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NTB30N06G

27A, 60V, 0.042ohm, N-CHANNEL, Si, POWER, MOSFET, LEAD FREE, CASE 418B-04, D2PAK-3

器件类别:分立半导体    晶体管   

厂商名称:Rochester Electronics

厂商官网:https://www.rocelec.com/

器件标准:

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器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
符合
厂商名称
Rochester Electronics
包装说明
LEAD FREE, CASE 418B-04, D2PAK-3
针数
3
制造商包装代码
CASE 418B-04
Reach Compliance Code
unknown
雪崩能效等级(Eas)
101 mJ
外壳连接
DRAIN
配置
SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压
60 V
最大漏极电流 (ID)
27 A
最大漏源导通电阻
0.042 Ω
FET 技术
METAL-OXIDE SEMICONDUCTOR
JESD-30 代码
R-PSSO-G2
JESD-609代码
e3
湿度敏感等级
1
元件数量
1
端子数量
2
工作模式
ENHANCEMENT MODE
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
峰值回流温度(摄氏度)
260
极性/信道类型
N-CHANNEL
最大脉冲漏极电流 (IDM)
80 A
认证状态
COMMERCIAL
表面贴装
YES
端子面层
MATTE TIN
端子形式
GULL WING
端子位置
SINGLE
处于峰值回流温度下的最长时间
40
晶体管应用
SWITCHING
晶体管元件材料
SILICON
文档预览
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NTP30N06, NTB30N06
Power MOSFET
30 Amps, 60 Volts
N−Channel TO−220 and D
2
PAK
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
Features
http://onsemi.com
Pb−Free Packages are Available
Typical Applications
30 AMPERES, 60 VOLTS
R
DS(on)
= 42 mW
D
N−Channel
Power Supplies
Converters
Power Motor Controls
Bridge Circuits
G
S
4
Value
60
60
"20
"30
27
15
80
88.2
0.59
−55 to
+175
101
Adc
Apk
W
W/°C
°C
mJ
NTx30N06G
AYWW
R
qJC
T
L
1.7
260
°C/W
°C
1
Gate
2
Drain
NTx30N06
x
A
Y
WW
G
= Device Code
= B or P
= Assembly Location
= Year
= Work Week
= Pb−Free Package
3
Source
1
Gate
Unit
Vdc
Vdc
Vdc
V
GS
V
GS
I
D
I
D
I
DM
P
D
T
J
, T
stg
E
AS
1
TO−220AB
CASE 221A
STYLE 5
2
3
1
2
3
D
2
PAK
CASE 418B
STYLE 2
4
MAXIMUM RATINGS
(T
J
= 25°C unless otherwise noted)
Rating
Drain−to−Source Voltage
Drain−to−Gate Voltage (R
GS
= 10 MW)
Gate−to−Source Voltage
− Continuous
− Non−Repetitive (t
p
v10
ms)
Drain Current
− Continuous @ T
A
= 25°C
− Continuous @ T
A
= 100°C
− Single Pulse (t
p
v10
ms)
Total Power Dissipation @ T
A
= 25°C
Derate above 25°C
Operating and Storage Temperature Range
Single Pulse Drain−to−Source Avalanche
Energy − Starting T
J
= 25°C
(V
DD
= 50 Vdc, V
GS
= 10 Vdc, L = 0.3 mH
I
L(pk)
= 26 A, V
DS
= 60 Vdc)
Thermal Resistance, Junction−to−Case
Maximum Lead Temperature for Soldering
Purposes, 1/8 in from case for 10 seconds
Symbol
V
DSS
V
DGR
MARKING DIAGRAMS
& PIN ASSIGNMENTS
4
Drain
4
Drain
NTx
30N06G
AYWW
2
Drain
3
Source
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
©
Semiconductor Components Industries, LLC, 2005
1
August, 2005 − Rev. 1
Publication Order Number:
NTP30N06/D
NTP30N06, NTB30N06
ELECTRICAL CHARACTERISTICS
(T
J
= 25°C unless otherwise noted)
Characteristic
OFF CHARACTERISTICS
Drain−to−Source Breakdown Voltage (Note 1)
(V
GS
= 0 Vdc, I
D
= 250
mAdc)
Temperature Coefficient (Positive)
Zero Gate Voltage Drain Current
(V
DS
= 60 Vdc, V
GS
= 0 Vdc)
(V
DS
= 60 Vdc, V
GS
= 0 Vdc, T
J
= 150°C)
Gate−Body Leakage Current (V
GS
=
±
20 Vdc, V
DS
= 0 Vdc)
ON CHARACTERISTICS
(Note 1)
Gate Threshold Voltage (Note 1)
(V
DS
= V
GS
, I
D
= 250
mAdc)
Threshold Temperature Coefficient (Negative)
Static Drain−to−Source On−Resistance (Note 1)
(V
GS
= 10 Vdc, I
D
= 15 Adc)
Static Drain−to−Source On−Voltage (Note 1)
(V
GS
= 10 Vdc, I
D
= 30 Adc)
(V
GS
= 10 Vdc, I
D
= 15 Adc, T
J
= 150°C)
Forward Transconductance (Note 1) (V
DS
= 7.0 Vdc, I
D
= 15 Adc)
DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance
Transfer Capacitance
SWITCHING CHARACTERISTICS
(Note 2)
Turn−On Delay Time
Rise Time
Turn−Off Delay Time
Fall Time
Gate Charge
(V
DS
= 48 Vdc, I
D
= 30 Adc,
V
GS
= 10 Vdc) (Note 1)
SOURCE−DRAIN DIODE CHARACTERISTICS
Forward On−Voltage
Reverse Recovery Time
(I
S
= 30 Adc, V
GS
= 0 Vdc,
dI
S
/dt = 100 A/ms) (Note 1)
Reverse Recovery Stored Charge
1. Pulse Test: Pulse Width
300
ms,
Duty Cycle
2%.
2. Switching characteristics are independent of operating junction temperatures.
(I
S
= 30 Adc, V
GS
= 0 Vdc) (Note 1)
(I
S
= 30 Adc, V
GS
= 0 Vdc, T
J
= 150°C)
V
SD
t
rr
t
a
t
b
Q
RR
1.03
1.05
52
38
15
0.094
1.15
mC
Vdc
ns
(V
DD
= 30 Vdc, I
D
= 30 Adc,
V
GS
= 10 Vdc, R
G
= 9.1
W)
(Note 1)
t
d(on)
t
r
t
d(off)
t
f
Q
T
Q
1
Q
2
11
36
24
31
23.4
5.1
11
25
80
50
60
46
nC
ns
(V
DS
= 25 Vdc, V
GS
= 0 Vdc,
f = 1.0 MHz)
C
iss
C
oss
C
rss
850
250
68
1200
350
100
pF
V
GS(th)
2.0
R
DS(on)
V
DS(on)
g
FS
1.1
0.98
16
1.5
mhos
35
42
Vdc
3.05
7.3
4.0
Vdc
mV/°C
mW
V
(BR)DSS
60
I
DSS
I
GSS
1.0
10
±100
nAdc
71.1
70
Vdc
mV/°C
mAdc
Symbol
Min
Typ
Max
Unit
http://onsemi.com
2
NTP30N06, NTB30N06
60
V
GS
= 10 V
I
D
, DRAIN CURRENT (AMPS)
50
40
30
20
10
0
0
1
2
3
4
5
V
DS
, DRAIN−TO−SOURCE VOLTAGE (VOLTS)
6
9V
7V
6.5 V
6V
5.5 V
5V
4.5 V
0
2
I
D
, DRAIN CURRENT (AMPS)
8V
60
50
40
30
20
10
T
J
= 100°C
T
J
= −55°C
10
V
DS
10 V
T
J
= 25°C
4
8
6
V
GS
, GATE−TO−SOURCE VOLTAGE (VOLTS)
Figure 1. On−Region Characteristics
R
DS(on)
, DRAIN−TO−SOURCE RESISTANCE (W)
R
DS(on)
, DRAIN−TO−SOURCE RESISTANCE (W)
Figure 2. Transfer Characteristics
0.09
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0
0
10
20
30
40
50
60
T
J
= 25°C
T
J
= −55°C
T
J
= 100°C
V
GS
= 10 V
0.09
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0
0
10
20
T
J
= −55°C
T
J
= 100°C
T
J
= 25°C
V
GS
= 15 V
30
40
50
60
I
D
, DRAIN CURRENT (AMPS)
I
D
, DRAIN CURRENT (AMPS)
Figure 3. On−Resistance versus
Gate−to−Source Voltage
R
DS(on)
, DRAIN−TO−SOURCE RESISTANCE
(NORMALIZED)
2.2
2
1.8
1.6
1.4
1.2
1
0.8
0.6
−50 −25
1
0
25
50
75
100
125
150
175
0
I
D
= 15 A
V
GS
= 10 V
10000
Figure 4. On−Resistance versus Drain Current
and Gate Voltage
V
GS
= 0 V
I
DSS
, LEAKAGE (nA)
1000
T
J
= 150°C
100
10
T
J
= 100°C
10
20
30
40
50
60
T
J
, JUNCTION TEMPERATURE (°C)
V
DS
, DRAIN−TO−SOURCE VOLTAGE (VOLTS)
Figure 5. On−Resistance Variation with
Temperature
Figure 6. Drain−to−Source Leakage Current
versus Voltage
http://onsemi.com
3
NTP30N06, NTB30N06
V
GS
, GATE−TO−SOURCE VOLTAGE (VOLTS)
2400
2000
C, CAPACITANCE (pF)
1600
1200
V
DS
= 0 V
V
GS
= 0 V
12
10
8
Q
1
6
4
2
0
0
I
D
= 30 A
T
J
= 25°C
4
8
12
16
20
24
Q
2
Q
T
V
GS
T
J
= 25°C
C
iss
C
rss
800
400
0
10
C
iss
C
oss
C
rss
5 V
GS
0 V
DS
5
10
15
20
25
GATE−TO−SOURCE OR DRAIN−TO−SOURCE VOLTAGE
(VOLTS)
Q
g
, TOTAL GATE CHARGE (nC)
Figure 7. Capacitance Variation
1000
I
S
, SOURCE CURRENT (AMPS)
V
DS
= 30 V
I
D
= 30 A
V
GS
= 10 V
t, TIME (ns)
100
t
r
t
d(off)
10
t
d(on)
t
f
32
Figure 8. Gate−to−Source and
Drain−to−Source Voltage versus Total Charge
V
GS
= 0 V
T
J
= 25°C
24
16
8
1
1
10
R
G
, GATE RESISTANCE (W)
100
0
0.6
0.68
0.76
0.84
0.92
1
1.08
1.16
V
SD
, SOURCE−TO−DRAIN VOLTAGE (VOLTS)
Figure 9. Resistive Switching Time Variation
versus Gate Resistance
1000
I
D
, DRAIN CURRENT (AMPS)
V
GS
= 20 V
SINGLE PULSE
T
C
= 25°C
E
AS
, SINGLE PULSE DRAIN−TO−SOURCE
AVALANCHE ENERGY (mJ)
120
Figure 10. Diode Forward Voltage versus
Current
I
D
= 26 A
100
80
60
40
20
0
100
10
10 ms
1 ms
100
ms
10
ms
R
DS(on)
Limit
Thermal Limit
Package Limit
dc
1
0.1
0.1
1
10
100
25
50
75
100
125
150
175
V
DS
, DRAIN−TO−SOURCE VOLTAGE (VOLTS)
T
J
, STARTING JUNCTION TEMPERATURE (°C)
Figure 11. Maximum Rated Forward Biased
Safe Operating Area
Figure 12. Maximum Avalanche Energy versus
Starting Junction Temperature
http://onsemi.com
4
查看更多>
参数对比
与NTB30N06G相近的元器件有:NTP30N06、NTB30N06、NTB30N06T4。描述及对比如下:
型号 NTB30N06G NTP30N06 NTB30N06 NTB30N06T4
描述 27A, 60V, 0.042ohm, N-CHANNEL, Si, POWER, MOSFET, LEAD FREE, CASE 418B-04, D2PAK-3 27A, 60V, 0.042ohm, N-CHANNEL, Si, POWER, MOSFET, TO-220AB, CASE 221A-09, 3 PIN 27A, 60V, 0.042ohm, N-CHANNEL, Si, POWER, MOSFET, CASE 418B-04, D2PAK-3 27A, 60V, 0.042ohm, N-CHANNEL, Si, POWER, MOSFET, CASE 418B-04, D2PAK-3
是否无铅 含铅 含铅 含铅 含铅
是否Rohs认证 符合 不符合 不符合 不符合
厂商名称 Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics
包装说明 LEAD FREE, CASE 418B-04, D2PAK-3 CASE 221A-09, 3 PIN CASE 418B-04, D2PAK-3 CASE 418B-04, D2PAK-3
针数 3 3 3 3
制造商包装代码 CASE 418B-04 CASE 221A-09 CASE 418B-04 CASE 418B-04
Reach Compliance Code unknown unknown unknown unknown
雪崩能效等级(Eas) 101 mJ 101 mJ 101 mJ 101 mJ
外壳连接 DRAIN DRAIN DRAIN DRAIN
配置 SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压 60 V 60 V 60 V 60 V
最大漏极电流 (ID) 27 A 27 A 27 A 27 A
最大漏源导通电阻 0.042 Ω 0.042 Ω 0.042 Ω 0.042 Ω
FET 技术 METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JESD-30 代码 R-PSSO-G2 R-PSFM-T3 R-PSSO-G2 R-PSSO-G2
JESD-609代码 e3 e0 e0 e0
元件数量 1 1 1 1
端子数量 2 3 2 2
工作模式 ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE FLANGE MOUNT SMALL OUTLINE SMALL OUTLINE
峰值回流温度(摄氏度) 260 NOT SPECIFIED 235 235
极性/信道类型 N-CHANNEL N-CHANNEL N-CHANNEL N-CHANNEL
最大脉冲漏极电流 (IDM) 80 A 80 A 80 A 80 A
认证状态 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
表面贴装 YES NO YES YES
端子面层 MATTE TIN TIN LEAD TIN LEAD TIN LEAD
端子形式 GULL WING THROUGH-HOLE GULL WING GULL WING
端子位置 SINGLE SINGLE SINGLE SINGLE
处于峰值回流温度下的最长时间 40 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
晶体管应用 SWITCHING SWITCHING SWITCHING SWITCHING
晶体管元件材料 SILICON SILICON SILICON SILICON
湿度敏感等级 1 - 1 1
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