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PMP5501V; PMP5501G;
PMP5501Y
PNP/PNP matched double transistors
Rev. 03 — 28 August 2009
Product data sheet
1. Product profile
1.1 General description
PNP/PNP matched double transistors in small Surface-Mounted Device (SMD) plastic
packages. The transistors in the SOT666 and SOT363 (SC-88) packages are fully isolated
internally.
Table 1.
Product overview
Package
NXP
PMP5501V
PMP5501G
PMP5501Y
SOT666
SOT353
SOT363
JEITA
-
SC-88A
SC-88
PNP/PNP h
FE1
/h
FE2
0.98 complement
PMP5201V
PMP5201G
PMP5201Y
NPN/NPN
complement
PMP4501V
PMP4501G
PMP4501Y
Type number
1.2 Features
I
I
I
I
Current gain matching
Base-emitter voltage matching
Common emitter configuration for SOT353 types
Application-optimized pinout
1.3 Applications
I
Current mirror
I
Differential amplifier
1.4 Quick reference data
Table 2.
Symbol
V
CEO
I
C
h
FE
Quick reference data
Parameter
collector-emitter voltage
collector current
DC current gain
V
CE
=
−5
V;
I
C
=
−2
mA
Conditions
open base
Min
-
-
200
Typ
-
-
290
Max
−45
−100
450
Unit
V
mA
Per transistor
NXP Semiconductors
PMP5501V; PMP5501G; PMP5501Y
PNP/PNP matched double transistors
Quick reference data
…continued
Parameter
h
FE
matching
V
BE
matching
Conditions
V
CE
=
−5
V;
I
C
=
−2
mA
V
CE
=
−5
V;
I
C
=
−2
mA
[1]
Table 2.
Symbol
Per device
h
FE1
/h
FE2
V
BE1
−V
BE2
Min
0.95
-
Typ
1
-
Max
-
2
Unit
[2]
mV
[1]
[2]
The smaller of the two values is taken as the numerator.
The smaller of the two values is subtracted from the larger value.
2. Pinning information
Table 3.
Pin
1
2
3
4
5
6
SOT353
1
2
3
4
5
base TR1
emitter TR1, TR2
base TR2
collector TR2
collector TR1
1
2
3
1
2
3
006aaa551
Pinning
Description
base TR1
base TR2
collector TR2
emitter TR2
emitter TR1
collector TR1
1
1
2
3
001aab555
Simplified outline
Symbol
SOT666; SOT363
6
5
4
6
TR1
TR2
5
4
2
3
006aaa550
5
4
5
4
TR1 TR2
3. Ordering information
Table 4.
Ordering information
Package
Name
PMP5501V
PMP5501G
PMP5501Y
-
SC-88A
SC-88
Description
plastic surface-mounted package; 6 leads
plastic surface-mounted package; 5 leads
plastic surface-mounted package; 6 leads
Version
SOT666
SOT353
SOT363
Type number
PMP5501V_G_Y_3
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 28 August 2009
2 of 14
NXP Semiconductors
PMP5501V; PMP5501G; PMP5501Y
PNP/PNP matched double transistors
4. Marking
Table 5.
PMP5501V
PMP5501G
PMP5501Y
[1]
* = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
Marking codes
Marking code
[1]
ED
R4*
S6*
Type number
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
CBO
V
CEO
V
EBO
I
C
I
CM
P
tot
Parameter
collector-base voltage
collector-emitter voltage
emitter-base voltage
collector current
peak collector current
total power dissipation
SOT666
SOT353
SOT363
Per device
P
tot
total power dissipation
SOT666
SOT353
SOT363
T
j
T
amb
T
stg
[1]
[2]
Conditions
open emitter
open base
open collector
single pulse;
t
p
≤
1 ms
T
amb
≤
25
°C
[1][2]
[1]
[1]
Min
-
-
-
-
-
Max
−50
−45
−5
−100
−200
Unit
V
V
V
mA
mA
Per transistor
-
-
-
200
200
200
mW
mW
mW
T
amb
≤
25
°C
[1][2]
[1]
[1]
-
-
-
-
−65
−65
300
300
300
150
+150
+150
mW
mW
mW
°C
°C
°C
junction temperature
ambient temperature
storage temperature
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Reflow soldering is the only recommended soldering method.
PMP5501V_G_Y_3
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 28 August 2009
3 of 14
NXP Semiconductors
PMP5501V; PMP5501G; PMP5501Y
PNP/PNP matched double transistors
6. Thermal characteristics
Table 7.
Symbol
R
th(j-a)
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
SOT666
SOT353
SOT363
Per device
R
th(j-a)
thermal resistance from
junction to ambient
SOT666
SOT353
SOT363
[1]
[2]
Conditions
in free air
[1][2]
[1]
[1]
Min
Typ
Max
Unit
Per transistor
-
-
-
-
-
-
625
625
625
K/W
K/W
K/W
in free air
[1][2]
[1]
[1]
-
-
-
-
-
-
416
416
416
K/W
K/W
K/W
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Reflow soldering is the only recommended soldering method.
7. Characteristics
Table 8.
Characteristics
T
amb
= 25
°
C unless otherwise specified.
Symbol
I
CBO
Parameter
collector-base cut-off
current
Conditions
V
CB
=
−30
V;
I
E
= 0 A
V
CB
=
−30
V;
I
E
= 0 A;
T
j
= 150
°C
I
EBO
h
FE
emitter-base cut-off
current
DC current gain
V
EB
=
−5
V;
I
C
= 0 A
V
CE
=
−5
V;
I
C
=
−10 µA
V
CE
=
−5
V;
I
C
=
−2
mA
V
CEsat
collector-emitter
saturation voltage
I
C
=
−10
mA;
I
B
=
−0.5
mA
I
C
=
−100
mA;
I
B
=
−5
mA
V
BEsat
base-emitter saturation I
C
=
−10
mA;
voltage
I
B
=
−0.5
mA
I
C
=
−100
mA;
I
B
=
−5
mA
[1]
Min
-
-
Typ
-
-
Max
−15
−5
Unit
nA
µA
Per transistor
-
-
200
-
-
-
-
-
250
290
−50
−200
−760
−920
−100
-
450
−200
−400
-
-
nA
mV
mV
mV
mV
[1]
PMP5501V_G_Y_3
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 28 August 2009
4 of 14
