型号 | PUMA2E2000MB-12 | PUMA2E2000I-15 | PUMA2E2000I-25 | PUMA2E2000M-12 | PUMA2E2000-20 |
---|---|---|---|---|---|
描述 | EEPROM Module, 64KX32, 120ns, Parallel, CMOS, CPGA66 | EEPROM Module, 64KX32, 150ns, Parallel, CMOS, CPGA66 | EEPROM Module, 64KX32, 250ns, Parallel, CMOS, CPGA66 | EEPROM Module, 64KX32, 120ns, Parallel, CMOS, CPGA66 | EEPROM Module, 64KX32, 200ns, Parallel, CMOS, CPGA66 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | APTA Group Inc | APTA Group Inc | APTA Group Inc | APTA Group Inc | APTA Group Inc |
包装说明 | PGA, PGA66,11X11 | PGA, PGA66,11X11 | PGA, PGA66,11X11 | PGA, PGA66,11X11 | PGA, PGA66,11X11 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
最长访问时间 | 120 ns | 150 ns | 250 ns | 120 ns | 200 ns |
数据轮询 | YES | YES | YES | YES | YES |
JESD-30 代码 | S-XPGA-P66 | S-XPGA-P66 | S-XPGA-P66 | S-XPGA-P66 | S-XPGA-P66 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
内存密度 | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit |
内存集成电路类型 | EEPROM MODULE | EEPROM MODULE | EEPROM MODULE | EEPROM MODULE | EEPROM MODULE |
内存宽度 | 32 | 32 | 32 | 32 | 32 |
端子数量 | 66 | 66 | 66 | 66 | 66 |
字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 |
最高工作温度 | 125 °C | 85 °C | 85 °C | 125 °C | 70 °C |
最低工作温度 | -55 °C | -40 °C | -40 °C | -55 °C | - |
组织 | 64KX32 | 64KX32 | 64KX32 | 64KX32 | 64KX32 |
封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
封装代码 | PGA | PGA | PGA | PGA | PGA |
封装等效代码 | PGA66,11X11 | PGA66,11X11 | PGA66,11X11 | PGA66,11X11 | PGA66,11X11 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
页面大小 | 128 words | 128 words | 128 words | 128 words | 128 words |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大待机电流 | 0.002 A | 0.002 A | 0.002 A | 0.002 A | 0.002 A |
最大压摆率 | 0.2 mA | 0.2 mA | 0.2 mA | 0.2 mA | 0.2 mA |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR |
切换位 | YES | YES | YES | YES | YES |
写保护 | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE |