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PDTA114T series
PNP resistor-equipped transistors; R1 = 10 kΩ, R2 = open
Rev. 07 — 20 April 2007
Product data sheet
1. Product profile
1.1 General description
PNP Resistor-Equipped Transistors (RET) family in small plastic packages.
Table 1.
Product overview
Package
NXP
PDTA114TE
PDTA114TK
PDTA114TM
PDTA114TS
[1]
PDTA114TT
PDTA114TU
[1]
Type number
NPN complement
JEITA
SC-75
SC-59A
SC-101
SC-43A
-
SC-70
JEDEC
-
TO-236
-
TO-92
TO-236AB
-
PDTC114TE
PDTC114TK
PDTC114TM
PDTC114TS
PDTC114TT
PDTC114TU
SOT416
SOT346
SOT883
SOT54
SOT23
SOT323
Also available in SOT54A and SOT54 variant packages (see
Section 2).
1.2 Features
I
100 mA output current capability
I
Built-in bias resistors
I
Simplifies circuit design
I
Reduces component count
I
Reduces pick and place costs
1.3 Applications
I
Digital applications
I
Control of IC inputs
I
Cost-saving alternative to BC857 series
in digital applications
I
Low current peripheral driver
1.4 Quick reference data
Table 2.
Symbol
V
CEO
I
O
R1
Quick reference data
Parameter
collector-emitter voltage
output current
bias resistor 1 (input)
Conditions
open base
Min
-
-
7
Typ
-
-
10
Max
−50
−100
13
Unit
V
mA
kΩ
NXP Semiconductors
PDTA114T series
PNP resistor-equipped transistors; R1 = 10 kΩ, R2 = open
2. Pinning information
Table 3.
Pin
SOT54
1
2
3
input (base)
output (collector)
GND (emitter)
1
2
3
001aab347
006aaa217
R1
Pinning
Description
Simplified outline
Symbol
2
1
3
SOT54A
1
2
3
input (base)
output (collector)
GND (emitter)
1
2
3
001aab348
006aaa217
R1
2
1
3
SOT54 variant
1
2
3
input (base)
output (collector)
GND (emitter)
1
2
3
001aab447
006aaa217
R1
2
1
3
SOT23; SOT323; SOT346; SOT416
1
2
3
input (base)
GND (emitter)
output (collector)
1
1
2
006aaa144
sym009
3
R1
3
2
SOT883
1
2
3
input (base)
GND (emitter)
output (collector)
1
3
2
Transparent
top view
1
R1
3
2
sym009
PDTA114T_SER_7
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 07 — 20 April 2007
2 of 11
NXP Semiconductors
PDTA114T series
PNP resistor-equipped transistors; R1 = 10 kΩ, R2 = open
3. Ordering information
Table 4.
Ordering information
Package
Name
PDTA114TE
PDTA114TK
PDTA114TM
PDTA114TS
[1]
PDTA114TT
PDTA114TU
[1]
Type number
Description
plastic surface-mounted package; 3 leads
plastic surface-mounted package; 3 leads
Version
SOT416
SOT346
SC-75
SC-59A
SC-101
SC-43A
-
SC-70
leadless ultra small plastic package; 3 solder lands; SOT883
body 1.0
×
0.6
×
0.5 mm
plastic single-ended leaded (through hole) package; SOT54
3 leads
plastic surface-mounted package; 3 leads
plastic surface-mounted package; 3 leads
SOT23
SOT323
Also available in SOT54A and SOT54 variant packages (see
Section 2
and
Section 9).
4. Marking
Table 5.
Marking codes
Marking code
[1]
11
23
DE
TA114T
*11
*23
Type number
PDTA114TE
PDTA114TK
PDTA114TM
PDTA114TS
PDTA114TT
PDTA114TU
[1]
* = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
PDTA114T_SER_7
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 07 — 20 April 2007
3 of 11
NXP Semiconductors
PDTA114T series
PNP resistor-equipped transistors; R1 = 10 kΩ, R2 = open
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
CBO
V
CEO
V
EBO
I
O
I
CM
P
tot
Parameter
collector-base voltage
collector-emitter voltage
emitter-base voltage
output current
peak collector current
total power dissipation
PDTA114TE
PDTA114TK
PDTA114TM
PDTA114TS
PDTA114TT
PDTA114TU
T
j
T
amb
T
stg
[1]
[2]
[3]
Conditions
open emitter
open base
open collector
single pulse;
t
p
≤
1 ms
T
amb
≤
25
°C
[1]
[1]
[2][3]
[1]
[1]
[1]
Min
-
-
-
-
-
Max
−50
−50
−5
−100
−100
Unit
V
V
V
mA
mA
-
-
-
-
-
-
-
−65
−65
150
250
250
500
250
200
150
+150
+150
mW
mW
mW
mW
mW
mW
°C
°C
°C
junction temperature
ambient temperature
storage temperature
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Reflow soldering is the only recommended soldering method.
Device mounted on an FR4 PCB with 60
µm
copper strip line, standard footprint.
6. Thermal characteristics
Table 7.
Symbol
R
th(j-a)
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
PDTA114TE
PDTA114TK
PDTA114TM
PDTA114TS
PDTA114TT
PDTA114TU
[1]
[2]
[3]
Conditions
in free air
[1]
[1]
[2][3]
[1]
[1]
[1]
Min
Typ
Max
Unit
-
-
-
-
-
-
-
-
-
-
-
-
833
500
500
250
500
625
K/W
K/W
K/W
K/W
K/W
K/W
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Reflow soldering is the only recommended soldering method.
Device mounted on an FR4 PCB with 60
µm
copper strip line, standard footprint.
PDTA114T_SER_7
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 07 — 20 April 2007
4 of 11
