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PUMD19,115

NPN/PNP resistor-equipped transistors; R1 = 22 kOhm, R2 = open

器件类别:分立半导体    晶体管   

厂商名称:NXP(恩智浦)

厂商官网:https://www.nxp.com

器件标准:

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器件:PUMD19,115

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器件参数
参数名称
属性值
Brand Name
NXP Semiconduc
是否Rohs认证
符合
厂商名称
NXP(恩智浦)
零件包装代码
TSSOP
包装说明
SMALL OUTLINE, R-PDSO-G6
针数
6
制造商包装代码
SOT363
Reach Compliance Code
compli
ECCN代码
EAR99
其他特性
BUILT IN BIAS RESISTOR
最大集电极电流 (IC)
0.1 A
集电极-发射极最大电压
50 V
配置
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR
最小直流电流增益 (hFE)
100
JESD-30 代码
R-PDSO-G6
JESD-609代码
e3
湿度敏感等级
1
元件数量
2
端子数量
6
最高工作温度
150 °C
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
峰值回流温度(摄氏度)
260
极性/信道类型
NPN AND PNP
最大功率耗散 (Abs)
0.2 W
认证状态
Not Qualified
表面贴装
YES
端子面层
Tin (Sn)
端子形式
GULL WING
端子位置
DUAL
处于峰值回流温度下的最长时间
40
晶体管应用
SWITCHING
晶体管元件材料
SILICON
文档预览
PEMD19; PUMD19
NPN/PNP resistor-equipped transistors;
R1 = 22 kΩ, R2 = open
Rev. 01 — 17 February 2005
Product data sheet
1. Product profile
1.1 General description
NPN/PNP resistor-equipped transistors.
Table 1:
Product overview
Package
Philips
PEMD19
PUMD19
SOT666
SOT363
JEITA
-
SC-88
PNP/PNP
complement
PEMB19
PUMB19
NPN/NPN
complement
PEMH19
PUMH19
Type number
1.2 Features
s
s
s
s
Built-in bias resistors
Simplifies circuit design
Reduces component count
Reduces pick and place cost
1.3 Applications
s
Low current peripheral driver
s
Control of IC inputs
s
Replacement of general-purpose transistors in digital applications
1.4 Quick reference data
Table 2:
Symbol
V
CEO
I
O
R1
Quick reference data
Parameter
collector-emitter voltage
output current (DC)
bias resistor 1 (input)
Conditions
open base
Min
-
-
15.4
Typ
-
-
22
Max
50
100
28.6
Unit
V
mA
kΩ
Philips Semiconductors
PEMD19; PUMD19
NPN/PNP resistor-equipped transistors; R1 = 22 kΩ, R2 = open
2. Pinning information
Table 3:
Pin
1
2
3
4
5
6
Pinning
Description
GND (emitter) TR1
input (base) TR1
output (collector) TR2
GND (emitter) TR2
input (base) TR2
output (collector) TR1
TR1
Simplified outline
6
5
4
Symbol
6
5
4
R1
TR2
1
2
3
001aab555
R1
1
2
3
006aaa269
3. Ordering information
Table 4:
Ordering information
Package
Name
PEMD19
PUMD19
-
SC-88
Description
plastic surface mounted package; 6 leads
plastic surface mounted package; 6 leads
Version
SOT666
SOT363
Type number
4. Marking
Table 5:
PEMD19
PUMD19
[1]
* = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
Marking codes
Marking code
[1]
6E
T4*
Type number
9397 750 14408
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 17 February 2005
2 of 11
Philips Semiconductors
PEMD19; PUMD19
NPN/PNP resistor-equipped transistors; R1 = 22 kΩ, R2 = open
5. Limiting values
Table 6:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
CBO
V
CEO
V
EBO
I
O
I
CM
P
tot
Parameter
collector-base voltage
collector-emitter voltage
emitter-base voltage
output current (DC)
peak collector current
total power dissipation
SOT363
SOT666
T
stg
T
j
T
amb
Per device
P
tot
total power dissipation
SOT363
SOT666
[1]
[2]
Conditions
open emitter
open base
open collector
Min
-
-
-
-
-
Max
50
50
5
100
100
200
200
+150
150
+150
Unit
V
V
V
mA
mA
mW
mW
°C
°C
°C
Per transistor; for the PNP transistor with negative polarity
T
amb
25
°C
[1]
[1] [2]
-
-
−65
-
−65
storage temperature
junction temperature
ambient temperature
T
amb
25
°C
[1]
[1] [2]
-
-
300
300
mW
mW
Device mounted on an FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint.
Reflow soldering is the only recommended soldering method.
6. Thermal characteristics
Table 7:
Symbol
R
th(j-a)
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
SOT363
SOT666
Per device
R
th(j-a)
thermal resistance from
junction to ambient
SOT363
SOT666
[1]
[2]
Conditions
T
amb
25
°C
[1]
[1] [2]
Min
Typ
Max
Unit
Per transistor
-
-
-
-
625
625
K/W
K/W
T
amb
25
°C
[1]
[1] [2]
-
-
-
-
416
416
K/W
K/W
Device mounted on an FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint.
Reflow soldering is the only recommended soldering method.
9397 750 14408
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 17 February 2005
3 of 11
Philips Semiconductors
PEMD19; PUMD19
NPN/PNP resistor-equipped transistors; R1 = 22 kΩ, R2 = open
7. Characteristics
Table 8:
Characteristics
T
amb
= 25
°
C unless otherwise specified.
Symbol
I
CBO
I
CEO
Parameter
collector-base cut-off
current
collector-emitter
cut-off current
emitter-base cut-off
current
DC current gain
collector-emitter
saturation voltage
bias resistor 1 (input)
collector capacitance
TR1 (NPN)
TR2 (PNP)
V
CB
=
−10
V; I
E
= i
e
= 0 A;
f = 1 MHz
-
-
-
-
2.5
3
pF
pF
Conditions
V
CB
= 50 V; I
E
= 0 A
V
CE
= 30 V; I
B
= 0 A
V
CE
= 30 V; I
B
= 0 A;
T
j
= 150
°C
V
EB
= 5 V; I
C
= 0 A
V
CE
= 5 V; I
C
= 1 mA
I
C
= 10 mA; I
B
= 0.5 mA
Min
-
-
-
-
100
-
15.4
Typ
-
-
-
-
-
-
22
Max
100
1
50
100
-
150
28.6
mV
kΩ
Unit
nA
µA
µA
nA
Per transistor; for the PNP transistor with negative polarity
I
EBO
h
FE
V
CEsat
R1
C
c
9397 750 14408
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 17 February 2005
4 of 11
Philips Semiconductors
PEMD19; PUMD19
NPN/PNP resistor-equipped transistors; R1 = 22 kΩ, R2 = open
500
h
FE
(1)
006aaa172
10
3
006aaa173
400
V
CEsat
(mV)
(2)
300
10
2
(2) (1)
(3)
200
(3)
100
10
−1
1
10
I
C
(mA)
10
2
10
1
10
I
C
(mA)
10
2
V
CE
= 5 V
(1) T
amb
= 100
°C
(2) T
amb
= 25
°C
(3) T
amb
=
−40 °C
I
C
/I
B
= 20
(1) T
amb
= 100
°C
(2) T
amb
= 25
°C
(3) T
amb
=
−40 °C
Fig 1. TR1 (NPN): DC current gain as a function of
collector current; typical values
10
3
006aaa196
Fig 2. TR1 (NPN): Collector-emitter saturation voltage
as a function of collector current; typical values
−1
006aaa197
(1)
h
FE
(2)
(3)
V
CEsat
(V)
10
2
−10
−1
(1)
(2)
(3)
10
−10
−1
−1
−10
I
C
(mA)
−10
2
−10
−2
−10
−1
−1
−10
I
C
(mA)
−10
2
V
CE
=
−5
V
(1) T
amb
= 100
°C
(2) T
amb
= 25
°C
(3) T
amb
=
−40 °C
I
C
/I
B
= 20
(1) T
amb
= 100
°C
(2) T
amb
= 25
°C
(3) T
amb
=
−40 °C
Fig 3. TR2 (PNP): DC current gain as a function of
collector current; typical values
Fig 4. TR2 (PNP): Collector-emitter saturation voltage
as a function of collector current; typical values
9397 750 14408
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 17 February 2005
5 of 11
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参数对比
与PUMD19,115相近的元器件有:PEMD19,115。描述及对比如下:
型号 PUMD19,115 PEMD19,115
描述 NPN/PNP resistor-equipped transistors; R1 = 22 kOhm, R2 = open NPN/PNP resistor-equipped transistors; R1 = 22 kOhm, R2 = open
Brand Name NXP Semiconduc NXP Semiconduc
是否Rohs认证 符合 符合
厂商名称 NXP(恩智浦) NXP(恩智浦)
零件包装代码 TSSOP SOT
包装说明 SMALL OUTLINE, R-PDSO-G6 PLASTIC PACKAGE-6
针数 6 6
制造商包装代码 SOT363 SOT666
Reach Compliance Code compli compli
ECCN代码 EAR99 EAR99
其他特性 BUILT IN BIAS RESISTOR BUILT IN BIAS RESISTOR
最大集电极电流 (IC) 0.1 A 0.1 A
集电极-发射极最大电压 50 V 50 V
配置 SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR
最小直流电流增益 (hFE) 100 100
JESD-30 代码 R-PDSO-G6 R-PDSO-F6
JESD-609代码 e3 e3
湿度敏感等级 1 1
元件数量 2 2
端子数量 6 6
最高工作温度 150 °C 150 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装形状 RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE
峰值回流温度(摄氏度) 260 NOT SPECIFIED
极性/信道类型 NPN AND PNP NPN AND PNP
最大功率耗散 (Abs) 0.2 W 0.3 W
认证状态 Not Qualified Not Qualified
表面贴装 YES YES
端子面层 Tin (Sn) Tin (Sn)
端子形式 GULL WING FLAT
端子位置 DUAL DUAL
处于峰值回流温度下的最长时间 40 NOT SPECIFIED
晶体管应用 SWITCHING SWITCHING
晶体管元件材料 SILICON SILICON
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