型号
- 型号
- 关键词
IC 8 I/O, PIA-GENERAL PURPOSE, PDIP16, 0.300 INCH, LEAD FREE, PLASTIC, SOT-38-4, DIP-16, Parallel IO Port
器件类别：嵌入式处理器和控制器 微控制器和处理器
厂商名称：NXP(恩智浦)
厂商官网：https://www.nxp.com
器件标准：
| 型号 | PCF8574APN | PCF8574ATD-T | PCF8574PN | PCF8574TDK-T | PCF8574TD-T | PCF8574ATDK-T |
|---|---|---|---|---|---|---|
| 描述 | IC 8 I/O, PIA-GENERAL PURPOSE, PDIP16, 0.300 INCH, LEAD FREE, PLASTIC, SOT-38-4, DIP-16, Parallel IO Port | IC 8 I/O, PIA-GENERAL PURPOSE, PDSO16, 7.50 MM, LEAD FREE, PLASTIC, MS-013, SOT-162-1, SO-16, Parallel IO Port | IC 8 I/O, PIA-GENERAL PURPOSE, PDIP16, 0.300 INCH, LEAD FREE, PLASTIC, SOT-38-4, DIP-16, Parallel IO Port | IC 8 I/O, PIA-GENERAL PURPOSE, PDSO20, 4.40 MM, PLASTIC, MO-152, SOT-266-1, SSOP-20, Parallel IO Port | IC 8 I/O, PIA-GENERAL PURPOSE, PDSO16, 7.50 MM, LEAD FREE, PLASTIC, MS-013, SOT-162-1, SO-16, Parallel IO Port | IC IC,I/O PORT,8-BIT,CMOS,SSOP,20PIN,PLASTIC, Parallel IO Port |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 包装说明 | DIP, | SOP, | DIP, DIP16,.3 | LSSOP, | SOP, | SSOP, SSOP20,.25 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-PDIP-T16 | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G20 | R-PDSO-G16 | R-PDSO-G20 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e3 |
| 端子数量 | 16 | 16 | 16 | 20 | 16 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | DIP | LSSOP | SOP | SSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | YES | NO | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | MATTE TIN |
| 端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 0.65 mm | 1.27 mm | 0.635 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Source Url Status Check Date | 2013-06-14 00:00:00 | - | 2013-06-14 00:00:00 | 2013-06-14 00:00:00 | - | 2013-06-14 00:00:00 |
| 零件包装代码 | DIP | SOIC | DIP | SSOP | SOIC | - |
| 针数 | 16 | 16 | 16 | 20 | 16 | - |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - |
| 最大时钟频率 | 0.1 MHz | 0.1 MHz | 0.1 MHz | - | 0.1 MHz | - |
| 外部数据总线宽度 | 1 | 1 | 1 | - | 1 | - |
| 长度 | 19.025 mm | 10.3 mm | 19.025 mm | 6.5 mm | 10.3 mm | - |
| I/O 线路数量 | 8 | 8 | 8 | 8 | 8 | - |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | - |
| 峰值回流温度（摄氏度） | 245 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | 225 |
| 座面最大高度 | 4.2 mm | 2.65 mm | 4.2 mm | 1.5 mm | 2.65 mm | - |
| 最大压摆率 | 0.1 mA | 0.1 mA | 0.1 mA | - | 0.1 mA | - |
| 最大供电电压 | 6 V | 6 V | 6 V | 6 V | 6 V | - |
| 最小供电电压 | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | - |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| 处于峰值回流温度下的最长时间 | 40 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 7.5 mm | 7.62 mm | 4.4 mm | 7.5 mm | - |
| uPs/uCs/外围集成电路类型 | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE | - |
Linux与安卓
ARM技术
微控制器 MCU
嵌入式系统
WindowsCE
微控制器 MCU