型号
- 型号
- 关键词
SN74CB3Q3251 1-of-8 FET Multiplexer/Demultiplexer 2.5-V/3.3-V Low-Voltage High-Bandwidth Bus Switch
器件标准：
| 型号 | SN74CB3Q3251 | SN74CB3Q3251DBQRG4 | SN74CB3Q3251PWRE4 | SN74CB3Q3251PWRG4 | SN74CB3Q3251PWE4 |
|---|---|---|---|---|---|
| 描述 | SN74CB3Q3251 1-of-8 FET Multiplexer/Demultiplexer 2.5-V/3.3-V Low-Voltage High-Bandwidth Bus Switch | Multiplexer Switch ICs 2.5V 3.3V LO VLTG HI BandwidthBus Switch | Multiplexer Switch ICs Low-Power RS-485 Transceiver | Multiplexer Switch ICs 2.5V 3.3V LO VLTG HI BandwidthBus Switch | Multiplexer Switch ICs 1-of-8 FET Mltplxr/Demltplxr |
| 是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | - | SOIC | TSSOP | TSSOP | TSSOP |
| 包装说明 | - | SSOP, SSOP16,.25 | TSSOP, TSSOP16,.25 | TSSOP, TSSOP16,.25 | TSSOP, TSSOP16,.25 |
| 针数 | - | 16 | 16 | 16 | 16 |
| Reach Compliance Code | - | unknown | unknown | unknown | unknown |
| 系列 | - | CB3Q/3VH/3C/2B | CB3Q/3VH/3C/2B | CB3Q/3VH/3C/2B | CB3Q/3VH/3C/2B |
| JESD-30 代码 | - | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | - | e4 | e4 | e4 | e4 |
| 长度 | - | 4.9 mm | 5 mm | 5 mm | 5 mm |
| 逻辑集成电路类型 | - | MULTIPLEXER AND DEMUX/DECODER | MULTIPLEXER AND DEMUX/DECODER | MULTIPLEXER AND DEMUX/DECODER | MULTIPLEXER AND DEMUX/DECODER |
| 湿度敏感等级 | - | 2 | 1 | 1 | 1 |
| 功能数量 | - | 1 | 1 | 1 | 1 |
| 输入次数 | - | 1 | 1 | 1 | 1 |
| 输出次数 | - | 8 | 8 | 8 | 8 |
| 端子数量 | - | 16 | 16 | 16 | 16 |
| 最高工作温度 | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | - | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | SSOP | TSSOP | TSSOP | TSSOP |
| 封装等效代码 | - | SSOP16,.25 | TSSOP16,.25 | TSSOP16,.25 | TSSOP16,.25 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 | 260 |
| 电源 | - | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V |
| 传播延迟（tpd） | - | 0.18 ns | 0.18 ns | 0.18 ns | 0.18 ns |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | 1.75 mm | 1.2 mm | 1.2 mm | 1.2 mm |
| 最大供电电压 (Vsup) | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | - | 2.3 V | 2.3 V | 2.3 V | 2.3 V |
| 标称供电电压 (Vsup) | - | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | - | YES | YES | YES | YES |
| 技术 | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | - | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | - | 0.635 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | - | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | 3.9 mm | 4.4 mm | 4.4 mm | 4.4 mm |
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