SDM20E40C
DUAL SURFACE MOUNT SCHOTTKY BARRIER DIODE
Features
•
•
•
•
Low Forward Voltage Drop
Common Cathode Configuration
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Notes 3 & 4)
Mechanical Data
•
•
•
•
•
•
Case: SC59
Case Material: Molded Plastic, "Green" Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish annealed over Copper leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Polarity: See Diagram
Weight: 0.008 grams (approximate)
SC59
Top View
Device Schematic
Ordering Information
(Note 5)
Part Number
SDM20E40C-7-F
Notes:
Case
SC59
Packaging
3000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to
Date Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb
2
O
3
Fire Retardants.
5. For Packaging Details, go to our website at http://www.diodes.com.
Marking Information
KSS
KSS = Product Type Marking Code
YM = Date Code Marking
Y =Year (ex: N = 2002)
M = Month (ex: 9 = September)
Date Code Key
Year
2002
Code
N
Month
Code
Jan
1
2003
P
Feb
2
2004
R
Mar
3
…
…
2008
V
Apr
4
YM
2009
W
May
5
2010
X
Jun
6
2011
Y
Jul
7
2012
Z
Aug
8
2013
A
Sep
9
2014
B
2015
C
Oct
O
2016
D
Nov
N
2017
E
Dec
D
SDM20E40C
Document number: DS30276 Rev. 9 - 2
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© Diodes Incorporated
SDM20E40C
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current (Note 6)
Non-Repetitive Peak Forward Surge Current
Repetitive peak Forward Current
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
FM
I
FSM
I
FRM
Value
40
28
0.4
2
500
Unit
V
V
A
A
mA
@ t = 8.3ms
Thermal Characteristics
Characteristic
Power Dissipation (Note 6)
Operating Temperature Range
Junction Temperature Range
Storage Temperature Range
Symbol
P
D
T
OP
T
J
T
STG
Value
400
-30 to +85
-30 to +125
-40 to +125
Unit
mW
°C
°C
°C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 7)
Forward Voltage
Leakage Current (Note 7)
Total Capacitance
Notes:
Symbol
V
(BR)R
V
F
I
R
C
T
Min
40
⎯
⎯
⎯
⎯
Typ
⎯
⎯
⎯
⎯
⎯
Max
⎯
300
500
70
100
Unit
V
mV
μA
pF
Test Condition
I
R
= 500μA
I
F
= 10mA
I
F
= 200mA
V
R
= 25V
V
R
= 0V, f = 1.0MHz
6. Mounted on FR4 PC Board with recommended pad layout which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
7. Short duration pulse test used to minimize self-heating effect.
I
F
, INSTANTANEOUS FORWARD CURRENT (mA)
I
R
, INSTANTANEOUS REVERSE CURRENT (uA)
1,000
10,000
1,000
T
A
= 125ºC
100
100
T
A
= 75ºC
10
10
T
A
= 25ºC
1.0
1
T
A
= 0ºC
0.1
0.1
0
10
20
30
40
V
R
, INSTANTANEOUS REVERSE VOLTAGE (V)
Fig. 2 Typical Reverse Characteristics
0
100
200
300
400
500
600
700
V
R
, INSTANTANEOUS FORWARD VOLTAGE (mV)
Fig. 1 Typical Forward Characteristics
SDM20E40C
Document number: DS30276 Rev. 9 - 2
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© Diodes Incorporated
SDM20E40C
100
500
P
D
, POWER DISSIPATION (mW)
C
T
, TOTAL CAPACITANCE (pF)
400
300
10
200
100
1
0
25
20
30
35
40
10
15
V
R
, DC REVERSE VOLTAGE (V)
Fig. 3 Total Capacitance vs. Reverse Voltage
5.0
0
0
75
25
50
100
125
T
A
, AMBIENT TEMPERATURE (
°
C)
Fig. 4 Power Derating Curve
150
Package Outline Dimensions
A
B C
G
H
K
M
N
J
D
L
SC59
Dim
Min
Max
Typ
A
0.35
0.50
0.38
B
1.50
1.70
1.60
C
2.70
3.00
2.80
D
-
-
0.95
G
-
-
1.90
H
2.90
3.10
3.00
J
0.013 0.10
0.05
K
1.00
1.30
1.10
L
0.35
0.55
0.40
M
0.10
0.20
0.15
N
0.70
0.80
0.75
0°
8°
-
α
All Dimensions in mm
Suggested Pad Layout
Y
Z
C
Dimensions Value (in mm)
Z
3.4
X
0.8
Y
1.0
C
2.4
E
1.35
X
E
SDM20E40C
Document number: DS30276 Rev. 9 - 2
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May 2012
© Diodes Incorporated
SDM20E40C
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2012, Diodes Incorporated
www.diodes.com
SDM20E40C
Document number: DS30276 Rev. 9 - 2
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May 2012
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