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QG80332M800

Microprocessor, 800MHz, CMOS, PBGA829, 37.50 X 37.50 MM, 1.27 MM PITCH, LEAD FREE, FCBGA-829

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:Intel(英特尔)

厂商官网:http://www.intel.com/

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
Intel(英特尔)
零件包装代码
BGA
包装说明
BGA, BGA829,29X29,50
针数
829
Reach Compliance Code
unknown
ECCN代码
3A001.A.3
地址总线宽度
64
边界扫描
YES
最大时钟频率
133 MHz
外部数据总线宽度
64
格式
FIXED POINT
集成缓存
YES
JESD-30 代码
S-PBGA-B829
长度
37.5 mm
低功率模式
YES
端子数量
829
封装主体材料
PLASTIC/EPOXY
封装代码
BGA
封装等效代码
BGA829,29X29,50
封装形状
SQUARE
封装形式
GRID ARRAY
电源
1.3,1.5,1.8/2.5,3.3 V
认证状态
Not Qualified
座面最大高度
2.942 mm
速度
800 MHz
最大供电电压
3.6 V
最小供电电压
3 V
标称供电电压
3.3 V
表面贴装
YES
技术
CMOS
端子形式
BALL
端子节距
1.27 mm
端子位置
BOTTOM
宽度
37.5 mm
uPs/uCs/外围集成电路类型
MICROPROCESSOR
文档预览
Intel® 80332 I/O Processor
Datasheet
Product Features
Integrated Intel XScale
®
core
— 500, 667 and 800 MHz
— ARM* V5TE Compliant
— 32 KByte, 32-way Set Associative
Instruction Cache with cache locking
— 32 KByte, 32-way Set Associative Data
Cache with cache locking. Supports
write through or write back
— 2 KByte, 2-way Set Associative
Mini-Data Cache
— 128-Entry Branch Target Buffer
— 8-Entry Write Buffer
— 4-Entry Fill and Pend Buffer
— Performance Monitor Unit
— Internal Bus 266 MHz/64-bit
PCI Express-to-PCI Bridges
— x8 PCI Express Upstream Link
— PCI Express Specification 1.0a
compliant
— PCI-X Bus A (IOP bus - ATU interface)
—PCI-X Bus B (Slot Expansion bus)
supports standard PCI Hot-Plug Controller
— Four output clocks per PCI-X bus
Address Translation Unit
— 2 KB or 4 KB Outbound Read Queue
— 4 KB Outbound Write Queue
— 4 KB Inbound Read and Write Queue
— Connects Internal Bus to PCI/X Bus A
— Messaging Unit and Expansion ROM
Two Programmable 32-bit Timers and
Watchdog Timer
Eight General Purpose I/O Pins
Two I
2
C Bus Interface Units
Warning:
Memory Controller
— PC2700 Double Data Rate (DDR333)
SDRAM
— DDRII 400 SDRAM
— Up to 2 GB of 64-bit DDR333
— Up to 1 GB of 64-bit DDRII400
— Optional Single-bit Error Correction,
Multi-bit Detection Support (ECC)
— Supports Unbuffered or Registered
DIMMs and Discrete SDRAM
— 32-bit memory support
DMA Controller
— Two Independent Channels Connected
to Internal Bus
— Two 1KB Queues in Ch0 and Ch1
— CRC-32C Calculation
Application Accelerator Unit
— Performs optional XOR on Read Data
— Compute Parity Across Local Memory
Blocks
— 1 KB/512-byte Store Queue
Two UART (16550) Units
— 64-byte Receive and Transmit FIFOs
— 4-pin, Master/Slave Capable
Peripheral Bus Interface
— 8-/16-bit Data Bus with Two Chip Selects
Interrupt Controller Unit
— Four Priority Levels
— Vector Generation
— Sixteen External Interrupt Pins with
High Priority Interrupt (HPI#)
829-Ball, Flip Chip Ball Grid Array (FCBGA)
— 37.5 mm
2
and 1.27 mm ball pitch
Intel Corporation products are not intended for use in life support appliances,
devices or systems. Use of a Intel products in such applications without written
consent is prohibited.
Document Number: 274066-004US
August 2005
Intel® 80332 I/O Processor Datasheet
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS
ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER
INTELLECTUAL PROPERTY RIGHT.
Intel products are not intended for use in medical, life saving, life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling
1-800-548-4725 or by visiting Intel's website at http://www.intel.com.
Copyright© Intel Corporation, 2005
AlertVIEW, i960, AnyPoint, AppChoice, BoardWatch, BunnyPeople, CablePort, Celeron, Chips, Commerce Cart, CT Connect, CT Media, Dialogic,
DM3, EtherExpress, ETOX, FlashFile, GatherRound, i386, i486, iCat, iCOMP, Insight960, InstantIP, Intel, Intel logo, Intel386, Intel486, Intel740,
IntelDX2, IntelDX4, IntelSX2, Intel ChatPad, Intel Create&Share, Intel Dot.Station, Intel GigaBlade, Intel InBusiness, Intel Inside, Intel Inside logo, Intel
NetBurst, Intel NetStructure, Intel Play, Intel Play logo, Intel Pocket Concert, Intel SingleDriver, Intel SpeedStep, Intel StrataFlash, Intel TeamStation,
Intel WebOutfitter, Intel Xeon, Intel XScale, Itanium, JobAnalyst, LANDesk, LanRover, MCS, MMX, MMX logo, NetPort, NetportExpress, Optimizer
logo, OverDrive, Paragon, PC Dads, PC Parents, Pentium, Pentium II Xeon, Pentium III Xeon, Performance at Your Command, ProShare,
RemoteExpress, Screamline, Shiva, SmartDie, Solutions960, Sound Mark, StorageExpress, The Computer Inside, The Journey Inside, This Way In,
TokenExpress, Trillium, Vivonic, and VTune are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and
other countries.
*Other names and brands may be claimed as the property of others.
2
August 2005
Document Number: 274066-004US
Intel® 80332 I/O Processor Datasheet
Contents
1.0
Introduction......................................................................................................................... 7
1.1
About This Document............................................................................................ 7
1.1.1 Terminology.............................................................................................. 7
1.1.2 Other Relevant Documents ...................................................................... 8
About the Intel
®
80332 I/O Processor ................................................................... 9
Intel XScale
®
Core ..............................................................................................11
PCI Express-to-PCI Bridge Units ........................................................................11
Address Translation Unit .....................................................................................12
Memory Controller...............................................................................................12
Application Accelerator Unit ................................................................................12
Peripheral Bus Interface......................................................................................12
DMA Controller....................................................................................................12
I
2
C Bus Interface Unit..........................................................................................13
Messaging Unit....................................................................................................13
Internal Bus .........................................................................................................13
UART Units .........................................................................................................13
Interrupt Controller Unit .......................................................................................13
GPIO ...................................................................................................................14
SMBus Unit .........................................................................................................14
Functional Signal Descriptions ............................................................................15
Package Thermal Specifications .........................................................................56
Absolute Maximum Ratings.................................................................................57
V
CCPLL
Pin Requirements ...................................................................................57
Targeted DC Specifications.................................................................................58
Targeted AC Specifications.................................................................................60
4.4.1 Clock Signal Timings..............................................................................60
4.4.2 DDR/DDR-II SDRAM Interface Signal Timings ......................................62
4.4.3 Peripheral Bus Interface Signal Timings ................................................64
4.4.4 I
2
C/SMBus Interface Signal Timings ......................................................66
4.4.5 UART Interface Signal Timings ..............................................................66
4.4.6 PCI Express Differential Transmitter (Tx) Output Specifications............67
4.4.7 PCI Express Differential Receiver (Rx) Input Specifications ..................68
4.4.8 Boundary Scan Test Signal Timings ......................................................69
AC Timing Waveforms ........................................................................................70
AC Test Conditions .............................................................................................74
1.2
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
2.10
2.11
2.12
2.13
2.14
3.0
3.1
3.2
4.0
4.1
4.2
4.3
4.4
Features ...........................................................................................................................11
Package Information ........................................................................................................15
Electrical Specifications....................................................................................................57
4.5
4.6
Document Number: 274066-004US
August 2005
3
Intel® 80332 I/O Processor Datasheet
Figures
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
Intel
®
80332 I/O Processor Functional Block Diagram ....................................... 10
829-Ball FCBGA Package Diagram .................................................................... 36
Intel
®
80332 I/O Processor Signal Group Locations (Bottom View) ................... 37
Intel
®
80332 I/O Processor Ballout - Left Side (Bottom View) ............................ 38
Intel
®
80332 I/O Processor Ballout - Right Side (Bottom View) .......................... 39
Clock Timing Measurement Waveforms ............................................................. 70
Output Timing Measurement Waveforms ........................................................... 70
Input Timing Measurement Waveforms .............................................................. 71
I
2
C/SMBus Interface Signal Timings ................................................................... 71
UART Transmitter Receiver Timing .................................................................... 71
DDR SDRAM Write Timings ............................................................................... 72
DDR SDRAM Read Timings ............................................................................... 72
Write PreAmble/PostAmble Durations ................................................................ 73
AC Test Load for All Signals Except PCI and DDR SDRAM .............................. 74
AC Test Load for DDR SDRAM Signals ............................................................. 74
PCI/PCI-X TOV(max) Rising Edge AC Test Load............................................... 74
PCI/PCI-X TOV(max) Falling Edge AC Test Load .............................................. 75
PCI/PCI-X TOV(min) AC Test Load .................................................................... 75
Transmitter Test Load (100 ohm differential load) .............................................. 75
Transmitter Eye Diagram .................................................................................... 76
Receiver Eye Opening (Differential).................................................................... 76
4
August 2005
Document Number: 274066-004US
Intel® 80332 I/O Processor Datasheet
Tables
1
2
4
3
5
6
7
8
10
9
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
Pin Description Nomenclature.............................................................................15
DDR SDRAM Signals..........................................................................................16
MISC SDRAM Signals.........................................................................................17
DDR-II SDRAM Signals.......................................................................................17
Peripheral Bus Interface Signals .........................................................................18
PCI Express Signals............................................................................................19
B PCI (Slot Expansion) Bus Signals....................................................................20
A PCI (IOP) Bus Signals .....................................................................................22
I
2
C/SMBus Signals ..............................................................................................24
Interrupt Signals ..................................................................................................24
Hot-Plug Controller Signals for Parallel 1-slot, no-glue .......................................25
UART Signals......................................................................................................26
Test and Miscellaneous Signals..........................................................................28
Reset Strap Signals.............................................................................................29
Power and Ground Pins ......................................................................................31
Pin Mode Behavior ..............................................................................................32
Pin Multiplexing for Functional Modes.................................................................35
FC-style, H-PBGA Package Dimensions ............................................................36
829-Lead Package - Alphabetical Ball Listings ...................................................40
829-Lead Package - Alphabetical Signal Listings ...............................................48
Absolute Maximum Ratings.................................................................................57
Operating Conditions...........................................................................................57
DC Characteristics ..............................................................................................58
I
CC
Characteristics ..............................................................................................59
PCI Clock Timings...............................................................................................60
DDR Clock Timings .............................................................................................60
PCI Express Clock Timings.................................................................................61
DDR SDRAM Signal Timings ..............................................................................62
DDR-II SDRAM Signal Timings...........................................................................63
Peripheral Bus Signal Timings ............................................................................64
PCI Signal Timings..............................................................................................65
I
2
C/SMBus Signal Timings ..................................................................................66
UART Signal Timings ..........................................................................................66
PCI Express Tx Output Specifications ................................................................67
PCI Express Rx Input Specifications...................................................................68
Boundary Scan Test Signal Timings ...................................................................69
AC Measurement Conditions ..............................................................................74
Document Number: 274066-004US
August 2005
5
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参数对比
与QG80332M800相近的元器件有:QG80332M667、NQ80332M800、NQ80332M500、QG80332M500、NQ80332M667。描述及对比如下:
型号 QG80332M800 QG80332M667 NQ80332M800 NQ80332M500 QG80332M500 NQ80332M667
描述 Microprocessor, 800MHz, CMOS, PBGA829, 37.50 X 37.50 MM, 1.27 MM PITCH, LEAD FREE, FCBGA-829 Microprocessor, 667MHz, CMOS, PBGA829, 37.50 X 37.50 MM, 1.27 MM PITCH, LEAD FREE, FCBGA-829 Microprocessor, 800MHz, CMOS, PBGA829, 37.50 X 37.50 MM, 1.27 MM PITCH, FCBGA-829 Microprocessor, 500MHz, CMOS, PBGA829, 37.50 X 37.50 MM, 1.27 MM PITCH, FCBGA-829 Microprocessor, 500MHz, CMOS, PBGA829, 37.50 X 37.50 MM, 1.27 MM PITCH, LEAD FREE, FCBGA-829 Microprocessor, 667MHz, CMOS, PBGA829, 37.50 X 37.50 MM, 1.27 MM PITCH, FCBGA-829
是否Rohs认证 符合 符合 不符合 不符合 符合 不符合
零件包装代码 BGA BGA BGA BGA BGA BGA
包装说明 BGA, BGA829,29X29,50 BGA, BGA829,29X29,50 BGA, BGA829,29X29,50 BGA, BGA829,29X29,50 BGA, BGA829,29X29,50 BGA, BGA829,29X29,50
针数 829 829 829 829 829 829
Reach Compliance Code unknown unknown unknown unknown unknown unknown
ECCN代码 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3
地址总线宽度 64 64 64 64 64 64
边界扫描 YES YES YES YES YES YES
最大时钟频率 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz
外部数据总线宽度 64 64 64 64 64 64
格式 FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT
集成缓存 YES YES YES YES YES YES
JESD-30 代码 S-PBGA-B829 S-PBGA-B829 S-PBGA-B829 S-PBGA-B829 S-PBGA-B829 S-PBGA-B829
长度 37.5 mm 37.5 mm 37.5 mm 37.5 mm 37.5 mm 37.5 mm
低功率模式 YES YES YES YES YES YES
端子数量 829 829 829 829 829 829
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA BGA BGA BGA
封装等效代码 BGA829,29X29,50 BGA829,29X29,50 BGA829,29X29,50 BGA829,29X29,50 BGA829,29X29,50 BGA829,29X29,50
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
电源 1.3,1.5,1.8/2.5,3.3 V 1.3,1.5,1.8/2.5,3.3 V 1.3,1.5,1.8/2.5,3.3 V 1.3,1.5,1.8/2.5,3.3 V 1.3,1.5,1.8/2.5,3.3 V 1.3,1.5,1.8/2.5,3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 2.942 mm 2.942 mm 2.942 mm 2.942 mm 2.942 mm 2.942 mm
速度 800 MHz 667 MHz 800 MHz 500 MHz 500 MHz 667 MHz
最大供电电压 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 3 V 3 V 3 V 3 V 3 V 3 V
标称供电电压 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
端子形式 BALL BALL BALL BALL BALL BALL
端子节距 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
宽度 37.5 mm 37.5 mm 37.5 mm 37.5 mm 37.5 mm 37.5 mm
uPs/uCs/外围集成电路类型 MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR
厂商名称 Intel(英特尔) - Intel(英特尔) Intel(英特尔) Intel(英特尔) Intel(英特尔)
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器件捷径:
E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ
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