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S29GL256N80FAF001

Flash, 16MX16, 80ns, PBGA64, 13 X 11 MM, 1 MM PITCH, FBGA-64

器件类别:存储    存储   

厂商名称:SPANSION

厂商官网:http://www.spansion.com/

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
SPANSION
零件包装代码
BGA
包装说明
13 X 11 MM, 1 MM PITCH, FBGA-64
针数
64
Reach Compliance Code
compliant
ECCN代码
3A991.B.1.A
最长访问时间
80 ns
备用内存宽度
8
启动块
BOTTOM/TOP
JESD-30 代码
R-PBGA-B64
JESD-609代码
e0
长度
13 mm
内存密度
268435456 bit
内存集成电路类型
FLASH
内存宽度
16
湿度敏感等级
3
功能数量
1
端子数量
64
字数
16777216 words
字数代码
16000000
工作模式
ASYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-40 °C
组织
16MX16
封装主体材料
PLASTIC/EPOXY
封装代码
LBGA
封装形状
RECTANGULAR
封装形式
GRID ARRAY, LOW PROFILE
并行/串行
PARALLEL
峰值回流温度(摄氏度)
240
编程电压
3 V
认证状态
Not Qualified
座面最大高度
1.4 mm
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
2.7 V
标称供电电压 (Vsup)
3 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
TIN LEAD
端子形式
BALL
端子节距
1 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
30
类型
NOR TYPE
宽度
11 mm
文档预览
S29GLxxxN MirrorBit
TM
Flash Family
S29GL512N, S29GL256N, S29GL128N
512 Megabit, 256 Megabit, and 128 Megabit,
3.0 Volt-only Page Mode Flash Memory featuring
110 nm MirrorBit process technology
Datasheet
ADVANCE
INFORMATION
Distinctive Characteristics
Architectural Advantages
Single power supply operation
— 3 volt read, erase, and program operations
Enhanced VersatileI/O™ control
— All input levels (address, control, and DQ input levels)
and outputs are determined by voltage on V
IO
input.
V
IO
range is 1.65 to V
CC
Manufactured on 110 nm MirrorBit process
technology
SecSi™ (Secured Silicon) Sector region
— 128-word/256-byte sector for permanent, secure
identification through an 8-word/16-byte random
Electronic Serial Number, accessible through a
command sequence
— May be programmed and locked at the factory or by
the customer
Flexible sector architecture
— S29GL512N: Five hundred twelve 64 Kword (128
Kbyte) sectors
— S29GL256N: Two hundred fifty-six 64 Kword (128
Kbyte) sectors
— S29GL128N: One hundred twenty-eight 64 Kword
(128 Kbyte) sectors
Compatibility with JEDEC standards
— Provides pinout and software compatibility for single-
power supply flash, and superior inadvertent write
protection
100,000 erase cycles per sector
20-year data retention
— 56-pin TSOP/RTSOP
— 64-ball Fortified BGA
Software & Hardware Features
Software features
— Program Suspend & Resume: read other sectors
before programming operation is completed
— Erase Suspend & Resume: read/program other
sectors before an erase operation is completed
— Data# polling & toggle bits provide status
— Unlock Bypass Program command reduces overall
multiple-word or byte programming time
— CFI (Common Flash Interface) compliant: allows host
system to identify and accommodate multiple flash
devices
Hardware features
— Advanced Sector Protection
— WP#/ACC input accelerates programming time
(when high voltage is applied) for greater throughput
during system production. Protects first or last sector
regardless of sector protection settings
— Hardware reset input (RESET#) resets device
— Ready/Busy# output (RY/BY#) detects program or
erase cycle completion
Performance Characteristics
High performance
— 80 ns access time (S29GL128N, S29GL256N),
90 ns access time (S29GL512N)
— 8-word/16-byte page read buffer
— 16-word/32-byte write buffer
— 25 ns page read times
— 16-word/32-byte write buffer reduces overall
programming time for multiple-word updates
Low power consumption (typical values at 3.0 V, 5
MHz)
— 30 mA typical interpage active read current;
10 mA typical intrapage active read current
— 50 mA typical erase/program current
— 1 µA typical standby mode current
Package options
Publication Number
27631
Revision
A
Amendment
1
Issue Date
October 16, 2003
This document contains information on a product under development at FASL LLC. The information is intended to help you evaluate this product. FASL LLC reserves the
right to change or discontinue work on this proposed product without notice.
A d v a n c e
I n f o r m a t i o n
General Description
The S29GL512/256/128N family of devices are 3.0V single power flash memory
manufactured using 110 nm MirrorBit technology. The S29GL512N is a 512 Mbit,
organized as 33,554,432 words or 67,108,864 bytes. The S29GL256N is a 256
Mbit, organized as 16,777,216 words or 33,554,432 bytes. The S29GL128N is a
128 Mbit, organized as 8,388,608 words or 16,777,216 bytes. The devices have
a 16-bit wide data bus that can also function as an 8-bit wide data bus by using
the BYTE# input. The device can be programmed either in the host system or in
standard EPROM programmers.
Access times as fast as 80 ns (S29GL128N, S29GL256N) or 90 ns (S29GL512N)
are available. Note that each access time has a specific operating voltage range
(V
CC
) and an I/O voltage range (V
IO
), as specified in the
Product Selector Guide
and the
Ordering Information
sections. The devices are offered in a 56-pin TSOP
or 64-ball Fortified BGA package. Each device has separate chip enable (CE#),
write enable (WE#) and output enable (OE#) controls.
Each device requires only a
single 3.0 volt power supply
for both read and
write functions. In addition to a V
CC
input, a high-voltage
accelerated program
(WP#/ACC)
input provides shorter programming times through increased cur-
rent. This feature is intended to facilitate factory throughput during system
production, but may also be used in the field if desired.
The devices are entirely command set compatible with the
JEDEC single-
power-supply Flash standard.
Commands are written to the device using
standard microprocessor write timing. Write cycles also internally latch addresses
and data needed for the programming and erase operations.
The
sector erase architecture
allows memory sectors to be erased and repro-
grammed without affecting the data contents of other sectors. The device is fully
erased when shipped from the factory.
Device programming and erasure are initiated through command sequences.
Once a program or erase operation has begun, the host system need only poll the
DQ7 (Data# Polling) or DQ6 (toggle)
status bits
or monitor the
Ready/Busy#
(RY/BY#)
output to determine whether the operation is complete. To facilitate
programming, an
Unlock Bypass
mode reduces command sequence overhead
by requiring only two write cycles to program data instead of four.
The
Enhanced VersatileI/O™
(V
IO
) control allows the host system to set the
voltage levels that the device generates and tolerates on all input levels (address,
chip control, and DQ input levels) to the same voltage level that is asserted on
the V
IO
pin. This allows the device to operate in a 1.8 V or 3 V system environ-
ment as required.
Hardware data protection
measures include a low V
CC
detector that automat-
ically inhibits write operations during power transitions.
Persistent Sector
Protection
provides in-system, command-enabled protection of any combina-
tion of sectors using a single power supply at V
CC
.
Password Sector Protection
prevents unauthorized write and erase operations in any combination of sectors
through a user-defined 64-bit password.
The
Erase Suspend/Erase Resume
feature allows the host system to pause an
erase operation in a given sector to read or program any other sector and then
complete the erase operation. The
Program Suspend/Program Resume
fea-
ture enables the host system to pause a program operation in a given sector to
read any other sector and then complete the program operation.
2
S29GLxxxN MirrorBitTM Flash Family
27631A1 October 16, 2003
A d v a n c e
I n f o r m a t i o n
The
hardware RESET# pin
terminates any operation in progress and resets the
device, after which it is then ready for a new operation. The RESET# pin may be
tied to the system reset circuitry. A system reset would thus also reset the device,
enabling the host system to read boot-up firmware from the Flash memory
device.
The device reduces power consumption in the
standby mode
when it detects
specific voltage levels on CE# and RESET#, or when addresses have been stable
for a specified period of time.
The
SecSi™ (Secured Silicon) Sector
provides a 128-word/256-byte area for
code or data that can be permanently protected. Once this sector is protected,
no further changes within the sector can occur.
The
Write Protect (WP#/ACC)
feature protects the first or last sector by as-
serting a logic low on the WP# pin.
MirrorBit flash technology combines years of Flash memory manufacturing expe-
rience to produce the highest levels of quality, reliability and cost effectiveness.
The device electrically erases all bits within a sector simultaneously via hot-hole
assisted erase. The data is programmed using hot electron injection.
October 16, 2003 27631A1
S29GLxxxN MirrorBitTM Flash Family
3
A d v a n c e
I n f o r m a t i o n
Table of Contents
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . .6
S29GL512N ..............................................................................................................6
S29GL256N .............................................................................................................6
S29GL128N ..............................................................................................................6
Power-Up Write Inhibit ................................................................................53
Common Flash Memory Interface (CFI) . . . . . . . 53
Table 9. System Interface String.......................................... 54
Command Definitions . . . . . . . . . . . . . . . . . . . . . . 56
Reading Array Data ........................................................................................... 57
Reset Command ................................................................................................. 57
Autoselect Command Sequence ................................................................... 57
Enter SecSi Sector/Exit SecSi Sector Command Sequence ................... 58
Word/Byte Program Command Sequence ................................................ 58
Unlock Bypass Command Sequence ........................................................ 59
Write Buffer Programming ......................................................................... 59
Accelerated Program ....................................................................................60
Figure 1. Write Buffer Programming Operation....................... 61
Figure 2. Program Operation ............................................... 62
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . .8
Special Package Handling Instructions ............................................................9
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
S29GL512N ......................................................................................................... 11
S29GL256N ........................................................................................................ 11
S29GL128N ........................................................................................................ 11
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 12
S29GL512N Standard Products ....................................................................... 12
S29GL256N Standard Products .......................................................................13
S29GL128N Standard Products ....................................................................... 14
Program Suspend/Program Resume Command Sequence .................... 62
Figure 3. Program Suspend/Program Resume ........................ 63
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . 15
Table 1. Device Bus Operations ........................................... 15
Word/Byte Configuration .................................................................................15
VersatileIO
TM
(V
IO
) Control ..............................................................................15
Requirements for Reading Array Data ......................................................... 16
Page Mode Read .............................................................................................. 16
Writing Commands/Command Sequences ................................................. 16
Write Buffer ......................................................................................................17
Accelerated Program Operation ................................................................17
Autoselect Functions ......................................................................................17
Standby Mode ........................................................................................................17
Automatic Sleep Mode .......................................................................................17
RESET#: Hardware Reset Pin ......................................................................... 18
Output Disable Mode ........................................................................................ 18
Table 2. Sector Address Table–S29GL512N ........................... 18
Table 3. Sector Address Table–S29GL256N ........................... 33
Table 4. Sector Address Table–S29GL128N ........................... 40
Chip Erase Command Sequence ................................................................... 63
Sector Erase Command Sequence ................................................................ 64
Figure 4. Erase Operation ................................................... 65
Erase Suspend/Erase Resume Commands .................................................. 65
Lock Register Command Set Definitions .................................................... 66
Password Protection Command Set Definitions ...................................... 66
Non-Volatile Sector Protection Command Set Definitions .................68
Global Volatile Sector Protection Freeze Command Set ......................68
Volatile Sector Protection Command Set .................................................. 69
SecSi Sector Entry Command ......................................................................... 69
SecSi Sector Exit Command ........................................................................... 70
Command Definitions .........................................................................................71
Table 12. S29GL512N, S29GL256N, S29GL128N Command Defini-
tions, x16 .........................................................................71
Table 13. S29GL512N, S29GL256N, S29GL128N Command Defini-
tions, x8 ...........................................................................74
Autoselect Mode ................................................................................................ 44
Table 5. Autoselect Codes, (High Voltage Method) ................ 45
Write Operation Status ................................................................................... 76
DQ7: Data# Polling ........................................................................................... 77
Figure 5. Data# Polling Algorithm ........................................ 78
Sector Protection ................................................................................................45
Persistent Sector Protection .......................................................................45
Password Sector Protection .......................................................................45
WP# Hardware Protection .........................................................................45
Selecting a Sector Protection Mode .........................................................45
Advanced Sector Protection .......................................................................... 46
Lock Register ....................................................................................................... 46
Table 6. Lock Register ........................................................ 46
RY/BY#: Ready/Busy# ....................................................................................... 78
DQ6: Toggle Bit I ............................................................................................... 79
Figure 6. Toggle Bit Algorithm ............................................. 80
DQ2: Toggle Bit II ..............................................................................................80
Reading Toggle Bits DQ6/DQ2 ......................................................................81
DQ5: Exceeded Timing Limits .........................................................................81
DQ3: Sector Erase Timer ................................................................................82
DQ1: Write-to-Buffer Abort ...........................................................................82
Table 14. Write Operation Status .........................................83
Figure 7. Maximum Negative Overshoot Waveform................. 84
Figure 8. Maximum Positive
Overshoot Waveform.......................................................... 84
Persistent Sector Protection .......................................................................... 46
Dynamic Protection Bit (DYB) ...................................................................47
Persistent Protection Bit (PPB) ................................................................. 48
Persistent Protection Bit Lock (PPB Lock Bit) ..................................... 48
Table 7. Sector Protection Schemes ..................................... 48
Persistent Protection Mode Lock Bit .......................................................... 49
Password Sector Protection ........................................................................... 49
Password and Password Protection Mode Lock Bit ............................... 49
64-bit Password .................................................................................................. 50
Persistent Protection Bit Lock (PPB Lock Bit) .......................................... 50
SecSi (Secured Silicon) Sector Flash Memory Region ............................. 50
Write Protect (WP#) ........................................................................................52
Hardware Data Protection ..............................................................................52
Low VCC Write Inhibit ................................................................................52
Write Pulse “Glitch” Protection ................................................................52
Logical Inhibit ...................................................................................................53
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 84
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 85
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Figure 9. Test Setup........................................................... 86
Table 15. Test Specifications ...............................................86
Key to Switching Waveforms . . . . . . . . . . . . . . . 86
Figure 10. Input Waveforms and
Measurement Levels........................................................... 86
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 87
Read-Only Operations–S29GL512N Only .................................................. 87
Read-Only Operations–S29GL256N Only .................................................88
Read-Only Operations–S29GL128N Only ..................................................89
October 16, 2003 27631A1
S29GLxxxN MirrorBitTM Flash Family
4
A d v a n c e
I n f o r m a t i o n
Figure 11. Read Operation Timings ....................................... 90
Figure 12. Page Read Timings .............................................. 90
Hardware Reset (RESET#) ............................................................................... 91
Figure 13. Reset Timings..................................................... 91
S29GL256N Only .............................................................................................. 100
Alternate CE# Controlled Erase and Program Operations–
S29GL128N Only ................................................................................................101
Figure 20. Alternate CE# Controlled Write (Erase/Program)
Operation Timings............................................................ 102
Erase and Program Operations–S29GL512N Only .................................. 92
Erase and Program Operations–S29GL256N Only ..................................93
Erase and Program Operations–S29GL128N Only .................................. 94
Figure 14. Program Operation Timings .................................. 95
Figure 15. Accelerated Program Timing Diagram .................... 95
Figure 16. Chip/Sector Erase Operation Timings ..................... 96
Figure 17. Data# Polling Timings
(During Embedded Algorithms) ............................................ 97
Figure 18. Toggle Bit Timings (During Embedded Algorithms) .. 98
Figure 19. DQ2 vs. DQ6 ...................................................... 98
Latchup Characteristics . . . . . . . . . . . . . . . . . . .
Erase And Programming Performance . . . . . . .
TSOP Pin and BGA Package Capacitance . . . .
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . .
102
103
103
104
TS056/TSR056—56-Pin Standard/Reverse Thin Small Outline Package
(TSOP) ..................................................................................................................104
LAA064—64-Ball Fortified Ball Grid Array (FBGA) ..............................105
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 106
Alternate CE# Controlled Erase and Program Operations–
S29GL512N Only ................................................................................................ 99
Alternate CE# Controlled Erase and Program Operations–
October 16, 2003 27631A1
S29GLxxxN MirrorBitTM Flash Family
5
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