Bulletin I0502J rev. F 03/07
SC060.....5. Series
SCHOTTKY DIE 60 x 60 mils
40 (157)
Wafer flat alligned with
side b of the die
a
c
0.35 ± 0.01
(14 ± 0.4)
D
b
d
C
A
Ø
NOTES:
Ø 125 (492)
1. ALL DIMENSIONS ARE SHOWN IN
MILLIMETERS (MILS)
2. CONTROLLING DIMENSION: (MILS)
3. LETTER DESIGNATION:
A = Anode (Top Metal)
C = Cathode (Back Metal)
D = Reject Ink Dot (only on non-conforming dies)
4. SAWING:
Recommended Blade
SEMITEC S1025 QS00 Blade
Sawing Street
0.05 ± 0.005
(2 ± 0.2)
NOT TO SCALE
5. DIMENSIONS AND TOLERANCES
Device
#
SC060
R
015x5x
SC060
S
020x5x
SC060
S
030x5x
SC060
S
045x5x
SC060
S
060x5x
SC060
H
045x5x
SC060
H
100x5x
SC060
H
150x5x
T
J
Max.
(°C)
125
150
150
150
150
175
175
175
V
R
(V)
15
20
30
45
60
45
100
150
A
B
C
D
diameter
1.52 + 0,- 0.01 1.52 + 0,- 0.01 1.37 + 0,-0.01 1.37 + 0,-0.01
(60 + 0, -0.4) (60 + 0, -0.4) (54 + 0, - 0.4) (54 + 0, - 0.4)
n.a. contact factory
1.52 + 0,- 0.01 1.52 + 0,- 0.01 1.37 + 0,-0.01 1.37 + 0,-0.01
(60 + 0, -0.4) (60 + 0, -0.4) (54 + 0, - 0.4) (54 + 0, - 0.4)
1.52 + 0,- 0.01 1.52 + 0,- 0.01 1.37 + 0,-0.01 1.37 + 0,-0.01
(60 + 0, -0.4) (60 + 0, -0.4) (54 + 0, - 0.4) (54 + 0, - 0.4)
1.52 + 0,- 0.01 1.52 + 0,- 0.01 1.37 + 0,-0.01 1.37 + 0,-0.01
(60 + 0, -0.4) (60 + 0, -0.4) (54 + 0, - 0.4) (54 + 0, - 0.4)
n.a. contact factory
1.52 + 0,- 0.01 1.52 + 0,- 0.01 1.37 + 0,-0.01 1.37 + 0,-0.01
(60 + 0, -0.4) (60 + 0, -0.4) (54 + 0, - 0.4) (54 + 0, - 0.4)
n.a. contact factory
0.7 ± 0.1
30 ± 4
0.7 ± 0.1
30 ± 4
0.7 ± 0.1
30 ± 4
0.7 ± 0.1
30 ± 4
0.7 ± 0.1
30 ± 4
Document Number: 93862
www.vishay.com
1
SC060.....5.
Bulletin I0502J rev. F 03/07
Electrical Characteristics
Device
#
SC060
R
015x5x
SC060
S
020x5x
SC060
S
030x5x
SC060
S
045x5x
SC060
S
060x5x
SC060
H
045x5x
SC060
H
100x5x
SC060
H
150x5x
T
J
Max.
(°C)
125
150
150
150
150
175
175
175
V
R
(V)
15
20
30
45
60
45
100
150
2.5
1.5
40
35
25
20
15
12
Typ. I
R
@ 25°C
(μA)
500
Typ. I
R
@ 125°C Max. V
F
@ I
F
@ 25°C
(mA)
(V)
50 (100°C)
0.25 @ 3A
Package
Style
SMC
n.a. contact factory
0.45 @ 3A
0.53 @ 3A
0.61 @ 3A
n.a. contact factory
0.81 @ 3A
D-Pak (TO-252)
D-Pak (TO-252)
D-Pak (TO-252)
D-Pak (TO-252)
n.a. contact factory
Mechanical Data
Device
#
SC060xxxx
A
5x
SC060xxxx
S
5x
Bondable
Solderable
--
Ti 2 kÅ
Metal Thickness
Front Metal
Al (1% Si) 30 kÅ
Ni 1 kÅ
--
Ag 35 kÅ
Cr 1 kÅ
Cr 1 kÅ
Metal Thickness
Back Metal
Ni 2 kÅ
Ni 2 kÅ
Ag 3 kÅ
Ag 3 kÅ
Recommended Storage Environment: Store in original container, in dessicated nitrogen, with no contamination.
Shelf life for parts stored in above condition is 2 years.
If the storage is done in normal atmosphere shelf life is reduced to six months.
Packaging
Device
#
SC060xxxxx5
B
SC060xxxxx5
R
SC060xxxxx5
P
SC060xxxxx5
F
Description
Minimum Order Quantity
Die in Sale Package
4462
n. a.
n.a.
4462
Inked Probed Unsawn Wafer (Wafer in Box)
Probed Die in Tape & Reel
Probed Die in Waffle Pack
Inked Probed Sawn Wafer on Film
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Document Number: 93862
SC060.....5.
Bulletin I0502J rev. F 03/07
Ordering Information Table
Device Code
SC
1
1
2
3
4
5
6
7
060
2
S
3
060
4
A
5
5
6
B
7
-
-
-
-
-
-
-
Schottky Die
Die Size Code
H = 830 Process
Process (see Electrical Characteristics Table)
Voltage code: Code = V
RRM
Chip surface metallization (see Mechanical Data Table)
Wafer Diameter in inches
Packaging (see Packaging Table)
R = OR'ing Process
S = Standard Process
Wafer on Film
Document Number: 93862
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3
SC060.....5.
Bulletin I0502J rev. F 03/07
Wafer in Box
ROUND CONTAINER
TYVEK DISK
FOAM DISK
Die in Waffle Pack
CHIP TRAY POCKET
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Document Number: 93862
SC060.....5.
Bulletin I0502J rev. F 03/07
Data and specifications subject to change without notice.
This product has been designed for Industrial Level.
Qualification Standards can be found on IR's Web site.
IR WORLD HEADQUARTERS:
233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7309
Visit us at www.irf.com for sales contact information. 03/07
Document Number: 93862
www.vishay.com
5
