型号
- 型号
- 关键词
| 型号 | SN74AS870DW | SN74AS870FN | SN74AS870NT | SN54AS870FK | SN74AS871N | SN54AS870JT |
|---|---|---|---|---|---|---|
| 描述 | 16X4 DUAL-PORT SRAM, 15ns, PDSO24 | 16X4 DUAL-PORT SRAM, 15ns, PQCC28 | 16X4 DUAL-PORT SRAM, 15ns, PDIP24 | 16X4 DUAL-PORT SRAM, 20ns, CQCC28 | 16X4 DUAL-PORT SRAM, 16ns, PDIP28 | 16X4 DUAL-PORT SRAM, 20ns, CDIP24 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | _compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | 3A001.A.2.C | EAR99 | 3A001.A.2.C |
| 最长访问时间 | 15 ns | 15 ns | 15 ns | 20 ns | 16 ns | 20 ns |
| 其他特性 | DUAL MEMORY FOR MULTIBUS ARCHITECTURE | DUAL MEMORY FOR MULTIBUS ARCHITECTURE | DUAL MEMORY FOR MULTIBUS ARCHITECTURE | DUAL MEMORY FOR MULTIBUS ARCHITECTURE | DUAL MEMORY FOR MULTIBUS ARCHITECTURE; SEPARATE I/O FOR PORT A | DUAL MEMORY FOR MULTIBUS ARCHITECTURE |
| JESD-30 代码 | R-PDSO-G24 | S-PQCC-J28 | R-PDIP-T24 | S-CQCC-N28 | R-PDIP-T28 | R-CDIP-T24 |
| 内存密度 | 64 bit | 64 bit | 64 bit | 64 bit | 64 bit | 64 bi |
| 内存集成电路类型 | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | MULTI-PORT SRAM | MULTI-PORT SRAM | MULTI-PORT SRAM |
| 内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 24 | 28 | 24 | 28 | 28 | 24 |
| 字数 | 16 words | 16 words | 16 words | 16 words | 16 words | 16 words |
| 字数代码 | 16 | 16 | 16 | 16 | 16 | 16 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 125 °C | 70 °C | 125 °C |
| 组织 | 16X4 | 16X4 | 16X4 | 16X4 | 16X4 | 16X4 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 可输出 | NO | NO | NO | NO | NO | NO |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | SOP | QCCJ | DIP | QCCN | DIP | DIP |
| 封装等效代码 | SOP24,.4 | LDCC28,.5SQ | DIP24,.3 | LCC28,.45SQ | DIP28,.6 | DIP24,.3 |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | YES | NO | NO |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY |
| 端子形式 | GULL WING | J BEND | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | QUAD | DUAL | QUAD | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 长度 | 15.4 mm | 11.5062 mm | 31.64 mm | 11.43 mm | 36.32 mm | - |
| 座面最大高度 | 2.65 mm | 4.57 mm | 5.08 mm | 2.03 mm | 5.08 mm | - |
| 宽度 | 7.5 mm | 11.5062 mm | 7.62 mm | 11.43 mm | 15.24 mm | - |