描述 |
SN74CBTS3384 10-Bit FET Bus Switch With Schottky Diode Clamping |
Digital Bus Switch ICs 10-Bit FET Bus Switch |
Digital Bus Switch ICs 10B FETBus Switch |
Digital Bus Switch ICs 10-Bit FET Bus Switch |
Digital Bus Switch ICs 10B FETBus Switch |
Digital Bus Switch ICs 10B FETBus Switch |
Digital Bus Switch ICs Quad 2-1-Line Data Selector/Mltplxr |
是否无铅 |
- |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
是否Rohs认证 |
- |
符合 |
符合 |
符合 |
符合 |
符合 |
符合 |
厂商名称 |
- |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
零件包装代码 |
- |
TSSOP |
TSSOP |
SOIC |
TSSOP |
SOIC |
TSSOP |
包装说明 |
- |
PLASTIC, TSSOP-24 |
GREEN, PLASTIC, TSSOP-24 |
SOP, SOP24,.4 |
GREEN, PLASTIC, TSSOP-24 |
SOP, SOP24,.4 |
PLASTIC, TSSOP-24 |
针数 |
- |
24 |
24 |
24 |
24 |
24 |
24 |
Reach Compliance Code |
- |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
系列 |
- |
CBT/FST/QS/5C/B |
CBT/FST/QS/5C/B |
CBT/FST/QS/5C/B |
CBT/FST/QS/5C/B |
CBT/FST/QS/5C/B |
CBT/FST/QS/5C/B |
JESD-30 代码 |
- |
R-PDSO-G24 |
R-PDSO-G24 |
R-PDSO-G24 |
R-PDSO-G24 |
R-PDSO-G24 |
R-PDSO-G24 |
JESD-609代码 |
- |
e4 |
e4 |
e4 |
e4 |
e4 |
e4 |
长度 |
- |
7.8 mm |
7.8 mm |
15.365 mm |
7.8 mm |
15.365 mm |
7.8 mm |
逻辑集成电路类型 |
- |
BUS DRIVER |
BUS DRIVER |
BUS DRIVER |
BUS DRIVER |
BUS DRIVER |
BUS DRIVER |
湿度敏感等级 |
- |
1 |
1 |
1 |
1 |
1 |
1 |
位数 |
- |
10 |
10 |
10 |
10 |
10 |
10 |
功能数量 |
- |
1 |
1 |
1 |
1 |
1 |
1 |
端口数量 |
- |
2 |
2 |
2 |
2 |
2 |
2 |
端子数量 |
- |
24 |
24 |
24 |
24 |
24 |
24 |
最高工作温度 |
- |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
最低工作温度 |
- |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
输出特性 |
- |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
输出极性 |
- |
TRUE |
TRUE |
TRUE |
TRUE |
TRUE |
TRUE |
封装主体材料 |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
- |
TSSOP |
TSSOP |
SOP |
TSSOP |
SOP |
TSSOP |
封装等效代码 |
- |
TSSOP24,.25 |
TSSOP24,.25 |
SOP24,.4 |
TSSOP24,.25 |
SOP24,.4 |
TSSOP24,.25 |
封装形状 |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
封装形式 |
- |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) |
- |
260 |
260 |
260 |
260 |
260 |
260 |
电源 |
- |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
传播延迟(tpd) |
- |
0.35 ns |
0.35 ns |
0.35 ns |
0.35 ns |
0.35 ns |
0.35 ns |
认证状态 |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
座面最大高度 |
- |
1.2 mm |
1.2 mm |
2.65 mm |
1.2 mm |
2.65 mm |
1.2 mm |
最大供电电压 (Vsup) |
- |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
最小供电电压 (Vsup) |
- |
4 V |
4 V |
4 V |
4 V |
4 V |
4 V |
标称供电电压 (Vsup) |
- |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
表面贴装 |
- |
YES |
YES |
YES |
YES |
YES |
YES |
技术 |
- |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
温度等级 |
- |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
端子面层 |
- |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 |
- |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
端子节距 |
- |
0.65 mm |
0.65 mm |
1.27 mm |
0.65 mm |
1.27 mm |
0.65 mm |
端子位置 |
- |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
处于峰值回流温度下的最长时间 |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
宽度 |
- |
4.4 mm |
4.4 mm |
7.5 mm |
4.4 mm |
7.5 mm |
4.4 mm |