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SML80H12R1

Power Field-Effect Transistor, 11.5A I(D), 800V, 0.67ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-258AA, TO-258, 3 PIN

器件类别:分立半导体    晶体管   

厂商名称:TT Electronics plc

厂商官网:http://www.ttelectronics.com/

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
TT Electronics plc
包装说明
TO-258, 3 PIN
Reach Compliance Code
compliant
雪崩能效等级(Eas)
1210 mJ
配置
SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压
800 V
最大漏极电流 (ID)
11.5 A
最大漏源导通电阻
0.67 Ω
FET 技术
METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码
TO-258AA
JESD-30 代码
R-MSFM-P3
JESD-609代码
e1
元件数量
1
端子数量
3
工作模式
ENHANCEMENT MODE
最高工作温度
150 °C
封装主体材料
METAL
封装形状
RECTANGULAR
封装形式
FLANGE MOUNT
峰值回流温度(摄氏度)
NOT SPECIFIED
极性/信道类型
N-CHANNEL
最大脉冲漏极电流 (IDM)
46 A
认证状态
Not Qualified
表面贴装
NO
端子面层
TIN SILVER COPPER
端子形式
PIN/PEG
端子位置
SINGLE
处于峰值回流温度下的最长时间
NOT SPECIFIED
晶体管应用
SWITCHING
晶体管元件材料
SILICON
文档预览
SML80H12
TO–258 Package Outline.
Dimensions in mm (inches)
17.65 (0.695)
17.39 (0.685)
6.86 (0.270)
6.09 (0.240)
1.14 (0.707)
0.88 (0.035)
17.96 (0.707)
17.70 (0.697)
13.84 (0.545)
13.58 (0.535)
1 2 3
4.19 (0.165)
3.94 (0.155)
Dia.
21.21 (0.835)
20.70 (0.815)
N–CHANNEL
ENHANCEMENT MODE
HIGH VOLTAGE
POWER MOSFETS
V
DSS
800V
11.5A
I
D(cont)
R
DS(on)
0.670Ω
3.56 (0.140)
BSC
19.05 (0.750)
12.70 (0.500)
5.08 (0.200)
BSC
1.65 (0.065)
1.39 (0.055)
Typ.
Pin 1 – Drain
Pin 2 – Source
Pin 3 – Gate
• Faster Switching
• Lower Leakage
• TO–258 Hermetic Package
D
G
S
StarMOS is a new generation of high voltage
N–Channel enhancement mode power MOSFETs.
This new technology minimises the JFET effect,
increases packing density and reduces the
on-resistance. StarMOS also achieves faster
switching speeds through optimised gate layout.
ABSOLUTE MAXIMUM RATINGS
(T
case
= 25°C unless otherwise stated)
V
DSS
I
D
I
DM
V
GS
V
GSM
P
D
T
J
, T
STG
T
L
I
AR
E
AR
E
AS
Drain – Source Voltage
Continuous Drain Current
Pulsed Drain Current
1
Gate – Source Voltage
Gate – Source Voltage Transient
Total Power Dissipation @ T
case
= 25°C
Derate Linearly
Operating and Storage Junction Temperature Range
Lead Temperature : 0.063” from Case for 10 Sec.
Avalanche Current
1
(Repetitive and Non-Repetitive)
Repetitive Avalanche Energy
1
Single Pulse Avalanche Energy
2
800
11.5
46
±30
±40
200
1.6
–55 to 150
300
11.5
30
1210
V
A
A
V
W
W/°C
°C
A
mJ
1) Repetitive Rating: Pulse Width limited by maximum junction temperature.
2) Starting T
J
= 25°C, L = 18.3mH, R
G
= 25Ω, Peak I
L
= 11.5A
Semelab plc.
Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
Website:
http://www.semelab.co.uk
E-mail:
sales@semelab.co.uk
6/99
SML80H12
STATIC ELECTRICAL RATINGS
(T
case
= 25°C unless otherwise stated)
BV
DSS
I
DSS
I
GSS
V
GS(TH)
I
D(ON)
R
DS(ON)
Characteristic
Drain – Source Breakdown Voltage
Zero Gate Voltage Drain Current
(V
GS
= 0V)
Gate – Source Leakage Current
Gate Threshold Voltage
On State Drain Current
2
Drain – Source On State Resistance
2
Test Conditions
V
GS
= 0V , I
D
= 250µA
V
DS
= V
DSS
V
DS
= 0.8V
DSS
, T
C
= 125°C
V
GS
= ±30V , V
DS
= 0V
V
DS
= V
GS
, I
D
= 1.0mA
V
DS
> I
D(ON)
x R
DS(ON)
Max
V
GS
= 10V
V
GS
= 10V , I
D
= 0.5 I
D
[Cont.]
2
11.5
0.670
Min.
800
Typ.
Max. Unit
V
25
250
±100
4
µA
nA
V
A
DYNAMIC CHARACTERISTICS
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
Characteristic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
3
Gate – Source Charge
Gate – Drain (“Miller”) Charge
Turn–on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Test Conditions
V
GS
= 0V
V
DS
= 25V
f = 1MHz
V
GS
= 10V
V
DD
= 0.5 V
DSS
I
D
= I
D
[Cont.] @ 25°C
V
GS
= 15V
V
DD
= 0.5 V
DSS
I
D
= I
D
[Cont.] @ 25°C
R
G
= 1.6Ω
Min.
Typ.
3050
300
150
150
17
70
12
11
60
12
Max. Unit
3700
420
225
225
25
105
24
22
90
24
ns
nC
pF
SOURCE – DRAIN DIODE RATINGS AND CHARACTERISTICS
I
S
I
SM
V
SD
t
rr
Q
rr
Characteristic
Continuous Source Current
Pulsed Source Current
1
Diode Forward Voltage
2
Reverse Recovery Time
Reverse Recovery Charge
Test Conditions
(Body Diode)
(Body Diode)
V
GS
= 0V , I
S
= – I
D
[Cont.]
I
S
= – I
D
[Cont.] , dl
s
/ dt = 100A/µs
I
S
= – I
D
[Cont.] , dl
s
/ dt = 100A/µs
650
9
Min.
Typ.
Max. Unit
11.5
A
46
1.3
V
ns
µC
THERMAL CHARACTERISTICS
R
θJC
R
θJA
Characteristic
Junction to Case
Junction to Ambient
1) Repetitive Rating: Pulse Width limited by maximum junction temperature.
2) Pulse Test: Pulse Width < 380µS , Duty Cycle < 2%
3) See MIL–STD–750 Method 3471
CAUTION — Electrostatic Sensitive Devices. Anti-Static Procedures Must Be Followed.
Min.
Typ.
Max. Unit
0.62
°C/W
40
Semelab plc.
Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
Website:
http://www.semelab.co.uk
E-mail:
sales@semelab.co.uk
6/99
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参数对比
与SML80H12R1相近的元器件有:SML80H12。描述及对比如下:
型号 SML80H12R1 SML80H12
描述 Power Field-Effect Transistor, 11.5A I(D), 800V, 0.67ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-258AA, TO-258, 3 PIN Power Field-Effect Transistor, 11.5A I(D), 800V, 0.67ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-258AA, TO-258, 3 PIN
是否Rohs认证 符合 不符合
厂商名称 TT Electronics plc TT Electronics plc
包装说明 TO-258, 3 PIN FLANGE MOUNT, R-MSFM-P3
Reach Compliance Code compliant compliant
雪崩能效等级(Eas) 1210 mJ 1210 mJ
配置 SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压 800 V 800 V
最大漏极电流 (ID) 11.5 A 11.5 A
最大漏源导通电阻 0.67 Ω 0.67 Ω
FET 技术 METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码 TO-258AA TO-258AA
JESD-30 代码 R-MSFM-P3 R-MSFM-P3
元件数量 1 1
端子数量 3 3
工作模式 ENHANCEMENT MODE ENHANCEMENT MODE
最高工作温度 150 °C 150 °C
封装主体材料 METAL METAL
封装形状 RECTANGULAR RECTANGULAR
封装形式 FLANGE MOUNT FLANGE MOUNT
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED
极性/信道类型 N-CHANNEL N-CHANNEL
最大脉冲漏极电流 (IDM) 46 A 46 A
认证状态 Not Qualified Not Qualified
表面贴装 NO NO
端子形式 PIN/PEG PIN/PEG
端子位置 SINGLE SINGLE
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED
晶体管应用 SWITCHING SWITCHING
晶体管元件材料 SILICON SILICON
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