FREQUENCY
QESM49H2 / H32
HC49 SMD Crystal – SMD packaged
Specification (Rev-G)
Electrical Characteristics .....................................................P01
ESR vs. frequency range and Mode of vibration .................P01
Mechanical Characteristics ..................................................P01
Ordering Information ............................................................P02
Suggested Reflow Soldering Profile .....................................P03
Tape Drawing ......................................................................P03
Reel Drawing .......................................................................P04
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Frequency
QESM49H2 / H32
HC49 SMD Crystal – SMD packaged
Specification (rev-G)
May 23 , 2016
rd
Electrical Characteristics
Electrical Parameters
Frequency range
(see Note 1)
Temperature Stability
Operating Temperature Range
Storage temperature range
Shunt capacitance C
0
Load capacitance
Drive level
Ageing (First Year)
Insulator resistance
Unit
MHz
± ppm
°C
°C
pF
pF
µW
± ppm
MΩ
500
100
-40
Customized specification upon request
Minimum Typical Maximum
3.000
10
10
30
30
-20/+70
100.00
50
50
-40/+85
+85
7.0
6pF ~ 32pF or series
500
3
Ref at 25°C
At 100V
DC
Refer to Ordering Information
Refer to Ordering Information
Refer to Ordering Information
Refer to Ordering Information
Test conditions
Frequency Tolerance
(at 25°C) ± ppm
Note 1 :
8 MHz is the minimum frequency for package QESM49H32
ESR vs. frequency range and Mode of vibration
Frequency range
(MHz)
3.00 to 3.49
3.50 to 3.99
4.00 to 4.99
5.00 to 6.99
7.00 to 7.99
8.00 to 8.99
9.00 to 9.99
Mode of vibration Max ESR (Ω)
Fund. / AT
Fund. / AT
Fund. / AT
Fund. / AT
Fund. / AT
Fund. / AT
Fund. / AT
150
120
100
80
70
60
50
Frequency range
(MHz)
10.00 to 10.99
11.00 to 19.99
20.00 to 40.00
27.00 to 29.99
30.00 to 44.99
45.00 to 80.00
Mode of vibration
Fund. / AT
Fund. / AT
Fund. / AT
rd
3 / AT
rd
3 / AT
rd
3 / AT
Max ESR (Ω)
40
30
25
100
80
60
Mechanical Characteristics
1
TEMEXPRESS reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost.
Frequency
QESM49H2 / H32
HC49 SMD Crystal – SMD packaged
Specification (rev-G)
May 23 , 2016
rd
Heights (mm)
49H2
H = 4.0 max
49H32
H = 3.2 max
Marking for SM94H2 / H32
Frequency in MHz (6 digits on the top)
ex: 10.000
Laser marking
Mechanical Conditions
Vibration 10g, 10 H to 2 kHz
according to standard
CEI68-2-63
Shocks
100g, 6 ms according to
standard CEI68-2-27
Note 1 :
QESM49H serie is fully RoHS compliant.
Ordering Information
QESM49H2
1
30
Part numbering system
HQ
50
20
25.000MHZ
Package type
Vibration
mode
Frequency
tolerance
Operating
temperature
range
D=-40°C
F= -30°C
H=-20°C
J=-10°C
L=0°C
M=+50°C
N=+55°C
O=+60°C
Q=+70°C
T=+85°C
Frequency
stability
Load
Capacitance
Nominal
Frequency
(MHz)
Please enter the
nominal
frequency
QESM49H2 :
QESM49H32 :
HC49 SMD package
1 = Fundamental
rd
3 = 3 Overtone
10=±10ppm
30=±30ppm
50=±30ppm
10=±10ppm
30=±20ppm
50=±30ppm
16=16pF
Please, enter the
value of load
capacitance
2
TEMEXPRESS reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost.
Frequency
QESM49H2 / H32
HC49 SMD Crystal – SMD packaged
Specification (rev-G)
May 23 , 2016
rd
Suggested Reflow Soldering Profile
The product has been tested to withstand the Reflow Profile shown. The Reflow Profile used to solder
TEMEXPRESS QESM49Hx crystals are determinated by the solder paste Manufacturer’s specification. It is
recommended that the Reflow Profile used does not exceed the one shown above.
Tape Drawing
3
TEMEXPRESS reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost.
Frequency
QESM49H2 / H32
HC49 SMD Crystal – SMD packaged
Specification (rev-G)
May 23 , 2016
rd
Reel Drawing
Multiple
:
1000pcs per reel
4
TEMEXPRESS reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost.
FPGA/CPLD
