型号
- 型号
- 关键词
| 型号 | SLE66R04PMCC2XHSA1 | SLE66R16PC | SLE66R16PMCC2 | SLE66R04PMCC2 | SLE66R32PC | SLE66R04PC | SLE66R04PMCC8 | SLE66R04PMCC8IXHSA1 |
|---|---|---|---|---|---|---|---|---|
| 描述 | Memory Circuit, | Memory Circuit, 2KX8, CMOS, DIE-2 | Memory Circuit, CARD | Memory Circuit, CARD | Memory Circuit, 4KX8, CMOS, DIE-2 | Memory Circuit, 616X8, CMOS, DIE-2 | Memory Circuit, CARD | Memory Circuit, |
| Reach Compliance Code | compliant | compliant | unknown | unknown | compliant | compliant | unknown | compliant |
| 内存集成电路类型 | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT |
| 厂商名称 | Infineon(英飞凌) | - | - | Infineon(英飞凌) | Infineon(英飞凌) | Infineon(英飞凌) | Infineon(英飞凌) | Infineon(英飞凌) |
| 零件包装代码 | - | DIE | MODULE | MODULE | DIE | DIE | MODULE | - |
| JESD-30 代码 | - | X-XUUC-N2 | R-XXMA-X | R-XXMA-X | X-XUUC-N2 | R-XUUC-N2 | R-XXMA-X | - |
| 封装主体材料 | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | - |
| 封装形状 | - | UNSPECIFIED | RECTANGULAR | RECTANGULAR | UNSPECIFIED | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | - | UNCASED CHIP | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | UNCASED CHIP | UNCASED CHIP | MICROELECTRONIC ASSEMBLY | - |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 表面贴装 | - | YES | NO | NO | YES | YES | NO | - |
| 端子形式 | - | NO LEAD | UNSPECIFIED | UNSPECIFIED | NO LEAD | NO LEAD | UNSPECIFIED | - |
| 端子位置 | - | UPPER | UNSPECIFIED | UNSPECIFIED | UPPER | UPPER | UNSPECIFIED | - |