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PO75-06

75 A, 600 V, SILICON, BRIDGE RECTIFIER DIODE

器件类别:分立半导体    二极管   

厂商名称:EDI [Electronic devices inc.]

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器件参数
参数名称
属性值
厂商名称
EDI [Electronic devices inc.]
包装说明
R-PUFM-X4
Reach Compliance Code
unknow
外壳连接
ISOLATED
配置
BRIDGE, 4 ELEMENTS
二极管元件材料
SILICON
二极管类型
BRIDGE RECTIFIER DIODE
最大正向电压 (VF)
1.3 V
JESD-30 代码
R-PUFM-X4
最大非重复峰值正向电流
1000 A
元件数量
4
相数
1
端子数量
4
最高工作温度
150 °C
最大输出电流
75 A
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
FLANGE MOUNT
认证状态
Not Qualified
最大重复峰值反向电压
600 V
表面贴装
NO
端子形式
UNSPECIFIED
端子位置
UPPER
文档预览
PO
Provides 0.40
o
C/W Junction-to-Case, Thermal Resistance
75, 100 and 120 Ampere Bridges
ion under the component
This mark indicates recognit
boratories, inc.
program of Underwriters La
PRV/LEG
TYPE NUMBER
100
200
400
PO120-04
PO100-04
PO75-04
600
PO120-06
PO100-06
PO75-06
800
PO120-08
PO100-08
PO75-08
1000
PO120-10
PO100-10
PO75-10
1200
PO120-12
PO100-12
PO75-12
1400
PO120-14
PO100-14
PO75-14
PO120-01 PO120-02
PO100-01 PO100-02
PO75-01
PO75-02
TYPE NUMBER
TYPE NUMBER
ELECTRICAL CHARACTERISTICS
Series Type Number
Max. Repetitive Peak
Reverse Voltage
O
PO 75
PO 100 PO 120
100 to 1400
UNIT
Volts
Max. DC Output Current. Tc=80 C
Max. DC Reverse Current @ PRV and 125
o
C, I
R
Max. Peak Non-Rep. Surge Current,8.3mS
Max.I
2
t for Fusing (t < 8.3ms)
Max. Instantaneous Forward Voltage @ IF=100Apk
Pulse Width=300
S
. Duty cycle<2.0%
Max. Isolation Voltage
Thermal Resistance R
0jc
Junction To Case
Operating Temperature Range,
75
5
1000
4000
1.3
2000
100
5
1000
4000
1.3
2000
120
5
1000
4000
1.3
2000
Adc
MmA.
Apk
A
2
SEC.
Vpk
V
RMS
o
0.40 typ. 0.40 typ. 0.40 typ.
-55 to+150
o
C
C/W
EDI reserves the right to change these specifications at any time without notice
PO
Figure 1
CURRENT DERATING
120
I
F(AV)
AVERAGE FORWARD CURRENT (AMP.)
For large capacitive load derate by up to 20%
100
PO
120
PO
100
80
60
PO
75
40
20
0
0
25
50
75
100
O
125
150
T
C
TEMPERATURE
( C)
Figure 2
NON- REPETITIVE SURGE CURRENT
PEAK HALF SINE WAVE
FORWARD CURRENT IN AMPERES
1000
875
750
625
500
375
250
125
1
2
4
6
8 10
20
40
60
NUMBER OF CYCLES AT 60 H
Z
PO SERIES MECHANICAL OUTLINE
2.25 (57.15)
0.177(4.50)
DIA.(TYP.)
+
+
AC
0.02(0.51)MIN.
+
1.75
(44.45)
0.177
(4.50)
+
+
1.07
(27.17)
REF.
+
-
AC
+
1.08
(27.43)
MAX.
1.88 (47.75)
TERMINAL
.375(9.53)HEX.
WITH 10-32 SCREW
4 PALCE
1.63(41.40)
REF.
DIMENSIONS IN INCHES
(MILLIMETERS)
NOTE: A thin film of silicone thermal compound is recommended between the Bridge
case and mounting surface for improved thermal conduction.
ELECTRONIC DEVICES, INC.
DESIGNERS AND MANUFACTURERS OF SOLID STATE DEVICES SINCE 1951.
21 GRAY OAKS AVENUE
* YONKERS. NEW YORK 10710 914-965-4400
* FAX 914-965-5531
* 1-800-678-0828
Ee-mail:sales@edidiodes.com
*
Wwebsite:
http://www.edidiodes.com
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