ATM/SONET/SDH SUPPORT CIRCUIT, PBGA63
ATM/SONET/SDH辅助电路, PBGA63
厂商名称:SILABS
厂商官网:http://www.silabs.com
下载文档型号 | SI5321-H-BL | SI5321 | SI5321-G-BC | SI5321-H-GL |
---|---|---|---|---|
描述 | ATM/SONET/SDH SUPPORT CIRCUIT, PBGA63 | ATM/SONET/SDH SUPPORT CIRCUIT, PBGA63 | ATM/SONET/SDH SUPPORT CIRCUIT, PBGA63 | ATM/SONET/SDH SUPPORT CIRCUIT, PBGA63 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 63 | 63 | 63 | 63 |
最大工作温度 | 85 Cel | 85 Cel | 85 Cel | 85 Cel |
最小工作温度 | -20 Cel | -20 Cel | -20 Cel | -20 Cel |
额定供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
加工封装描述 | 9 X 9 MM, PLASTIC, ROHS COMPLIANT, MO-192AAB-1, BGA-63 | 9 X 9 MM, PLASTIC, ROHS COMPLIANT, MO-192AAB-1, BGA-63 | 9 X 9 MM, PLASTIC, ROHS COMPLIANT, MO-192AAB-1, BGA-63 | 9 X 9 MM, PLASTIC, ROHS COMPLIANT, MO-192AAB-1, BGA-63 |
状态 | ACTIVE | ACTIVE | ACTIVE | Active |
包装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
包装尺寸 | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE |
表面贴装 | Yes | Yes | Yes | YES |
端子形式 | BALL | BALL | BALL | BALL |
端子间距 | 1 mm | 1 mm | 1 mm | 1 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
包装材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
温度等级 | OTHER | OTHER | OTHER | OTHER |
通信类型 | SUPPORT CIRCUIT | SUPPORT CIRCUIT | SUPPORT CIRCUIT | ATM/SONET/SDH SUPPORT CIRCUIT |
同步数字系列应用 | SDH Application | SDH Application | SDH Application | - |
sonnet应用 | SONET Application | SONET Application | SONET Application | - |