Note 2 : Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted.
Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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2
NSVJ3910SB3
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3
NSVJ3910SB3
PACKAGE DIMENSIONS
unit : mm
CPH3
CASE 318BA
ISSUE O
*1 : Lot Indication
RECOMMENDED
SOLDERING FOOTPRINT
0.6
1.4
1 : Source
2 : Drain
3 : Gate
0.95
0.95
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4
2.4
NSVJ3910SB3
ORDERING INFORMATION
Device
NSVJ3910SB3T1G
Marking
J2
Package
CPH3
Pb-Free)
Shipping
3,000 / Tape & Reel
† For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications
ON Semiconductor and the ON logo are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States
and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of
SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf . SCILLC reserves the right to make changes without
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without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can
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