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SMDA05LC

LOW CAPACITANCE TVS ARRAY

器件类别:分立半导体    二极管   

厂商名称:ProTek Devices

厂商官网:http://www.protekdevices.com/

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
ProTek Devices
零件包装代码
SOD
包装说明
R-PDSO-G8
针数
8
Reach Compliance Code
compli
ECCN代码
EAR99
其他特性
LOW CAPACITANCE
最小击穿电压
6 V
最大钳位电压
13.5 V
配置
SEPARATE, 4 ELEMENTS
二极管元件材料
SILICON
二极管类型
TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 代码
R-PDSO-G8
JESD-609代码
e0
湿度敏感等级
1
最大非重复峰值反向功率耗散
500 W
元件数量
4
端子数量
8
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
峰值回流温度(摄氏度)
245
极性
UNIDIRECTIONAL
认证状态
Not Qualified
最大重复峰值反向电压
5 V
表面贴装
YES
技术
AVALANCHE
端子面层
Tin/Lead (Sn/Pb)
端子形式
GULL WING
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
文档预览
05074
SMDA03LC
thru
Only One Name Means ProT
ek’Tion™
SMDA24LCC
LOW CAPACIT
ANCE TVS ARRA
Y
APPLICA
TIONS
SCSI & IDE Interfaces
Parallel & Serial Port Protection (RS-232)
Ethernet - 10/100 Base T
Test & Measurement Equipment
Industrial Control: Low Voltage Sensors
IEC COMPA
TIBILITY
(EN61000-4)
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
61000-4-4 (EFT): 40A - 5/50ns
61000-4-5 (Surge): 12A, 8/20µs - Level 1(Line-Gnd) & Level 2(Line-Line)
FEA
TURES
500 Watts Peak Pulse Power per Line (tp=8/20µs)
Unidirectional & Bidirectional Configurations
Available in Multiple Voltage Types Ranging From 3V to 24V
Protects Up to Four (4) Lines
ESD Protection > 40 kilovolts
LOW CAPACITANCE: 15pF
RoHS Compliant in Lead-Free Versions
MECHANICAL CHARACTERISTICS
Molded JEDEC SO-8 Package
Weight 70 milligrams (Approximate)
Available in Tin-Lead or Lead-Free Pure-Tin Plating(Annealed)
Solder Reflow Temperature:
Tin-Lead - Sn/Pb, 85/15: 240-245°C
Pure-Tin - Sn, 100: 260-270°C
Flammability rating UL 94V-0
12mm Tape and Reel Per EIA Standard 481
Marking: Logo, Marking Code, Date Code & Pin One Defined By Dot on Top of Package
SO-8
PIN CONFIGURA
TIONS
UNIDIRECTIONAL
BIDIRECTIONAL
8
7
6
5
8
7
6
5
1
2
3
4
1
2
3
4
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SMDA03LC
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SMDA24LCC
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
PARAMETER
Peak Pulse Power (t
p
= 8/20µs) - See Figure 1
Operating Temperature
Storage Temperature
Forward Voltage @ 50mA, 300µs - Square Wave (Note 1)
Note 1:
Only applies to unidirectional devices.
SYMBOL
P
PP
T
J
T
STG
V
F
VALUE
500
-55°C to 150°C
-55°C to 150°C
1.5
UNITS
Watts
°C
°C
Volts
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
(See Note 1)
DEVICE
MARKING
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ I
P
= 1A
V
C
VOLTS
7.0
7.0
9.8
9.8
13.4
13.4
19.0
19.0
24.0
24.0
43.0
43.0
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
MAXIMUM
LEAKAGE
CURRENT
MAXIMUM
CAPACITANCE
V
WM
VOLTS
SMDA03LC
SMDA03LCC
SMDA05LC
SMDA05LCC
SMDA08LC
SMDA08LCC
SMDA12LC
SMDA12LCC
SMDA15LC
SMDA15LCC
SMDA24LC
SMDA24LCC
SLA
SLB
SLC
SLD
SLE
SLF
SLG
SLH
SLJ
SLK
SLL
SLM
3.3
3.3
5.0
5.0
8.0
8.0
12.0
12.0
15.0
15.0
24.0
24.0
@ 1mA
V
(BR)
VOLTS
4.5
4.5
6.0
6.0
8.5
8.5
13.3
13.3
16.7
16.7
26.7
26.7
@8/20µs
V
C
@ I
PP
10.9V @ 43.0A
10.9V @ 43.0A
13.5V @ 42.0A
13.5V @42.0A
16.9V @ 34.0A
16.9V @ 34.0A
25.9V @ 27.0A
25.9V @ 27.0A
30.0V @ 17.0A
30.0V @ 17.0A
49.0V @ 12.0A
49.0V @ 12.0A
@V
WM
I
D
µA
125
125
20
20
10
10
1
1
1
1
1
1
0V @ 1 MHz
C
pF
15
15
15
15
15
15
15
15
15
15
15
15
Note 1:
Part numbers with a “C” suffix are bidirectional devices, i.e., SMDA03LCC.
05074.R6 4/05
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SMDA03LC
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SMDA24LCC
GRAPHS
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
10,000
P
PP
- Peak Pulse Power - Watts
1,000
500W 8/20µs Waveform
100
10
0.1
1
10
100
t
d
- Pulse Duration - µs
1,000
10,000
120
I
PP
- Peak Pulse Current - % of I
PP
FIGURE 2
PULSE WAVE FORM
100
t
f
Peak Value I
PP
TEST
WAVEFORM
PARAMETERS
t
f
= 8µs
t
d
= 20µs
80
% Of Rated Power
FIGURE 3
POWER DERATING CURVE
Peak Pulse Power
8/20µs
100
80
60
40
20
0
0
5
e
-t
60
40
20
Average Power
0
t
d
= t I /2
PP
10
15
t - Time - µs
20
25
30
0
25
50
75
100
125
T
L
- Lead Temperature - °C
150
FIGURE 4
OVERSHOOT & CLAMPING VOLTAGE FOR SMDA05LC
20
5 Volts per Division
10
0
-10
-20
ESD Test Pulse: 5 kilovolt, 1/30ns (waveform)
05074.R6 4/05
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SMDA03LC
thru
SMDA24LCC
APPLICA
TION NOTE
The SMDAxxLC & SMDAxxLCC Series are TVS arrays designed to protect I/O or data lines from the damaging effects of ESD, EFT and other types
of surges. This product series provides both unidirectional and bidirectional protection, with a surge capability of 500 Watts P
PP
per line for an 8/20µs
waveform and ESD protection > 40kV.
UNIDIRECTIONAL COMMON-MODE CONFIGURATION(Figure 1)
The SMDAxxLC Series provides up to four (4) lines of protection in a common-mode
configuration as depicted in Figure 1.
Circuit connectivity is as follows:
Line 1 is
Line 2 is
Line 3 is
Line 4 is
Pins 1-4
connected to Pin 5.
connected to Pin 6.
connected to Pin 7.
connected to Pin 8.
are connected to ground.
Figure 1. Unidirectional Common-Mode Protection
LINE 1
LINE 2
LINE 3
LINE 4
BIDIRECTIONAL COMMON-MODE CONFIGURATION (Figure 2)
Ideal for Ethernet applications, SMDAxxLCC Series provides up to four (4) lines of
protection in a common-mode configuration as depicted in Figure 2.
Circuit connectivity is as follows:
TPIN is connected to Pin 5.
TPIP is connected to Pin 6.
TPON is connected to Pin 1.
TPOP is connected to Pin 2.
Pins 3, 4, 7 & 8 are connected to ground.
1
2
3
GND PLANE
8
7
6
5
4
CIRCUIT BOARD LAYOUT RECOMMENDATIONS
Circuit board layout is critical for Electromagnetic
Compatibility (EMC) protection. The following
guidelines are recommended:
The protection device should be placed near the
input terminals or connectors, the device will
divert the transient current immediately before it
can be coupled into the nearby traces.
The path length between the TVS device and the
protected line should be minimized.
All conductive loops including power and ground
loops should be minimized.
The transient current return path to ground
should be kept as short as possible to reduce
parasitic inductance.
Ground planes should be used whenever
possible. For multilayer PCBs, use ground vias.
Figure 2. Bidirectional Common-Mode Protection
TPIN
TPIP
8
7
6
5
ETHERNET REPEATER
1
2
3
4
TPON
TPOP
05074.R6 4/05
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SMDA03LC
thru
SMDA24LCC
PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
-A-
SO-8
8
5
-B-
P
0.010” (0.25 MM)
M
B
M
4 PL
1
4
PACKAGE DIMENSIONS
DIM
MILLIMETERS
MIN
MAX
4.80
3.80
1.35
0.35
0.40
1.27 BSC
0.18
0.10
5.80
0.25
5.00
4.00
1.75
0.49
INCHES
MIN
MAX
0.189
0.150
0.054
0.014
0.196
0.157
0.068
0.019
D
G
C
R X 45º
A
B
C
D
0º - 10º
-T-
K
0.010” (0.25 MM)
M
T B
S
J
A
S
F
F
G
J
K
P
R
NOTES
1.250
0.016
0.049
1.27 BSC 0.05 BSC 0.05 BSC
0.25
0.007
0.009
0.25
6.20
0.50
0.004
0.229
0.010
0.008
0.244
0.019
8 PL
MOUNTING PAD
0.050”
±
0.005”
0.030”
±
0.005”
1. - T - = Seating Plane and Datum Surface.
2. Dimensions “A” and “B” are Datum.
3. Dimensions “A” and “B” do not include mold protrusion.
4. Maximum mold protrusion is 0.015” (0.380 mm) per side.
5. Dimensioning and tolerances per ANSI Y14.5M, 1982.
6. Dimensions are exclusive of mold flash and metal burrs.
TAPE & REEL/BULK ORDERING NOMENCLATURE
0.160”
±
0.005”
0.245” MIN
1. Surface mount product is taped and reeled in accordance
with EIA-481.
2. Suffix-T7 = 7 Inch Reel - 1,000 pieces per 12mm tape,
i.e.,
SMDA05LC-T7.
3. Suffix-T13 = 13 Inch Reel - 2,500 pieces per 12mm tape,
i.e.,
SMDA05LC-T13.
4. Suffix - LF = Lead-Free, Pure-Tin Plating,
i.e.,
SMDA05LC-LF-T7.
5. No Suffix = Product Shipped in Tubes of 98 pcs per Tube.
0.045”
±
0.005”
Outline & Dimensions: Rev 1 - 11/01, 06009
COPYRIGHT © ProTek Devices 2005
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical
characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that
the final judgement concerning selection and specifications is the buyer’s and that in furnishing
engineering and technical assistance, ProTek assumes no responsibility with respect to the
selection or specifications of such products.
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail:
sales@protekdevices.com
Web Site:
www.protekdevices.com
05074.R6 4/05
5
www.protekdevices.com
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