描述 |
FIFO 512 x 18 asynch FIFO Memory |
FIFO 512 x 18 asynch FIFO Memory |
FIFO 512 x 18 asynch FIFO Memory |
FIFO 512 x 18 asynch FIFO Memory |
Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
是否无铅 |
不含铅 |
含铅 |
不含铅 |
不含铅 |
是否Rohs认证 |
符合 |
符合 |
符合 |
符合 |
厂商名称 |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
零件包装代码 |
SSOP |
SSOP |
SSOP |
SSOP |
包装说明 |
SSOP, SSOP56,.4 |
SSOP, SSOP56,.4 |
0.300 INCH, PLASTIC, SSOP-56 |
0.300 INCH, PLASTIC, SSOP-56 |
针数 |
56 |
56 |
56 |
56 |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
ECCN代码 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Factory Lead Time |
1 week |
1 week |
1 week |
1 week |
最长访问时间 |
22 ns |
20 ns |
24 ns |
24 ns |
最大时钟频率 (fCLK) |
40 MHz |
50 MHz |
25 MHz |
25 MHz |
周期时间 |
25 ns |
20 ns |
40 ns |
40 ns |
JESD-30 代码 |
R-PDSO-G56 |
R-PDSO-G56 |
R-PDSO-G56 |
R-PDSO-G56 |
JESD-609代码 |
e4 |
e4 |
e4 |
e4 |
长度 |
18.415 mm |
18.415 mm |
18.415 mm |
18.415 mm |
内存密度 |
9216 bit |
9216 bit |
9216 bit |
9216 bit |
内存集成电路类型 |
OTHER FIFO |
OTHER FIFO |
OTHER FIFO |
OTHER FIFO |
内存宽度 |
18 |
18 |
18 |
18 |
湿度敏感等级 |
1 |
1 |
1 |
1 |
功能数量 |
1 |
1 |
1 |
1 |
端子数量 |
56 |
56 |
56 |
56 |
字数 |
512 words |
512 words |
512 words |
512 words |
字数代码 |
512 |
512 |
512 |
512 |
工作模式 |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
最高工作温度 |
70 °C |
70 °C |
70 °C |
70 °C |
组织 |
512X18 |
512X18 |
512X18 |
512X18 |
输出特性 |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
可输出 |
YES |
YES |
YES |
YES |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
SSOP |
SSOP |
SSOP |
SSOP |
封装等效代码 |
SSOP56,.4 |
SSOP56,.4 |
SSOP56,.4 |
SSOP56,.4 |
封装形状 |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
封装形式 |
SMALL OUTLINE, SHRINK PITCH |
SMALL OUTLINE, SHRINK PITCH |
SMALL OUTLINE, SHRINK PITCH |
SMALL OUTLINE, SHRINK PITCH |
并行/串行 |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
峰值回流温度(摄氏度) |
260 |
260 |
260 |
260 |
电源 |
5 V |
5 V |
5 V |
5 V |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
座面最大高度 |
2.79 mm |
2.79 mm |
2.79 mm |
2.79 mm |
最大供电电压 (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
最小供电电压 (Vsup) |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
标称供电电压 (Vsup) |
5 V |
5 V |
5 V |
5 V |
表面贴装 |
YES |
YES |
YES |
YES |
技术 |
CMOS |
CMOS |
CMOS |
CMOS |
温度等级 |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
端子面层 |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
端子节距 |
0.635 mm |
0.635 mm |
0.635 mm |
0.635 mm |
端子位置 |
DUAL |
DUAL |
DUAL |
DUAL |
处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
宽度 |
7.5 mm |
7.5 mm |
7.5 mm |
7.5 mm |
Base Number Matches |
1 |
1 |
1 |
1 |