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ON5088

TRANSISTOR C BAND, SiGe, NPN, RF SMALL SIGNAL TRANSISTOR, PLASTIC PACKAGE-4, BIP RF Small Signal

器件类别:分立半导体    晶体管   

厂商名称:NXP(恩智浦)

厂商官网:https://www.nxp.com

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
NXP(恩智浦)
包装说明
SMALL OUTLINE, R-PDSO-F4
针数
4
Reach Compliance Code
compliant
ECCN代码
EAR99
其他特性
LOW NOISE
最大集电极电流 (IC)
0.04 A
集电极-发射极最大电压
2.8 V
配置
SINGLE
最小直流电流增益 (hFE)
160
最高频带
C BAND
JESD-30 代码
R-PDSO-F4
JESD-609代码
e3
元件数量
1
端子数量
4
最高工作温度
150 °C
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
峰值回流温度(摄氏度)
NOT SPECIFIED
极性/信道类型
NPN
最大功率耗散 (Abs)
0.136 W
认证状态
Not Qualified
表面贴装
YES
端子面层
Tin (Sn)
端子形式
FLAT
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
晶体管应用
AMPLIFIER
晶体管元件材料
SILICON GERMANIUM
标称过渡频率 (fT)
55000 MHz
文档预览
ON5088
NPN wideband silicon germanium RF transistor
Rev. 3 — 12 December 2012
Product data sheet
1. Product profile
1.1 General description
NPN silicon germanium microwave transistor for high speed, low noise applications in a
plastic, 4-pin dual-emitter SOT343F package.
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling
electrostatic sensitive devices.
Such precautions are described in the
ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A
or
equivalent standards.
1.2 Features and benefits
Low noise high gain microwave transistor
High maximum stable gain 27 dB at 1.8 GHz
110 GHz f
T
silicon germanium technology
1.3 Applications
2nd and 3rd LNA stage in DBS LNBs
Satellite radio
Low noise amplifiers for microwave communications systems
WLAN and WiMAX applications
Analog/digital cordless applications
1.4 Quick reference data
Table 1.
V
CB
V
CE
V
EB
I
C
P
tot
h
FE
C
CBS
Quick reference data
Conditions
open emitter
open base
shorted base
emitter-base voltage
collector current
total power dissipation
DC current gain
collector-base
capacitance
T
sp
90
C
I
C
= 10 mA; V
CE
= 2 V;
T
j
= 25
C
V
CB
= 2 V; f = 1 MHz
[1]
Symbol Parameter
collector-base voltage
collector-emitter voltage
Min
-
-
-
-
-
-
160
-
Typ
-
-
-
-
25
-
280
70
Max
10
3.0
10
1.0
40
136
400
-
Unit
V
V
V
V
mA
mW
open collector
fF
NXP Semiconductors
ON5088
NPN wideband silicon germanium RF transistor
Quick reference data
…continued
Conditions
I
C
= 25 mA; V
CE
= 2 V;
f = 2 GHz; T
amb
= 25
C
I
C
= 25 mA; V
CE
= 2 V;
f = 12 GHz; T
amb
= 25
C
I
C
= 5 mA; V
CE
= 2 V;
f = 12 GHz;
S
=
opt
;
T
amb
= 25
C
[2]
Table 1.
f
T
G
p(max)
NF
Symbol Parameter
transition frequency
maximum power gain
noise figure
Min
-
-
-
Typ
55
13
1.1
Max
-
-
-
Unit
GHz
dB
dB
[1]
[2]
T
sp
is the temperature at the solder point of the emitter lead.
G
p(max)
is the maximum power gain, if K > 1. If K < 1 then G
p(max)
= Maximum Stable Gain (MSG).
2. Pinning information
Table 2.
Pin
1
2
3
4
Discrete pinning
Description
emitter
base
emitter
collector
1, 3
2
1
mbb159
Simplified outline
3
4
Graphic symbol
4
2
3. Ordering information
Table 3.
Ordering information
Package
Name
ON5088
-
Description
plastic surface-mounted flat pack package; reverse
pinning; 4 leads
Version
SOT343F
Type number
4. Marking
Table 4.
ON5088
Marking
Marking
*6N
Description
* = p : made in Hong Kong
* = t : made in Malaysia
* = W : made in China
Type number
ON5088
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 12 December 2012
2 of 9
NXP Semiconductors
ON5088
NPN wideband silicon germanium RF transistor
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
CB
V
CE
V
EB
I
C
P
tot
T
stg
T
j
[1]
Parameter
collector-base voltage
collector-emitter voltage
emitter-base voltage
collector current
total power dissipation
storage temperature
junction temperature
Conditions
open emitter
open base
shorted base
open collector
T
sp
90
C
[1]
Min
-
-
-
-
-
-
65
-
Max
10
3.0
10
1.0
40
136
+150
150
Unit
V
V
V
V
mA
mW
C
C
T
sp
is the temperature at the solder point of the emitter lead.
6. Thermal characteristics
Table 6.
Symbol
R
th(j-sp)
Thermal characteristics
Parameter
thermal resistance from junction to solder point
Conditions
Typ
440
Unit
K/W
7. Characteristics
Table 7.
Characteristics
T
j
= 25
C unless otherwise specified.
Symbol Parameter
V
(BR)CBO
collector-base breakdown
voltage
V
(BR)CEO
collector-emitter breakdown
voltage
I
C
I
CBO
h
FE
C
CES
C
EBS
C
CBS
f
T
G
p(max)
collector current
collector-base cut-off current
DC current gain
collector-emitter capacitance
emitter-base capacitance
collector-base capacitance
transition frequency
maximum power gain
I
E
= 0 mA; V
CB
= 4.5 V
I
C
= 10 mA; V
CE
= 2 V
V
CB
= 2 V; f = 1 MHz
V
EB
= 0.5 V; f = 1 MHz
V
CB
= 2 V; f = 1 MHz
I
C
= 25 mA; V
CE
= 2 V; f = 2 GHz; T
amb
= 25
C
I
C
= 25 mA; V
CE
= 2 V; T
amb
= 25
C
f = 1.8 GHz
f = 12 GHz
s
21
2
insertion power gain
I
C
= 25 mA; V
CE
= 2 V; T
amb
= 25
C
f = 1.8 GHz
f = 12 GHz
-
-
25.4 -
9.3
-
dB
dB
[1]
Conditions
I
C
= 2.5
A;
I
E
= 0 mA
I
C
= 1 mA; I
B
= 0 mA
Min Typ Max Unit
10
3.0
-
-
-
-
-
-
-
-
-
-
25
-
268
400
70
55
27
13
-
-
40
400
-
-
-
-
-
-
fF
fF
fF
GHz
dB
dB
V
V
mA
100 nA
160 280
ON5088
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 12 December 2012
3 of 9
NXP Semiconductors
ON5088
NPN wideband silicon germanium RF transistor
Table 7.
Characteristics
…continued
T
j
= 25
C unless otherwise specified.
Symbol Parameter
NF
noise figure
Conditions
I
C
= 5 mA; V
CE
= 2 V;
S
=
opt
; T
amb
= 25
C
f = 1.8 GHz
f = 12 GHz
G
ass
associated gain
I
C
= 5 mA; V
CE
= 2 V;
S
=
opt
; T
amb
= 25
C
f = 1.8 GHz
f = 12 GHz
P
L(1dB)
IP3
output power at 1 dB gain
compression
third-order intercept point
I
C
= 25 mA; V
CE
= 2 V; Z
S
= Z
L
= 50
;
T
amb
= 25
C;
f = 1.8 GHz
I
C
= 25 mA; V
CE
= 2 V; Z
S
= Z
L
= 50
;
T
amb
= 25
C;
f
2
= f
1
+ 1 MHz; f
1
= 1.8 GHz
-
-
-
-
22
10
9
17
-
-
-
-
dB
dB
dBm
dBm
-
-
0.43 -
1.1
-
dB
dB
Min Typ Max Unit
[1]
G
p(max)
is the maximum power gain, if K > 1. If K < 1 then G
p(max)
= MSG.
ON5088
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 12 December 2012
4 of 9
NXP Semiconductors
ON5088
NPN wideband silicon germanium RF transistor
8. Package outline
Plastic surface-mounted flat pack package; reverse pinning; 4 leads
SOT343F
D
A
E
y
H
E
X
e
3
4
A
c
L
p
w
M
2
1
w
M
A
b
p
e
1
b
1
A
detail X
0
1
scale
2 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A
max
0.75
0.65
b
p
0.4
0.3
b
1
0.7
0.5
c
0.25
0.10
D
2.2
1.8
E
1.35
1.15
e
1.3
e
1
1.15
H
E
2.2
2.0
L
p
0.48
0.38
w
0.2
y
0.1
OUTLINE
VERSION
SOT343F
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
05-07-12
06-03-16
Fig 1.
ON5088
Package outline SOT343F
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 12 December 2012
5 of 9
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