型号
- 型号
- 关键词
| 型号 | SN65LVP20DRFR | SN65LVDS20DRFR | SN65LVP20DRFT | SN65LVDS20DRFRG4 | SN65LVDS20DRFTG4 |
|---|---|---|---|---|---|
| 描述 | 4-Gbps PECL to LVPECL Repeater 8-WSON -40 to 85 | 4-Gbps PECL to LVDS Translator 8-WSON -40 to 85 | 4-Gbps PECL to LVPECL Repeater 8-WSON -40 to 85 | 4-Gbps PECL to LVDS Translator 8-WSON -40 to 85 | 4-Gbps PECL to LVDS Translator 8-WSON -40 to 85 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SON | SON | SON | SON | SON |
| 包装说明 | HVSSON, SOLCC8,.08,20 | HVSSON, SOLCC8,.08,20 | HVSSON, SOLCC8,.08,20 | HVSSON, SOLCC8,.08,20 | HVSSON, SOLCC8,.08,20 |
| 针数 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compli | compli | compli | compli | compli |
| ECCN代码 | 5A991.B.1 | EAR99 | 5A991.B.1 | EAR99 | EAR99 |
| Factory Lead Time | 1 week | 1 week | 1 week | 6 weeks | 6 weeks |
| 最大延迟 | 0.63 ns | 0.63 ns | 0.63 ns | 0.63 ns | 0.63 ns |
| 输入特性 | DIFFERENTIAL | DIFFERENTIAL | DIFFERENTIAL | DIFFERENTIAL | DIFFERENTIAL |
| 接口集成电路类型 | PECL TO LVDS TRANSLATOR | PECL TO LVDS TRANSLATOR | PECL TO LVDS TRANSLATOR | PECL TO LVDS TRANSLATOR | PECL TO LVDS TRANSLATOR |
| JESD-30 代码 | S-PDSO-N8 | S-PDSO-N8 | S-PDSO-N8 | S-PDSO-N8 | S-PDSO-N8 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 2 mm | 2 mm | 2 mm | 2 mm | 2 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出锁存器或寄存器 | NONE | NONE | NONE | NONE | NONE |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVSSON | HVSSON | HVSSON | HVSSON | HVSSON |
| 封装等效代码 | SOLCC8,.08,20 | SOLCC8,.08,20 | SOLCC8,.08,20 | SOLCC8,.08,20 | SOLCC8,.08,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 |
| 电源 | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 最大压摆率 | 45 mA | 45 mA | 45 mA | 45 mA | 45 mA |
| 最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 | 2.375 V | 2.375 V | 2.375 V | 2.375 V | 2.375 V |
| 标称供电电压 | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 2 mm | 2 mm | 2 mm | 2 mm | 2 mm |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
FPGA/CPLD
微控制器 MCU
Linux与安卓
嵌入式系统
电源技术
电源技术
