型号
- 型号
- 关键词
| 型号 | ONET1101LRGETG4 | ONET1101LRGET | ONET1101LRGER |
|---|---|---|---|
| 描述 | 11.3 Gbps Laser Diode Driver 24-VQFN -25 to 100 | 11.3 Gbps Laser Diode Driver 24-VQFN -25 to 100 | 11.3 Gbps Laser Diode Driver 24-VQFN -25 to 100 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | QFN | QFN | QFN |
| 包装说明 | HVQCCN, LCC24,.16SQ,20 | VQFN-24 | VQFN-24 |
| 针数 | 24 | 24 | 24 |
| Reach Compliance Code | compli | compliant | compliant |
| Factory Lead Time | 6 weeks | 6 weeks | 6 weeks |
| Is Samacsys | - | N | N |
| 应用程序 | - | SONET;SDH | SONET;SDH |
| JESD-30 代码 | - | S-PQCC-N24 | S-PQCC-N24 |
| JESD-609代码 | - | e4 | e4 |
| 长度 | - | 4 mm | 4 mm |
| 湿度敏感等级 | - | 2 | 2 |
| 功能数量 | - | 1 | 1 |
| 端子数量 | - | 24 | 24 |
| 最高工作温度 | - | 100 °C | 100 °C |
| 最低工作温度 | - | -25 °C | -25 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | HVQCCN | HVQCCN |
| 封装等效代码 | - | LCC24,.16SQ,20 | LCC24,.16SQ,20 |
| 封装形状 | - | SQUARE | SQUARE |
| 封装形式 | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | - | 260 | 260 |
| 认证状态 | - | Not Qualified | Not Qualified |
| 座面最大高度 | - | 1 mm | 1 mm |
| 最大压摆率 | - | 118 mA | 118 mA |
| 标称供电电压 | - | 3.3 V | 3.3 V |
| 表面贴装 | - | YES | YES |
| 电信集成电路类型 | - | ATM/SONET/SDH SUPPORT CIRCUIT | ATM/SONET/SDH SUPPORT CIRCUIT |
| 温度等级 | - | OTHER | OTHER |
| 端子面层 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | - | NO LEAD | NO LEAD |
| 端子节距 | - | 0.5 mm | 0.5 mm |
| 端子位置 | - | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | 4 mm | 4 mm |
| Base Number Matches | - | 1 | 1 |
