 V,
I
D
= 160 A
I
F
= 160 A, V
GS
= 0 V
I
F
= 160 A, V
GS
= 0 V,
di/dt = 100 A/
μ
s
230
50
75
0.9
60
100
V
F(S-D)
t
rr
Q
rr
1.5
V
ns
nC
Note
Pulsed test
TEST CIRCUIT 1 AVALANCHE CAPABILITY
D.U.T.
R
G
= 25
Ω
PG.
V
GS
= 20
0 V
50
Ω
TEST CIRCUIT 2 SWITCHING TIME
D.U.T.
L
V
DD
PG.
R
G
R
L
V
DD
V
GS
V
GS
Wave Form
0
10%
V
GS
90%
V
DS
90%
90%
10%
10%
BV
DSS
I
AS
I
D
V
DD
V
DS
V
GS
0
τ
τ
= 1
μ
s
Duty Cycle
1%
V
DS
V
DS
Wave Form
0
t
d(on)
t
on
t
r
t
d(off)
t
off
t
f
Starting T
ch
TEST CIRCUIT 3 GATE CHARGE
D.U.T.
I
G
= 2 mA
PG.
50
Ω
R
L
V
DD
2
Data Sheet D19411EJ1V0DS
NP161N04TUG
TYPICAL CHARACTERISTICS (T
A
= 25°C)
DERATING FACTOR OF FORWARD BIAS
SAFE OPERATING AREA
120
300
TOTAL POWER DISSIPATION vs.
CASE TEMPERATURE
dT - Percentage of Rated Power - %
100
80
60
40
20
0
0
25
50
75
100
125
150
175
P
T
- Total Power Dissipation - W
250
200
150
100
50
0
0
25
50
75
100
125
150
175
T
C
- Case Temperature -
°C
FORWARD BIAS SAFE OPERATING AREA
T
C
- Case Temperature -
°C
10000
1000
I
D
- Drain Current - A
d
it e
Lim )
V
i
0
=1
I
D(pulse)
R
S
G
(V
)
( on
DS
PW
=1
i
0
0
μ
100
10
1
0.1
s
I
D(DC)
Po
w
DC
er
D
Se
co
nd
ar
y
1
i
0
1
i
m
s
i
m
s
i
is
B
si
pa
t io
ra
ke
do
n
w
Li
m
it e
d
n
Li
m
it e
d
T
C
= 25°C
Single Pulse
0.1
1
10
100
V
DS
- Drain to Source Voltage - V
TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH
1000
r
th(t)
- Transient Thermal Resistance -
°C/W
100
R
th(ch-A)
= 83.3°C/Wi
10
1
R
th(ch-C)
= 0.6°C/Wi
0.1
Single Pulse
0.01
100
μ
1m
10 m
100 m
1
10
100
1000
PW - Pulse Width - s
Data Sheet D19411EJ1V0DS
3
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参数对比
与NP161N04TUG-E2-AY相近的元器件有:NP161N04TUG-E1-AY。描述及对比如下:
型号 NP161N04TUG-E2-AY NP161N04TUG-E1-AY
描述 NP161N04TUG-E2-AY mosfet N-CH 40v 160a TO-263-7
Brand Name Renesas Renesas
是否Rohs认证 符合 符合
厂商名称 Renesas(瑞萨电子) Renesas(瑞萨电子)
零件包装代码 MP-25ZT MP-25ZT
包装说明 SMALL OUTLINE, R-PSSO-G6 SMALL OUTLINE, R-PSSO-G6
针数 7 7
制造商包装代码 PRSS0008DB-A7 PRSS0008DB-A7
Reach Compliance Code compliant compliant
ECCN代码 EAR99 EAR99
外壳连接 DRAIN DRAIN
配置 SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压 40 V 40 V
最大漏极电流 (Abs) (ID) 160 A 160 A
最大漏极电流 (ID) 160 A 160 A
最大漏源导通电阻 0.0018 Ω 0.0018 Ω
FET 技术 METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JESD-30 代码 R-PSSO-G6 R-PSSO-G6
元件数量 1 1
端子数量 6 6
工作模式 ENHANCEMENT MODE ENHANCEMENT MODE
最高工作温度 175 °C 175 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装形状 RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED
极性/信道类型 N-CHANNEL N-CHANNEL
最大功率耗散 (Abs) 250 W 250 W
最大脉冲漏极电流 (IDM) 640 A 640 A
认证状态 Not Qualified Not Qualified
表面贴装 YES YES
端子形式 GULL WING GULL WING
端子位置 SINGLE SINGLE
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED
晶体管应用 SWITCHING SWITCHING
晶体管元件材料 SILICON SILICON
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