Features
RX71M Group
Renesas MCUs
Datasheet
R01DS0249EJ0110
Rev.1.10
Dec 28, 2017
240-MHz 32-bit RX MCU, on-chip FPU, 480 DMIPS, up to 4-MB flash memory,
512-KB SRAM, various communications interfaces including IEEE 1588-compliant Ethernet MAC,
high-speed USB 2.0 with battery charging, SD host interface (optional), quad SPI, and CAN, 12-bit A/D
converter, RTC, encryption (optional), serial interface for audio, CMOS camera interface
Features
■ 32-bit RXv2 CPU core
•
Max. operating frequency: 240 MHz
Capable of 480 DMIPS in operation at 240 MHz
•
Single precision 32-bit IEEE-754 floating point
•
Two types of multiply-and-accumulation unit (between memories
and between registers)
•
32-bit multiplier (fastest instruction execution takes one CPU clock
cycle)
•
Divider (fastest instruction execution takes two CPU clock cycles)
•
Fast interrupt
•
CISC Harvard architecture with 5-stage pipeline
•
Variable-length instructions: Ultra-compact code
•
Supports the memory protection unit (MPU)
•
JTAG and FINE (one-line) debugging interfaces
•
Operation from a single 2.7- to 3.6-V supply
•
Low power consumption: A product that supports all peripheral
functions draws only 0.2mA/MHz (Typ.).
•
RTC is capable of operation from a dedicated power supply.
•
Four low-power modes
PLQP0176KB-A 24 × 24 mm, 0.5-mm pitch
PLQP0144KA-A 20 × 20 mm, 0.5-mm pitch
PLQP0100KB-A 14 × 14 mm, 0.5-mm pitch
PTLG0177KA-A 8 × 8 mm, 0.5-mm pitch
PTLG0145KA-A 7 × 7 mm, 0.5-mm pitch
PTLG0100JA-A 7 × 7 mm, 0.65-mm pitch
PLBG0176GA-A 13 × 13mm, 0.8-mm pitch
■ Various communications interfaces
•
IEEE 1588-compliant Ethernet MAC
(for 176- and 177-pin products: 2 modules)
•
PHY layer for host/function or OTG controller (1) with high-speed
USB 2.0 with battery charging transfer (only for 176- and 177-pin
products)
•
PHY layer (1) for host/function or OTG controller (1) with full-
speed USB 2.0 transfer
•
CAN (compliant with ISO11898-1), incorporating 32 mailboxes (up
to 3 modules)
•
SCIg and SCIh with multiple functionalities (up to 9)
Choose from among asynchronous mode, clock-synchronous mode,
smart-card interface mode, simplified SPI, simplified I
2
C, and
extended serial mode.
•
SCIFA with 16-byte transmission and reception FIFOs (up to 4
interfaces)
•
I
2
C bus interface for transfer at up to 1 Mbps (up to 2 interfaces)
•
Four-wire QSPI (1 interface) in addition to RSPIa (2 interfaces)
•
Parallel data capture unit (PDC) for the CMOS camera interface (not
in 100-pin products)
•
SD host interface (optional: 1 interface) with a 1- or 4-bit SD bus for
use with SD memory or SDIO
•
MMCIF with 1-, 4-, or 8-bit transfer bus width
■ Low-power design and architecture
■ On-chip code flash memory
•
Supports versions with up to 4 Mbytes of ROM
•
No wait states at up to 120 MHz or when the AFU is hit, one wait
state at above 120 MHz and when the AFU is missed
•
User code is programmable by on-board or off-board programming.
•
Programming/erasing as background operations (BGOs)
■ On-chip data flash memory
•
64 Kbytes, reprogrammable up to 100,000 times
•
Programming/erasing as background operations (BGOs)
■ On-chip SRAM
•
512 Kbytes of SRAM (no wait states except in the 256 Kbytes from
0004 0000h to 0007 FFFFh when ICLK is set to 120 MHz or faster)
•
32 Kbytes of RAM with ECC (single-error correction and double
error detection)
•
8 Kbytes of standby RAM (backup on deep software standby)
■ External address space
•
Buses for full-speed data transfer (max. operating frequency of 60
MHz)
•
8 CS areas
•
8-, 16-, or 32-bit bus space is selectable per area
•
Independent SDRAM area (128 Mbytes)
■ Data transfer
•
•
•
•
DMAC: 8 channels
DTC
EXDMAC: 2 channels
DMAC for the Ethernet controller: 3 channels for 176- and 177-pin
products; 2 channels for 100-, 144-, and 145-pin products
■ Up to 29 extended-function timers
•
16-bit TPUa, MTU3a, and GPTA: input capture, output compare,
PWM waveform output
•
8-bit TMRa (4 channels), 16-bit CMT (4 channels), 32-bit CMTW (2
channels)
■ Reset and supply management
•
Power-on reset (POR)
•
Low voltage detection (LVD) with voltage settings
■ Clock functions
•
External crystal resonator or internal PLL for operation at 8 to 24
MHz
•
Internal 240-kHz LOCO and HOCO selectable from 16, 18, and 20
MHz
•
120-kHz clock for the IWDTa
■ 12-bit A/D converter
•
Two 12-bit units (8 channels for unit 0; 21 channels for unit 1)
•
Self diagnosis
•
Detection of analog input disconnection
■ Real-time clock
•
Adjustment functions (30 seconds, leap year, and error)
•
Real-time clock counting and binary counting modes are selectable
•
Time capture function
(for capturing times in response to event-signal input)
■ 12-bit D/A converter: 2 channels
•
On-chip operational amplifier output or direct input selectable
■ Temperature sensor for measuring temperature
within the chip
■ Encryption (optional)
•
AES (key lengths: 128, 192, and 256 bits)
•
DES (key lengths: 56 bits (DES); 3 × 56 bits (T-DES))
•
SHA (SHA-1 (128), SHA-2 (224 or 256), HMAC (160, 224, or 256))
■ Independent watchdog timer
•
120-kHz (1/2 LOCO frequency) clock operation
■ Useful functions for IEC60730 compliance
•
Oscillation-stoppage detection, frequency measurement, CRC,
IWDTa, self-diagnostic function for the A/D converter, etc.
•
Register write protection function can protect values in important
registers against overwriting.
■ Up to 127 pins for general I/O ports
•
5-V tolerance, open drain, input pull-up, switchable driving ability
■ Operating temp. range
•
–40°C to +85°C
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Dec 28, 2017
Page 1 of 232
RX71M Group
1. Overview
1.
1.1
Overview
Outline of Specifications
Table 1.1
lists the specifications in outline, and
Table 1.2
gives a comparison of the functions of products in different
packages.
Table 1.1
shows the outline of maximum specifications, and the number of peripheral module channels differs
depending on the pin number on the package and the code flash memory capacity. For details, see
Table 1.2,
Comparison of Functions for Different Packages.
Table 1.1
Classification
CPU
Outline of Specifications (1/9)
Module/Function
CPU
Description
•
Maximum operating frequency: 240 MHz
•
32-bit RX CPU (RXv2)
•
Minimum instruction execution time: One instruction per state (cycle of the system
clock)
•
Address space: 4-Gbyte linear
•
Register set of the CPU
General purpose: Sixteen 32-bit registers
Control: Ten 32-bit registers
Accumulator: Two 72-bit registers
•
Basic instructions: 75
•
Floating-point instructions: 11
•
DSP instructions: 23
•
Addressing modes: 11
•
Data arrangement
Instructions: Little endian
Data: Selectable as little endian or big endian
•
On-chip 32-bit multiplier: 32 × 32 → 64 bits
•
On-chip divider: 32 / 32 → 32 bits
•
Barrel shifter: 32 bits
•
Single precision (32-bit) floating point
•
Data types and floating-point exceptions in conformance with the IEEE754 standard
•
Capacity: 2 Mbytes, 2.5 Mbytes, 3 Mbytes, 4 Mbytes
•
No-wait access at up to 120 MHz, single wait access at frequencies above 120 MHz
•
No-wait access to instructions and operands when the AFU is hit in operation at 240
MHz
•
On-board programming: Four types
•
Off-board programming (parallel programmer mode)
•
The trusted memory (TM) function protects against the reading of programs from blocks
8 and 9.
•
Capacity: 64 Kbytes
•
Programming/erasing: 100,000 times
•
Capacity: 512 Kbytes
•
0000 0000h to 0003 FFFFh (256 Kbytes): 240 MHz No-wait access
0004 0000h to 0007 FFFFh (256 Kbytes): No-wait access at up to 120 MHz, single wait
access at frequencies above 120 MHz
•
SED (single error detection)
•
12-byte length ID unique to the device
•
Capacity: 32 Kbytes
•
Single wait access at up to 120 MHz, two wait accesses for reading and three wait
accesses for writing at frequencies above 120 MHz
•
SEC-DED (single error correction/double error detection)
•
Capacity: 8 Kbytes
•
Operation synchronized with PCLKB: Up to 60 MHz, two-cycle access
FPU
Memory
Code flash memory
Data flash memory
RAM
Unique ID
RAM with ECC
(ECCRAM)
Standby RAM
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RX71M Group
Table 1.1
Classification
Operating modes
1. Overview
Outline of Specifications (2/9)
Module/Function
Description
•
Operating modes by the mode-setting pins at the time of release from the reset state
Single-chip mode
Boot mode (for the SCI interface)
Boot mode (for the USB interface)
User boot mode
•
Selection of operating mode by register setting
Single-chip mode, user boot mode
On-chip ROM disabled extended mode
On-chip ROM enabled extended mode
•
Endian selectable
Clock generation circuit
•
Main clock oscillator, sub clock oscillator, low-speed/high-speed on-chip oscillator, PLL
frequency synthesizer, and IWDT-dedicated on-chip oscillator
•
The peripheral module clocks can be set to frequencies above that of the system clock.
•
Main-clock oscillation stoppage detection
•
Separate frequency-division and multiplication settings for the system clock (ICLK),
peripheral module clocks (PCLKA, PCLKB, PCLKC, PCLKD), flash-IF clock (FCLK) and
external bus clock (BCLK)
The CPU and other bus masters run in synchronization with the system clock (ICLK):
Up to 240 MHz
Peripheral modules of MTU3, GPT, RSPI, SCIFA, USBA, ETHERC, EPTPC, EDMAC,
and AES run in synchronization with PCLKA, which operates at up to 120 MHz.
Other peripheral modules run in synchronization with PCLKB: Up to 60 MHz
ADCLK in the SD12AD (unit 0) runs in synchronization with PCLKC: Up to 60 MHz
ADCLK in the SD12AD (unit 1) runs in synchronization with PCLKD: Up to 60 MHz
Flash IF run in synchronization with the flash-IF clock (FCLK): Up to 60 MHz
Devices connected to the external bus run in synchronization with the external bus
clock (BCLK): Up to 60 MHz
•
Multiplication is possible with using the high-speed on-chip oscillator (HOCO) as a
reference clock of the PLL circuit
Nine types of reset
•
RES# pin reset: Generated when the RES# pin is driven low.
•
Power-on reset: Generated when the RES# pin is driven high and VCC = AVCC0 =
AVCC1 rises.
•
Voltage-monitoring 0 reset: Generated when VCC = AVCC0 = AVCC1 falls.
•
Voltage-monitoring 1 reset: Generated when VCC = AVCC0 = AVCC1 falls.
•
Voltage-monitoring 2 reset: Generated when VCC = AVCC0 = AVCC1 falls.
•
Deep software standby reset: Generated in response to an interrupt to trigger release
from deep software standby.
•
Independent watchdog timer reset: Generated when the independent watchdog timer
underflows, or a refresh error occurs.
•
Watchdog timer reset: Generated when the watchdog timer underflows, or a refresh
error occurs.
•
Software reset: Generated by register setting.
If the RES# pin is at the high level when power is supplied, an internal reset is generated.
After VCC = AVCC0 = AVCC1 has exceeded the voltage detection level and the specified
period has elapsed, the reset is cancelled.
Monitors the voltage being input to the VCC = AVCC0 = AVCC1 pins and generates an
internal reset or internal interrupt.
•
Voltage detection circuit 0
Capable of generating an internal reset
The option-setting memory can be used to select enabling or disabling of the reset.
Voltage detection level: Selectable from three different levels (2.94 V, 2.87 V, and
2.80 V)
•
Voltage detection circuits 1 and 2
Voltage detection level: Selectable from three different levels (2.99 V, 2.92 V, and
2.85 V)
Digital filtering (1/2, 1/4, 1/8, and 1/16 LOCO frequency)
Capable of generating an internal reset
•
Two types of timing are selectable for release from reset
An internal interrupt can be requested.
•
Detection of voltage rising above and falling below thresholds is selectable.
•
Maskable or non-maskable interrupt is selectable
Voltage detection monitoring
Event linking
Clock
Reset
Power-on reset
Voltage detection circuit (LVDA)
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RX71M Group
Table 1.1
Classification
Low power
consumption
1. Overview
Outline of Specifications (3/9)
Module/Function
Low power
consumption facilities
Description
•
Module stop function
•
Four low power consumption modes
Sleep mode, all-module clock stop mode, software standby mode, and deep software
standby mode
•
When the voltage on the VCC pin drops, battery power from the VBATT pin is supplied
to keep the real-time clock (RTC) operating.
•
•
•
•
•
•
Peripheral function interrupts: 298 sources
External interrupts: 16 (pins IRQ0 to IRQ15)
Software interrupts: 2 sources
Non-maskable interrupts: 7 sources
Sixteen levels specifiable for the order of priority
Method of interrupt source selection:
The interrupt vectors consist of 256 vectors (128 sources are fixed. The remaining 128
vectors are selected from among the other 157 sources.)
Battery backup function
Interrupt
Interrupt controller
(ICUA)
External bus extension
•
The external address space can be divided into eight areas (CS0 to CS7), each with
independent control of access settings.
Capacity of each area: 16 Mbytes (CS0 to CS7)
A chip-select signal (CS0# to CS7#) can be output for each area.
Each area is specifiable as an 8-, 16-, or 32-bit bus space.
The data arrangement in each area is selectable as little or big endian (only for data).
•
SDRAM interface connectable
•
Bus format: Separate bus, multiplex bus
•
Wait control
•
Write buffer facility
•
8 channels
•
Three transfer modes: Normal transfer, repeat transfer, and block transfer
•
Request sources: Software trigger, external interrupts, and interrupt requests from
peripheral functions
•
2 channels
Four transfer modes: Normal transfer, repeat transfer, block transfer, and cluster
transfer
•
Single-address transfer enabled with the EDACKn signal
•
Request sources: Software trigger, external DMA requests (EDREQn), and interrupt
requests from peripheral functions
•
Three transfer modes: Normal transfer, repeat transfer, and block transfer
•
Request sources: External interrupts and interrupt requests from peripheral functions
•
I/O ports for the 177-pin TFLGA, 176-pin LFBGA, and 176-pin LFQFP
I/O pins: 127
Input pin: 1
Pull-up resistors: 127
Open-drain outputs: 127
5-V tolerance: 19
•
I/O ports for the 145-pin TFLGA and 144-pin LFQFP
I/O pins: 111
Input pin: 1
Pull-up resistors: 111
Open-drain outputs: 111
5-V tolerance: 18
•
I/O ports for the 100-pin TFLGA and 100-pin LFQFP
I/O pins: 78
Input pin: 1
Pull-up resistors: 78
Open-drain outputs: 78
5-V tolerance: 17
DMA
DMA controller
(DMACAa)
EXDMA controller
(EXDMACa)
Data transfer controller
(DTCa)
I/O ports
Programmable I/O ports
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RX71M Group
Table 1.1
Classification
1. Overview
Outline of Specifications (4/9)
Module/Function
Description
•
Event signals such as interrupt request signals can be interlinked with the operation of
functions such as timer counting, eliminating the need for intervention by the CPU to
control the functions.
•
119 internal event signals can be freely combined for interlinked operation with
connected functions.
•
Event signals from peripheral modules can be used to change the states of output pins
(of ports B and E).
•
Changes in the states of pins (of ports B and E) being used as inputs can be interlinked
with the operation of peripheral modules.
•
•
•
•
•
•
•
•
•
•
Multifunction timer
pulse unit (MTU3a)
(16 bits × 6 channels) × 1 unit
Maximum of 16 pulse-input/output possible
Select from among seven or eight counter-input clock signals for each channel
Input capture/output compare function
Output of PWM waveforms in up to 15 phases in PWM mode
Support for buffered operation, phase-counting mode (two phase encoder input) and
cascade-connected operation (32 bits × 2 channels) depending on the channel.
PPG output trigger can be generated
Capable of generating conversion start triggers for the A/D converters
Digital filtering of signals from the input capture pins
Event linking by the ELC
Event link controller (ELC)
Timers
16-bit timer pulse unit
(TPUa)
•
9 channels (16 bits × 8 channels, 32 bits × 1 channel)
•
Maximum of 28 pulse-input/output and 3 pulse-input possible
•
Select from among 14 counter-input clock signals for each channel (PCLKA/1, PCLKA/
2, PCLKA/4, PCLKA/8, PCLKA/16, PCLKA/32, PCLKA/64, PCLKA/256, PCLKA/1024,
MTCLKA, MTCLKB, MTCLKC, MTCLKD, MTIOC1A)
14 of the signals are available for channel 0, 12 are available for channel 2, 11 are
available for channels 1, 3, 4, 6 to 8, and 10 are available for channel 5.
•
Input capture function
•
39 output compare/input capture registers
•
Counter clear operation (synchronous clearing by compare match/input capture)
•
Simultaneous writing to multiple timer counters (TCNT)
•
Simultaneous register input/output by synchronous counter operation
•
Buffered operation
•
Support for cascade-connected operation
•
43 interrupt sources
•
Automatic transfer of register data
•
Pulse output mode
Toggle/PWM/complementary PWM/reset-synchronized PWM
•
Complementary PWM output mode
Outputs non-overlapping waveforms for controlling 3-phase inverters
Automatic specification of dead times
PWM duty cycle: Selectable as any value from 0% to 100%
Delay can be applied to requests for A/D conversion.
Non-generation of interrupt requests at peak or trough values of counters can be
selected.
Double buffer configuration
•
Reset synchronous PWM mode
Three phases of positive and negative PWM waveforms can be output with desired duty
cycles.
•
Phase-counting mode: 16-bit mode (channels 1 and 2); 32-bit mode (channels 1 and 2)
•
Counter functionality for dead-time compensation
•
Generation of triggers for A/D converter conversion
•
A/D converter start triggers can be skipped
•
Digital filter function for signals on the input capture and external counter clock pins
•
PPG output trigger can be generated
•
Event linking by the ELC
•
Control of the high-impedance state of the MTU3/GPT's waveform output pins
•
5 pins for input from signal sources: POE0, POE4, POE8, POE10, POE11
•
Initiation on detection of short-circuited outputs (detection of simultaneous PWM output
to the active level)
•
Initiation by oscillation-stoppage detection or software
•
Additional programming of output control target pins is enabled
Port output enable 3
(POE3a)
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