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SI7856DP-E3

Power Field-Effect Transistor, N-Channel, Metal-oxide Semiconductor FET

器件类别:分立半导体    晶体管   

厂商名称:Vishay(威世)

厂商官网:http://www.vishay.com

器件标准:

下载文档
器件参数
参数名称
属性值
是否Rohs认证
符合
Reach Compliance Code
compliant
配置
Single
最大漏极电流 (Abs) (ID)
14 A
FET 技术
METAL-OXIDE SEMICONDUCTOR
JESD-609代码
e3
湿度敏感等级
1
工作模式
ENHANCEMENT MODE
最高工作温度
150 °C
极性/信道类型
N-CHANNEL
最大功率耗散 (Abs)
5.4 W
表面贴装
YES
端子面层
Matte Tin (Sn)
Base Number Matches
1
文档预览
Si7856DP
New Product
Vishay Siliconix
N-Channel 30-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
V
DS
(V)
30
r
DS(on)
(W)
0.0045 @ V
GS
= 10 V
0.0055 @ V
GS
= 4.5 V
I
D
(A)
25
23
D
TrenchFETr Power MOSFET
D
Optimized for “Low Side” Synchronous
Rectifier Operation
D
New Low Thermal Resistance PowerPAKt
Package with Low 1.07-mm Profile
APPLICATIONS
D
DC/DC Converters
D
Synchronous Rectifiers
PowerPAKt SO-8
D
6.15 mm
S
1
2
3
4
D
8
7
6
5
D
D
D
S
S
G
5.15 mm
G
S
N-Channel MOSFET
Bottom View
ABSOLUTE MAXIMUM RATINGS (T
A
= 25_C UNLESS OTHERWISE NOTED)
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T
J
= 150_C)
a
_
Pulsed Drain Current (10
ms
Pulse Width)
Continuous Source Current (Diode Conduction)
a
Maximum Power Dissipation
a
Operating Junction and Storage Temperature Range
T
A
= 25_C
T
A
= 70_C
T
A
= 25_C
T
A
= 70_C
Symbol
V
DS
V
GS
10 secs
30
"20
25
Steady State
Unit
V
14
11
60
A
1.6
1.9
1.2
–55 to 150
W
_C
I
D
I
DM
I
S
P
D
T
J
, T
stg
19
4.5
5.4
3.4
THERMAL RESISTANCE RATINGS
Parameter
t
v
10 sec
Maximum Junction-to-Ambient
a
Maximum Junction-to-Case (Drain)
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
Document Number: 71850
S-20351—Rev. A, 18-Apr-02
www.vishay.com
Steady State
Steady State
R
thJA
R
thJC
Symbol
Typical
18
50
1.0
Maximum
23
65
1.5
Unit
_C/W
C/W
1
Si7856DP
Vishay Siliconix
New Product
SPECIFICATIONS (T
J
= 25_C UNLESS OTHERWISE NOTED)
Parameter
Static
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Drain-Source On-State Resistance
a
Forward Transconductance
a
Diode Forward Voltage
a
V
GS(th)
I
GSS
I
DSS
I
D(on)
r
DS(on)
g
fs
V
SD
V
DS
= V
GS
, I
D
= 250
mA
V
DS
= 0 V, V
GS
=
"20
V
V
DS
= 24 V, V
GS
= 0 V
V
DS
= 24 V, V
GS
= 0 V, T
J
= 55_C
V
DS
w
5 V, V
GS
= 10 V
V
GS
= 10 V, I
D
= 25 A
V
GS
= 4.5 V, I
D
= 19 A
V
DS
= 15 V, I
D
= 25 A
I
S
= 2.9 A, V
GS
= 0 V
30
0.0035
0.0043
95
0.72
1.1
0.0045
0.0055
S
V
1.0
1.95
3.0
"100
1
5
V
nA
mA
m
A
W
Symbol
Test Condition
Min
Typ
Max
Unit
Dynamic
b
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Source-Drain Reverse Recovery Time
Q
g
Q
gs
Q
gd
R
G
t
d(on)
t
r
t
d(off)
t
f
t
rr
I
F
= 2.9 A, di/dt = 100 A/ms
V
DD
= 15 V, R
L
= 15
W
I
D
^
1 A, V
GEN
= 10 V, R
G
= 6
W
V
DS
= 15 V, V
GS
= 4.5 V, I
D
= 25 A
34
15
10
1.3
21
15
100
30
50
35
25
150
45
80
ns
W
50
nC
Notes
a. Pulse test; pulse width
v
300
ms,
duty cycle
v
2%.
b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
60
V
GS
= 10 thru 4 V
50
50
60
Transfer Characteristics
I
D
– Drain Current (A)
40
I
D
– Drain Current (A)
40
30
30
20
3V
20
T
C
= 125_C
10
25_C
–55_C
10
0
0
1
2
3
4
5
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
V
DS
– Drain-to-Source Voltage (V)
V
GS
– Gate-to-Source Voltage (V)
www.vishay.com
2
Document Number: 71850
S-20351—Rev. A, 18-Apr-02
Si7856DP
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Drain Current
0.010
7000
C
iss
r
DS(on)
– On-Resistance (
W
)
0.008
C – Capacitance (pF)
5600
Vishay Siliconix
Capacitance
0.006
V
GS
= 4.5 V
0.004
V
GS
= 10 V
0.002
4200
2800
1400
C
rss
C
oss
0.000
0
10
20
30
40
50
0
0
6
12
18
24
30
I
D
– Drain Current (A)
V
DS
– Drain-to-Source Voltage (V)
Gate Charge
6
V
GS
– Gate-to-Source Voltage (V)
V
DS
= 15 V
I
D
= 20 A
1.8
On-Resistance vs. Junction Temperature
V
GS
= 10 V
I
D
= 20 A
4
r
DS(on)
– On-Resistance (
W)
(Normalized)
5
1.6
1.4
3
1.2
2
1.0
1
0.8
0
0
10
20
30
40
50
0.6
–50
–25
0
25
50
75
100
125
150
Q
g
– Total Gate Charge (nC)
T
J
– Junction Temperature (_C)
Source-Drain Diode Forward Voltage
50
0.020
On-Resistance vs. Gate-to-Source Voltage
T
J
= 150_C
10
r
DS(on)
– On-Resistance (
W
)
0.016
I
D
= 20 A
0.012
I
S
– Source Current (A)
0.008
T
J
= 25_C
0.004
1
0.00
0.2
0.4
0.6
0.8
1.0
1.2
0.000
0
2
4
6
8
10
V
SD
– Source-to-Drain Voltage (V)
V
GS
– Gate-to-Source Voltage (V)
Document Number: 71850
S-20351—Rev. A, 18-Apr-02
www.vishay.com
3
Si7856DP
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
0.6
0.4
0.2
–0.0
–0.2
–0.4
–0.6
–0.8
–50
40
Power (W)
120
I
D
= 250
mA
160
V
GS(th)
Variance (V)
200
Single Pulse Power
80
–25
0
25
50
75
100
125
150
0
0.001
0.01
0.1
Time (sec)
1
10
T
J
– Temperature (_C)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
Notes:
0.1
0.1
0.05
t
1
P
DM
0.02
t
2
1. Duty Cycle, D =
2. Per Unit Base = R
thJA
= 50_C/W
t
1
t
2
Single Pulse
0.01
10
–4
10
–3
10
–2
10
–1
1
Square Wave Pulse Duration (sec)
3. T
JM
– T
A
= P
DM
Z
thJA(t)
4. Surface Mounted
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Case
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.1
Single Pulse
0.05
0.02
0.01
10
–4
10
–3
10
–2
10
–1
Square Wave Pulse Duration (sec)
1
10
www.vishay.com
4
Document Number: 71850
S-20351—Rev. A, 18-Apr-02
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